公开(公告)号：US20150364816A1

公开(公告)日：2015-12-17

申请号：US14740190

申请日：2015-06-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rajen Manicon MURUGAN ,  Minhong MI ,  Gary Paul MORRISON ,  Jie CHEN ,  Kenneth Robert RHYNER ,  Stanley Craig BEDDINGFIELD ,  Chittranjan Mohan GUPTA ,  Django Earl TROMBLEY

IPC: H01Q1/50 ,  H01L23/64 ,  H01P3/08 ,  H01L23/50 ,  H01L23/498 ,  H01L23/00 ,  H01L23/66 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01Q1/3233 ,  H01Q23/00 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Abstract translation: 一种毫米波集成电路（IC）芯片。 IC芯片包括IC芯片和封装IC芯片的引线键合球栅阵列封装。 引线键合球栅阵列封装包括焊球阵列，毫米波发射通道和毫米波接收通道，其中每个毫米波发射和接收通道将IC管芯电耦合到焊球阵列的信号球，并且是 配置为在毫米波IC芯片的工作频带处谐振。

公开(公告)号：US20170229408A1

公开(公告)日：2017-08-10

申请号：US15497024

申请日：2017-04-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rajen Manicon MURUGAN ,  Minhong MI ,  Gary Paul MORRISON ,  Jie CHEN ,  Kenneth Robert RHYNER ,  Stanley Craig BEDDINGFIELD ,  Chittranjan Mohan GUPTA ,  Django Earl TROMBLEY

IPC: H01L23/66 ,  H01L23/00 ,  H01Q1/32 ,  H05K1/02 ,  H01Q1/22 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01Q1/3233 ,  H01Q23/00 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.