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公开(公告)号：US10480056B2
公开(公告)日：2019-11-19
申请号：US15719972
申请日：2017-09-29
Applicant: The Regents of the University of Michigan
Inventor： Stephen R. Forrest , Gregory McGraw
Abstract: A first device is provided. The device includes a print head. The print head further includes a first nozzle hermetically sealed to a first source of gas. The first nozzle has an aperture having a smallest dimension of 0.5 to 500 microns in a direction perpendicular to a flow direction of the first nozzle. At a distance from the aperture into the first nozzle that is 5 times the smallest dimension of the aperture of the first nozzle, the smallest dimension perpendicular to the flow direction is at least twice the smallest dimension of the aperture of the first nozzle.
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公开(公告)号：US09700901B2
公开(公告)日：2017-07-11
申请号：US14563803
申请日：2014-12-08
Applicant: The Regents of the University of Michigan
Inventor： Stephen R. Forrest , Gregory McGraw
IPC: B23K1/19 , B05B1/00 , C23C14/12 , C23C14/04 , C23C14/22 , B05C11/00 , B23K1/00 , B32B37/12 , B32B37/18 , H01L51/00 , B23K101/00
CPC classification number: B05B1/00 , B05C11/00 , B23K1/0008 , B23K2101/00 , B32B37/1284 , B32B37/18 , C23C14/04 , C23C14/12 , C23C14/228 , H01L51/0005
Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
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公开(公告)号：US09653709B2
公开(公告)日：2017-05-16
申请号：US13774225
申请日：2013-02-22
Applicant: The Regents of the University of Michigan
Inventor： Stephen R. Forrest , Gregory McGraw
CPC classification number: H01L51/56 , C23C14/04 , C23C14/12 , C23C14/24 , H01L27/3211 , H01L51/0005 , H01L51/0011
Abstract: An organic optoelectronic device (OED) includes a plurality of OED cells separated by a vapor flow barrier that extends away from a substrate surface. The vapor flow barrier partially defines an OED cell area and helps prevent stray organic material deflected away from the substrate surface during deposition from being deposited outside the cell area. An organic vapor jet (OVJ) print head can be used to deposit organic material along the vapor flow barrier and may include one or more features configured to capture some of the stray organic material. A method that includes use of vapor flow barriers and/or capturing stray organic material can facilitate high-density printing of OED cells such as OLEDs with sharply defined edges and without cross-contamination among adjacent cells.
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公开(公告)号：US10941481B2
公开(公告)日：2021-03-09
申请号：US16683389
申请日：2019-11-14
Applicant: The Regents of the University of Michigan
Inventor： Stephen R. Forrest , Gregory McGraw
Abstract: A first device is provided. The device includes a print head. The print head further includes a first nozzle hermetically sealed to a first source of gas. The first nozzle has an aperture having a smallest dimension of 0.5 to 500 microns in a direction perpendicular to a flow direction of the first nozzle. At a distance from the aperture into the first nozzle that is 5 times the smallest dimension of the aperture of the first nozzle, the smallest dimension perpendicular to the flow direction is at least twice the smallest dimension of the aperture of the first nozzle.
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公开(公告)号：US20180105923A1
公开(公告)日：2018-04-19
申请号：US15841171
申请日：2017-12-13
Inventor： Stephen Forrest , Gregory McGraw , Siddharth Harikrishna Mohan , Diane L. Peters
CPC classification number: C23C14/12 , C23C14/228 , C23C14/243 , Y10T137/85938
Abstract: A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.
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Patent Agency Ranking
公开(公告)号：US20150090775A1
公开(公告)日：2015-04-02
申请号：US14563803
申请日：2014-12-08
Applicant: The Regents of the University of Michigan
Inventor： Stephen R. Forrest , Gregory McGraw
CPC classification number: B05B1/00 , B05C11/00 , B23K1/0008 , B23K2101/00 , B32B37/1284 , B32B37/18 , C23C14/04 , C23C14/12 , C23C14/228 , H01L51/0005
Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
Abstract translation: 可以使用焊接接头连接有机蒸气喷射印刷装置的部件以及能够在高温下表现的流体密封。 焊点包括沉积在相对的部件表面上的一种或多种金属，例如喷嘴板的入口侧和/或安装板的出口侧。 将这些部件压在一起形成焊点。 两种或更多种沉积的金属可以一起形成共晶合金，并且可以通过将沉积的金属加热到高于共晶合金的熔点的温度来形成焊接接头。 焊料接头和各部件之间可以包括扩散阻挡层和粘附层。
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公开(公告)号：US20140138629A1
公开(公告)日：2014-05-22
申请号：US13774225
申请日：2013-02-22
Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
Inventor： Stephen R. Forrest , Gregory McGraw
CPC classification number: H01L51/56 , C23C14/04 , C23C14/12 , C23C14/24 , H01L27/3211 , H01L51/0005 , H01L51/0011
Abstract: An organic optoelectronic device (OED) includes a plurality of OED cells separated by a vapor flow barrier that extends away from a substrate surface. The vapor flow barrier partially defines an OED cell area and helps prevent stray organic material deflected away from the substrate surface during deposition from being deposited outside the cell area. An organic vapor jet (OVJ) print head can be used to deposit organic material along the vapor flow barrier and may include one or more features configured to capture some of the stray organic material. A method that includes use of vapor flow barriers and/or capturing stray organic material can facilitate high-density printing of OED cells such as OLEDs with sharply defined edges and without cross-contamination among adjacent cells.
Abstract translation: 有机光电子器件（OED）包括由蒸发流动隔离物隔开的多个OED电池，其从衬底表面延伸出来。 气流阻挡部分地限定了OED电池区域，并且有助于防止在沉积期间偏离衬底表面的杂散有机材料沉积在电池区域外部。 有机蒸气喷射（OVJ）打印头可以用于沿着蒸汽流动屏障沉积有机材料，并且可以包括被配置为捕获一些杂散有机材料的一个或多个特征。 包括使用蒸气阻挡层和/或捕获杂散有机材料的方法可以促进OED电池的高密度印刷，例如具有尖锐边界边缘且在相邻电池之间没有交叉污染的OLED。
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公开(公告)号：US20140116331A1
公开(公告)日：2014-05-01
申请号：US13774117
申请日：2013-02-22
Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
Inventor： Stephen R. Forrest , Gregory McGraw
IPC: B05C11/00
CPC classification number: B05B1/00 , B05C11/00 , B23K1/0008 , B23K2101/00 , B32B37/1284 , B32B37/18 , C23C14/04 , C23C14/12 , C23C14/228 , H01L51/0005
Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
Abstract translation: 可以使用焊接接头连接有机蒸气喷射印刷装置的部件以及能够在高温下表现的流体密封。 焊点包括沉积在相对的部件表面上的一种或多种金属，例如喷嘴板的入口侧和/或安装板的出口侧。 将这些部件压在一起形成焊点。 两种或更多种沉积的金属可以一起形成共晶合金，并且可以通过将沉积的金属加热到高于共晶合金的熔点的温度来形成焊接接头。 焊料接头和各部件之间可以包括扩散阻挡层和粘附层。
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公开(公告)号：US09797039B2
公开(公告)日：2017-10-24
申请号：US14569129
申请日：2014-12-12
Applicant: The Regents of the University of Michigan
Inventor： Stephen R. Forrest , Gregory McGraw
CPC classification number: C23C14/12 , B41J2/005 , C23C14/04 , C23C14/228
Abstract: A first device is provided. The device includes a print head. The print head further includes a first nozzle hermetically sealed to a first source of gas. The first nozzle has an aperture having a smallest dimension of 0.5 to 500 microns in a direction perpendicular to a flow direction of the first nozzle. At a distance from the aperture into the first nozzle that is 5 times the smallest dimension of the aperture of the first nozzle, the smallest dimension perpendicular to the flow direction is at least twice the smallest dimension of the aperture of the first nozzle.
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公开(公告)号：US08944309B2
公开(公告)日：2015-02-03
申请号：US13774117
申请日：2013-02-22
Applicant: The Regents of the University of Michigan
Inventor： Stephen R. Forrest , Gregory McGraw
CPC classification number: B05B1/00 , B05C11/00 , B23K1/0008 , B23K2101/00 , B32B37/1284 , B32B37/18 , C23C14/04 , C23C14/12 , C23C14/228 , H01L51/0005
Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
Abstract translation: 可以使用焊接接头连接有机蒸气喷射印刷装置的部件以及能够在高温下表现的流体密封。 焊点包括沉积在相对的部件表面上的一种或多种金属，例如喷嘴板的入口侧和/或安装板的出口侧。 将这些部件压在一起形成焊点。 两种或更多种沉积的金属可以一起形成共晶合金，并且可以通过将沉积的金属加热到高于共晶合金的熔点的温度来形成焊接接头。 焊料接头和各部件之间可以包括扩散阻挡层和粘附层。
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