公开(公告)号：US20230395395A1

公开(公告)日：2023-12-07

申请号：US18207555

申请日：2023-06-08

Applicant: TOPPAN INC.

Inventor： Takashi KIZU ,  Akane KOBAYASHI ,  Yuki NITTA

IPC: H01L21/48 ,  H05K3/42 ,  H05K1/14 ,  H01L23/00 ,  H05K3/36 ,  H05K3/46 ,  H01L23/498

CPC classification number: H01L21/4857 ,  H05K3/424 ,  H05K1/144 ,  H01L24/83 ,  H01L24/32 ,  H05K3/368 ,  H05K3/429 ,  H05K3/4682 ,  H01L24/16 ,  H01L24/73 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L21/4853 ,  H01L21/486 ,  H01L2224/32225 ,  H05K2203/0165 ,  H05K2203/107 ,  H01L2224/73204 ,  H01L2224/16227 ,  H01L2224/83203 ,  H01L2924/3511

Abstract: A board unit with support which does not require a high-energy UV laser and which is less likely to form residues of the release layer after separation of the support, a board unit, and a semiconductor device, and a method of producing them. The board unit with support includes a support, a release layer, a laser absorption layer that absorbs laser light, and at least one first wiring board in this order, wherein the at least one first wiring board has a first surface provided with first electrodes that can be bonded to at least one semiconductor element, the at least one first wiring board has a second surface provided with second electrodes that can be bonded to a second wiring board.