公开(公告)号：US20190245165A1

公开(公告)日：2019-08-08

申请号：US16385951

申请日：2019-04-16

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Wataru IJUIN ,  Satoshi SASAKI ,  Masayoshi SUZUTA

IPC: H01M2/02 ,  H01M2/08 ,  H01G11/80 ,  H01G11/84

CPC classification number: H01M2/0287 ,  B32B27/36 ,  H01G11/78 ,  H01G11/80 ,  H01G11/84 ,  H01M2/02 ,  H01M2/028 ,  H01M2/0285 ,  H01M2/08 ,  Y02E60/13

Abstract: A power storage device packaging material having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. The substrate layer is formed of a polyester film exhibiting ΔA, as expressed by the following formula, of 10% or more and a 50% elongation stress of 75 MPa or more after heat treatment at 160° C.: “ΔA=(break elongation after 160° C. heat treatment)−(break elongation before 160° C. heat treatment)”.

公开(公告)号：US20180366693A1

公开(公告)日：2018-12-20

申请号：US16104772

申请日：2018-08-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Wataru IJUIN ,  Masayoshi SUZUTA

IPC: H01M2/02 ,  B65D65/40 ,  B65D75/32 ,  H01G11/80 ,  H01G11/84

Abstract: The present invention relates to a packaging material for a power storage device, the packaging material including at least a slip agent layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer, in this order, wherein the slip agent layer contains a fatty acid amide and a fatty acid bisamide, or a fatty acid amide and silicone oil.

公开(公告)号：US20180219192A1

公开(公告)日：2018-08-02

申请号：US15922417

申请日：2018-03-15

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Wataru IJUIN ,  Satoshi SASAKI

IPC: H01M2/02 ,  H01G11/78 ,  H01G11/84 ,  H01M10/0525 ,  B32B7/12 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B27/16 ,  B32B27/32 ,  B32B27/36 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  B32B27/08 ,  B32B37/02 ,  B32B37/15 ,  B32B38/00

CPC classification number: H01M2/0287 ,  B32B7/12 ,  B32B15/00 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/16 ,  B32B27/32 ,  B32B27/36 ,  B32B37/02 ,  B32B37/06 ,  B32B37/10 ,  B32B37/1207 ,  B32B37/153 ,  B32B38/0008 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/26 ,  B32B2307/732 ,  B32B2310/14 ,  B32B2311/24 ,  B32B2323/10 ,  B32B2333/00 ,  B32B2367/00 ,  B32B2457/10 ,  B32B2457/16 ,  H01G11/78 ,  H01G11/82 ,  H01G11/84 ,  H01M2/0202 ,  H01M2/026 ,  H01M2/0277 ,  H01M2/028 ,  H01M2/0285 ,  H01M10/0525 ,  H01M2002/0297 ,  H01M2220/30 ,  Y02E60/13

Abstract: A packaging material for a power storage device having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. In the packaging material, the substrate layer is formed of a polyester film having a 50% elongation stress in the range of 100 to 180 MPa and a thermal shrinkage in the range of 1 to 15%, after heat treatment from 160° C. to 200° C., or a polyester film having a difference ΔA in break elongation of 12% or more after heat treatment at 200° C. and 160° C. and having a 50% elongation stress of 75 MPa or more after heat treatment at 200° C.

公开(公告)号：US20170141362A1

公开(公告)日：2017-05-18

申请号：US15404448

申请日：2017-01-12

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Wataru IJUIN

IPC: H01M2/02 ,  H01M2/08

Abstract: A power storage device packaging material including a base material layer; an adhesion-enhancing treatment layer on a surface of the base material layer; an adhesive layer on a surface of the adhesion-enhancing treatment layer opposite the base material layer; a metal foil layer formed on one side of the adhesive layer opposite the adhesion-enhancing treatment layer; and a sealant layer disposed on a surface of the metal foil layer opposite the adhesive layer. The base material layer is formed of a biaxially oriented film to have a breaking strength of 240 MPa or more in at least one of four directions (0° (MD), 45°, 90° (TD), 135°) and an elongation of 80% or more in at least one direction in a tensile test (test specimen shape: test specimen type 5 stipulated in JIS K7127; inter-chuck distance: 60 mm; tensile speed: 50 mm/min).