Yttrium ingot and sputtering target in which the yttrium ingot is used

    公开(公告)号:US12227830B2

    公开(公告)日:2025-02-18

    申请号:US17996718

    申请日:2021-04-19

    Abstract: Provided is an yttrium ingot from which an yttrium sputtering target that produces a reduced number of particles can be obtained, and an yttrium sputtering target that has high plasma resistance and a low resistance that enables realization of a high film deposition rate can be obtained.
    An yttrium ingot, wherein the yttrium ingot has a fluorine atom content of less than or equal to 10 wt %; in an instance where the yttrium ingot constitutes a target, a sputtering surface of the target has a surface roughness of 10 nm or greater and 2 μm or less; in the yttrium ingot, the number of pores having a diameter of greater than or equal to 100 μm is fewer than or equal to 0.1/cm2; and the yttrium ingot has a relative density of greater than or equal to 96%.

    Cr—Si sintered body, sputtering target, and method for producing thin film

    公开(公告)号:US12173398B2

    公开(公告)日:2024-12-24

    申请号:US17906927

    申请日:2021-03-24

    Abstract: A Cr—Si sintered body contains Cr and Si. The Cr—Si sintered body contains a crystalline CrSi2 phase and a crystalline Si phase. A content of the Si phase in the Cr—Si sintered body is 40% by mass or more. A relative density of the Cr—Si sintered body relative to a true density of the Cr—Si sintered body is 95% or more. The CrSi2 phase has an average crystal grain size of 40 μm or less, and the Si phase has an average crystal grain size of 30 μm or less. A total content of impurities in the Cr—Si sintered body is 200 ppm by mass or less, and the impurities are composed of at least one element selected from the group consisting of Mn, Fe, Mg, Ca, Sr, and Ba.

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