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公开(公告)号:US12247297B2
公开(公告)日:2025-03-11
申请号:US17772972
申请日:2020-10-27
Inventor: Yuya Tsuchida , Yuya Suemoto , Yoshihiro Ueoka , Masami Mesuda , Hideto Kuramochi , Takahiro Nagata , Liwen Sang , Toyohiro Chikyow
IPC: H01L21/02 , C23C14/00 , C23C14/02 , C23C14/06 , C23C14/34 , C23C14/35 , C23C28/04 , C30B23/02 , C30B25/06 , C30B25/18 , C30B29/40 , C30B29/68 , H01L29/20 , H01L29/205 , H01L33/32 , H01S5/02
Abstract: The present invention provides: a multilayer film structure which has high crystallinity and planarity; and a method for producing this multilayer film structure. This multilayer film structure is provided with: an Si (111) substrate; a first thin film that is arranged on the Si (111) substrate, while being formed of a nitride material and/or aluminum; and a second thin film that is arranged on the first thin film, while being formed of a nitride material. An amorphous layer having a thickness of 0 nm or more but less than 1.0 nm are present on the Si (111) substrate; and the full width at half maximum (FWHM) of a rocking curve of the (0002) plane at the surface of this multilayer film structure is 1.50° or less.
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公开(公告)号:US12227830B2
公开(公告)日:2025-02-18
申请号:US17996718
申请日:2021-04-19
Applicant: TOSOH CORPORATION
Inventor: Yuya Tsuchida , Masami Mesuda , Hiroyuki Hara , Osamu Matsunaga
Abstract: Provided is an yttrium ingot from which an yttrium sputtering target that produces a reduced number of particles can be obtained, and an yttrium sputtering target that has high plasma resistance and a low resistance that enables realization of a high film deposition rate can be obtained.
An yttrium ingot, wherein the yttrium ingot has a fluorine atom content of less than or equal to 10 wt %; in an instance where the yttrium ingot constitutes a target, a sputtering surface of the target has a surface roughness of 10 nm or greater and 2 μm or less; in the yttrium ingot, the number of pores having a diameter of greater than or equal to 100 μm is fewer than or equal to 0.1/cm2; and the yttrium ingot has a relative density of greater than or equal to 96%.-
公开(公告)号:US11377725B2
公开(公告)日:2022-07-05
申请号:US17031294
申请日:2020-09-24
Applicant: TOSOH CORPORATION
Inventor: Ryo Akiike , Yuya Tsuchida , Hideto Kuramochi
IPC: C04B35/01 , C04B35/495 , H01B1/08 , C23C14/34 , C03C17/245 , C04B35/626 , H01L31/18 , H01B1/00 , C04B35/64 , H01L27/30 , H01L31/0224 , H01L31/0264 , C23C14/08 , C23C14/35 , H01B13/00 , H01J37/34
Abstract: An oxide sintered body containing indium, hafnium, tantalum, and oxygen as constituent elements, in which when indium, hafnium, and tantalum are designated as In, Hf, and Ta, respectively, the atomic ratio of Hf/(In+Hf+Ta) is equal to 0.002 to 0.030, and the atomic ratio of Ta/(In+Hf+Ta) is equal to 0.0002 to 0.013.
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公开(公告)号:US10815564B2
公开(公告)日:2020-10-27
申请号:US16078488
申请日:2017-02-20
Applicant: TOSOH CORPORATION
Inventor: Ryo Akiike , Yuya Tsuchida , Hideto Kuramochi
IPC: C23C14/08 , C23C14/35 , C04B35/01 , H01B1/08 , C23C14/34 , C03C17/245 , C04B35/626 , H01L31/18 , H01B1/00 , C04B35/495 , C04B35/64 , H01L27/30 , H01L31/0224 , H01L31/0264 , H01B13/00
Abstract: An oxide sintered body containing indium, hafnium, tantalum, and oxygen as constituent elements, in which when indium, hafnium, and tantalum are designated as In, Hf, and Ta, respectively, the atomic ratio of Hf/(In+Hf+Ta) is equal to 0.002 to 0.030, and the atomic ratio of Ta/(In+Hf+Ta) is equal to 0.0002 to 0.013.
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