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    Electrical contact assembly
    1.
    发明授权
    Electrical contact assembly 有权
    电接触组件

    公开(公告)号：US09543679B2

    公开(公告)日：2017-01-10

    申请号：US13841449

    申请日：2013-03-15

    申请人： Tyco Electronics Corporation ,  Tyco Electronics AMP GMBH

    发明人： Helge Schmidt ,  Michael Leidner ,  Marjorie Myers

    IPC分类号： H01H1/06 ,  H01R13/22 ,  H01H3/12 ,  H01R13/24 ,  H01H1/10 ,  H01H13/48

    CPC分类号： H01R13/22 ,  H01H1/06 ,  H01H1/10 ,  H01H3/125 ,  H01H13/48 ,  H01R13/2478 ,  H01R13/2485 ,  H01R13/2492

    摘要： An electrical contact assembly includes a first electrical contact having a first mating element, and a second electrical contact having a second mating element. The first and second electrical contacts being configured to mate together at the first and second mating elements such that the first and second mating elements engage each other at a contact interface. A distribution of contact pressure across the contact interface at least partially coincides with a distribution of electrical current flow across the contact interface.

    摘要翻译： 电接触组件包括具有第一配合元件的第一电接触件和具有第二配合元件的第二电接触件。 第一和第二电触点构造成在第一和第二配合元件处配合在一起，使得第一和第二配合元件在接触界面处彼此接合。 接触界面上的接触压力的分布至少部分地与穿过接触界面的电流分布一致。

    ELECTRICAL CONTACT ASSEMBLY
    3.
    发明申请
    ELECTRICAL CONTACT ASSEMBLY 有权
    电气接点组件

    公开(公告)号：US20140099803A1

    公开(公告)日：2014-04-10

    申请号：US13841449

    申请日：2013-03-15

    申请人： Tyco Electronics AMP GmbH ,  Tyco Electronics Corporation

    发明人： Helge Schmidt ,  Michael Leidner ,  Marjorie Myers

    IPC分类号： H01R13/22

    CPC分类号： H01R13/22 ,  H01H1/06 ,  H01H1/10 ,  H01H3/125 ,  H01H13/48 ,  H01R13/2478 ,  H01R13/2485 ,  H01R13/2492

    摘要： An electrical contact assembly includes a first electrical contact having a first mating element, and a second electrical contact having a second mating element. The first and second electrical contacts being configured to mate together at the first and second mating elements such that the first and second mating elements engage each other at a contact interface. A distribution of contact pressure across the contact interface at least partially coincides with a distribution of electrical current flow across the contact interface.

    摘要翻译： 电接触组件包括具有第一配合元件的第一电接触件和具有第二配合元件的第二电接触件。 第一和第二电触点构造成在第一和第二配合元件处配合在一起，使得第一和第二配合元件在接触界面处彼此接合。 接触界面上的接触压力的分布至少部分地与穿过接触界面的电流分布一致。

    ELECTRICAL COMPONENT AND METHOD FOR FABRICATING SAME
    5.
    发明申请
    ELECTRICAL COMPONENT AND METHOD FOR FABRICATING SAME 审中-公开
    电气元件及其制造方法

    公开(公告)号：US20150079421A1

    公开(公告)日：2015-03-19

    申请号：US14031917

    申请日：2013-09-19

    申请人： TYCO ELECTRONICS AMP GMBH ,  TYCO ELECTRONICS CORPORATION

    发明人： Marjorie Myers ,  Helge Schmidt

    IPC分类号： H01B1/02 ,  H01B13/00

    CPC分类号： H01B1/02 ,  B32B15/01 ,  B32B15/018 ,  H01B13/0036 ,  H01R13/03 ,  Y10T428/12875

    摘要： An electrical component includes an interior layer that includes an exterior surface. The electrical component includes an intermediate layer that includes at least one platinum group metal (PGM). The intermediate layer extends on the exterior surface of the interior layer. The intermediate layer has an exterior PGM surface. The electrical component includes a silver layer that includes silver. The silver layer extends on the exterior PGM surface such that the intermediate layer extends between the interior layer and the silver layer.

    摘要翻译： 电气部件包括包括外表面的内层。 电气部件包括包含至少一种铂族金属（PGM）的中间层。 中间层在内层的外表面上延伸。 中间层具有外部PGM表面。 电气部件包括包含银的银层。 银层在外部PGM表面上延伸，使得中间层在内层和银层之间延伸。

    METHODS AND SYSTEMS OF MANUFACTURING A COATED STRUCTURE ON A SUBSTRATE
    6.
    发明申请
    METHODS AND SYSTEMS OF MANUFACTURING A COATED STRUCTURE ON A SUBSTRATE 有权
    在衬底上制造涂层结构的方法和系统

    公开(公告)号：US20140099450A1

    公开(公告)日：2014-04-10

    申请号：US13838767

    申请日：2013-03-15

    申请人： TYCO ELECTRONICS CORPORATION ,  Tyco Electronics AMP GmbH

    发明人： Soenke Sachs ,  Helge Schmidt ,  Michael Leidner ,  Eva Henschel ,  Dominique Freckmann ,  Marjorie Myers

    IPC分类号： C23C14/30 ,  C23C14/58

    CPC分类号： C23C14/30 ,  C23C14/5873

    摘要： A method of manufacturing a coated structure on a substrate includes positioning a substrate in a vapor deposition chamber having a crucible with source material. The method includes evaporating the source material with electron beams from an irradiation source, the evaporated source material being deposited on the substrate as a coating layer. The method includes ablating the coating layer with the electron beams to selectively remove portions of the coating layer leaving a circuit structure on the substrate. The evaporating and ablating are accomplished in situ within the vapor deposition chamber using the same irradiation source.

    摘要翻译： 在衬底上制造涂覆结构的方法包括将衬底定位在具有源材料的坩埚的气相沉积室中。 该方法包括用来自照射源的电子束蒸发源材料，蒸发的源材料作为涂层沉积在基底上。 该方法包括用电子束烧蚀涂层，以选择性地去除涂层的部分，从而在衬底上留下电路结构。 使用相同的照射源在蒸镀室内原位完成蒸发和消融。

    ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS
    7.
    发明申请
    ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS 审中-公开
    电气元件的制造和制造方法和系统

    公开(公告)号：US20150319865A1

    公开(公告)日：2015-11-05

    申请号：US14711453

    申请日：2015-05-13

    申请人： Tyco Electronics Corporation ,  Tyco Electronics AMP GmbH

    发明人： Soenke Sachs ,  Helge Schmidt ,  Michael Leidner ,  Eva Henschel ,  Dominique Freckmann ,  Marjorie Myers

    IPC分类号： H05K3/10 ,  H05K3/00

    CPC分类号： H05K3/105 ,  H05K1/02 ,  H05K3/0091 ,  H05K3/1283 ,  H05K2203/092 ,  H05K2203/111 ,  H05K2203/1157

    摘要： A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.

    摘要翻译： 一种制造电气部件的方法包括：提供具有外表面的电绝缘基板，在外表面上施加涂覆结构，并用电子束照射涂覆结构，以在基板上形成电导体。 照射可以包括加热涂层以熔化涂层以形成电导体。 涂层可能具有低的粘合剂浓度和高的金属浓度。 照射可以包括蒸发基本上所有的粘合剂，留下基本上纯的金属层以形成电导体。 可以将涂层照射直到涂层的非金属材料完全除去。

    ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS
    8.
    发明申请
    ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS 审中-公开
    电气元件的制造和制造方法和系统

    公开(公告)号：US20140097002A1

    公开(公告)日：2014-04-10

    申请号：US13836861

    申请日：2013-03-15

    申请人： Tyco Electronics Corporation ,  Tyco Electronics AMP GmbH

    发明人： Soenke Sachs ,  Helge Schmidt ,  Michael Leidner ,  Eva Henschel ,  Dominique Freckmann ,  Marjorie Myers

    IPC分类号： H05K3/10 ,  H05K1/02

    CPC分类号： H05K3/105 ,  H05K1/02 ,  H05K3/0091 ,  H05K3/1283 ,  H05K2203/092 ,  H05K2203/111 ,  H05K2203/1157

    摘要： A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.

    摘要翻译： 一种制造电气部件的方法包括：提供具有外表面的电绝缘基板，在外表面上施加涂覆结构，并用电子束照射涂覆结构，以在基板上形成电导体。 照射可以包括加热涂层以熔化涂层以形成电导体。 涂层可能具有低的粘合剂浓度和高的金属浓度。 照射可以包括蒸发基本上所有的粘合剂，留下基本上纯的金属层以形成电导体。 可以将涂层照射直到涂层的非金属材料完全除去。