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公开(公告)号：US20140099450A1
公开(公告)日：2014-04-10
申请号：US13838767
申请日：2013-03-15
发明人： Soenke Sachs , Helge Schmidt , Michael Leidner , Eva Henschel , Dominique Freckmann , Marjorie Myers
CPC分类号： C23C14/30 , C23C14/5873
摘要： A method of manufacturing a coated structure on a substrate includes positioning a substrate in a vapor deposition chamber having a crucible with source material. The method includes evaporating the source material with electron beams from an irradiation source, the evaporated source material being deposited on the substrate as a coating layer. The method includes ablating the coating layer with the electron beams to selectively remove portions of the coating layer leaving a circuit structure on the substrate. The evaporating and ablating are accomplished in situ within the vapor deposition chamber using the same irradiation source.
摘要翻译： 在衬底上制造涂覆结构的方法包括将衬底定位在具有源材料的坩埚的气相沉积室中。 该方法包括用来自照射源的电子束蒸发源材料，蒸发的源材料作为涂层沉积在基底上。 该方法包括用电子束烧蚀涂层，以选择性地去除涂层的部分，从而在衬底上留下电路结构。 使用相同的照射源在蒸镀室内原位完成蒸发和消融。
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公开(公告)号：US09543679B2
公开(公告)日：2017-01-10
申请号：US13841449
申请日：2013-03-15
发明人： Helge Schmidt , Michael Leidner , Marjorie Myers
CPC分类号： H01R13/22 , H01H1/06 , H01H1/10 , H01H3/125 , H01H13/48 , H01R13/2478 , H01R13/2485 , H01R13/2492
摘要： An electrical contact assembly includes a first electrical contact having a first mating element, and a second electrical contact having a second mating element. The first and second electrical contacts being configured to mate together at the first and second mating elements such that the first and second mating elements engage each other at a contact interface. A distribution of contact pressure across the contact interface at least partially coincides with a distribution of electrical current flow across the contact interface.
摘要翻译： 电接触组件包括具有第一配合元件的第一电接触件和具有第二配合元件的第二电接触件。 第一和第二电触点构造成在第一和第二配合元件处配合在一起，使得第一和第二配合元件在接触界面处彼此接合。 接触界面上的接触压力的分布至少部分地与穿过接触界面的电流分布一致。
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公开(公告)号：US09758858B2
公开(公告)日：2017-09-12
申请号：US13838767
申请日：2013-03-15
发明人： Soenke Sachs , Helge Schmidt , Michael Leidner , Eva Henschel , Dominique Freckmann , Marjorie Myers
CPC分类号： C23C14/30 , C23C14/5873
摘要： A method of manufacturing a coated structure on a substrate includes positioning a substrate in a vapor deposition chamber having a crucible with source material. The method includes evaporating the source material with electron beams from an irradiation source, the evaporated source material being deposited on the substrate as a coating layer. The method includes ablating the coating layer with the electron beams to selectively remove portions of the coating layer leaving a circuit structure on the substrate. The evaporating and ablating are accomplished in situ within the vapor deposition chamber using the same irradiation source.
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公开(公告)号：US10154595B2
公开(公告)日：2018-12-11
申请号：US14711453
申请日：2015-05-13
发明人： Soenke Sachs , Helge Schmidt , Michael Leidner , Eva Henschel , Dominique Freckmann , Marjorie Myers
摘要： A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.
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公开(公告)号：US20140099803A1
公开(公告)日：2014-04-10
申请号：US13841449
申请日：2013-03-15
发明人： Helge Schmidt , Michael Leidner , Marjorie Myers
IPC分类号： H01R13/22
CPC分类号： H01R13/22 , H01H1/06 , H01H1/10 , H01H3/125 , H01H13/48 , H01R13/2478 , H01R13/2485 , H01R13/2492
摘要： An electrical contact assembly includes a first electrical contact having a first mating element, and a second electrical contact having a second mating element. The first and second electrical contacts being configured to mate together at the first and second mating elements such that the first and second mating elements engage each other at a contact interface. A distribution of contact pressure across the contact interface at least partially coincides with a distribution of electrical current flow across the contact interface.
摘要翻译： 电接触组件包括具有第一配合元件的第一电接触件和具有第二配合元件的第二电接触件。 第一和第二电触点构造成在第一和第二配合元件处配合在一起，使得第一和第二配合元件在接触界面处彼此接合。 接触界面上的接触压力的分布至少部分地与穿过接触界面的电流分布一致。
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6.发明申请ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS 审中-公开电气元件的制造和制造方法和系统公开(公告)号：US20150319865A1
公开(公告)日：2015-11-05
申请号：US14711453
申请日：2015-05-13
发明人： Soenke Sachs , Helge Schmidt , Michael Leidner , Eva Henschel , Dominique Freckmann , Marjorie Myers
CPC分类号： H05K3/105 , H05K1/02 , H05K3/0091 , H05K3/1283 , H05K2203/092 , H05K2203/111 , H05K2203/1157
摘要： A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.
摘要翻译： 一种制造电气部件的方法包括：提供具有外表面的电绝缘基板，在外表面上施加涂覆结构，并用电子束照射涂覆结构，以在基板上形成电导体。 照射可以包括加热涂层以熔化涂层以形成电导体。 涂层可能具有低的粘合剂浓度和高的金属浓度。 照射可以包括蒸发基本上所有的粘合剂，留下基本上纯的金属层以形成电导体。 可以将涂层照射直到涂层的非金属材料完全除去。
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7.发明申请ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS 审中-公开电气元件的制造和制造方法和系统公开(公告)号：US20140097002A1
公开(公告)日：2014-04-10
申请号：US13836861
申请日：2013-03-15
发明人： Soenke Sachs , Helge Schmidt , Michael Leidner , Eva Henschel , Dominique Freckmann , Marjorie Myers
CPC分类号： H05K3/105 , H05K1/02 , H05K3/0091 , H05K3/1283 , H05K2203/092 , H05K2203/111 , H05K2203/1157
摘要： A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.
摘要翻译： 一种制造电气部件的方法包括：提供具有外表面的电绝缘基板，在外表面上施加涂覆结构，并用电子束照射涂覆结构，以在基板上形成电导体。 照射可以包括加热涂层以熔化涂层以形成电导体。 涂层可能具有低的粘合剂浓度和高的金属浓度。 照射可以包括蒸发基本上所有的粘合剂，留下基本上纯的金属层以形成电导体。 可以将涂层照射直到涂层的非金属材料完全除去。
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公开(公告)号：US20170100916A1
公开(公告)日：2017-04-13
申请号：US14881041
申请日：2015-10-12
发明人： Lavanya Bharadwaj , Barry C. Mathews , Dominique Freckmann , Shallu Soneja , Michael A. Oar , Gokce Gulsoy , Helge Schmidt , Michael Leidner , Soenke Sachs
CPC分类号： B32B15/04 , B32B37/06 , B32B37/08 , B32B2307/554 , B32B2457/00 , H01L21/324 , H05K1/0207 , H05K3/125 , H05K2203/092 , H05K2203/1131
摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
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9.发明申请ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELECTRICAL COMPONENTS 审中-公开电气元件的制造和制造方法和系统公开(公告)号：US20150126026A1
公开(公告)日：2015-05-07
申请号：US14589748
申请日：2015-01-05
发明人： Soenke Sachs , Helge Schmidt , Michael Leidner , Eva Henschel , Dominique Freckmann , Marjorie Myers
IPC分类号： H01L21/768 , H01L23/34
CPC分类号： H01L21/76892 , B23K15/0006 , H01L23/34 , H01L2924/0002 , H05K1/0271 , H05K1/056 , H05K3/1283 , H05K2203/0545 , H05K2203/092 , H05K2203/1105 , H05K2203/1476 , H01L2924/00
摘要： A method of manufacturing an electrical component includes providing a substrate, applying an insulating layer on the substrate, applying a circuit layer on the insulating layer, irradiating the insulating layer with an electron beam to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform the circuit layer. The substrate may be a metallic substrate that is highly thermally conductive. The insulating layer provides electrical isolation and effective heat transfer between the circuit layer and the substrate. The method may include coupling a light emitting diode module or other active circuits requiring thermal management to the circuit layer resident on the electrically insulating/thermally conducting layer.
摘要翻译： 一种制造电气元件的方法包括：提供基板，在基板上施加绝缘层，在绝缘层上施加电路层，用电子束照射绝缘层以转换绝缘层，以及用电路层照射电路层 电子束转换电路层。 衬底可以是高导热性的金属衬底。 绝缘层在电路层和衬底之间提供电隔离和有效的热传递。 该方法可以包括将需要热管理的发光二极管模块或其它有源电路耦合到驻留在电绝缘/导热层上的电路层。
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