Substrate processing apparatus
    5.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号:US08588950B2

    公开(公告)日:2013-11-19

    申请号:US13036485

    申请日:2011-02-28

    申请人: Makoto Nomura

    发明人: Makoto Nomura

    摘要: Only a wafer for QC check may be transferred and a production wafer may prevent from being transferred into an assigned process chamber whose QC check is not completed after a maintenance task, and the production wafer may be processed the assigned process chamber after the completion of the QC check. The wafer for QC check is transferred while inhibiting a transfer of the production wafer into the assigned process chamber, and the production wafer is transferred into each of the process chambers of the plurality except the assigned process chamber.

    摘要翻译: 可以仅转移用于QC检查的晶片,并且生产晶片可以防止在维护任务之后被转移到QC检查未完成的指定处理室中,并且生产晶片可以在完成之后被处理分配的处理室 QC检查。 传送用于QC检查的晶片,同时禁止将生产晶片转移到指定的处理室中,并且将生产晶片转移到除了指定的处理室之外的多个处理室中。

    Negative-type photosensitive resin composition containing epoxy-containing material
    6.
    发明申请
    Negative-type photosensitive resin composition containing epoxy-containing material 审中-公开
    含有含环氧材料的负型感光性树脂组合物

    公开(公告)号:US20060199099A1

    公开(公告)日:2006-09-07

    申请号:US11365381

    申请日:2006-03-01

    IPC分类号: G03C1/76

    CPC分类号: G03F7/0382

    摘要: Provided are negative-type photosensitive resin compositions which may be used as interlayer insulating layers on a silicon wafer. The compositions include a urea crosslinking agent together with an epoxy-containing material and vinylphenol resin. Also provided are methods of forming patterned insulating layers using such compositions. The resin compositions can be used in the manufacture of wafer-level chip-scale packages and LSIs, for example, as interlayer insulating layers.

    摘要翻译: 提供可以用作硅晶片上的层间绝缘层的负型感光性树脂组合物。 组合物包括与含环氧基材料和乙烯基苯酚树脂一起的尿素交联剂。 还提供了使用这种组合物形成图案化绝缘层的方法。 树脂组合物可用于制造晶片级芯片级封装和LSI,例如作为层间绝缘层。

    Negative-type photosensitive resin composition containing epoxy-containing material
    7.
    发明申请
    Negative-type photosensitive resin composition containing epoxy-containing material 审中-公开
    含有含环氧材料的负型感光性树脂组合物

    公开(公告)号:US20060199098A1

    公开(公告)日:2006-09-07

    申请号:US11365100

    申请日:2006-03-01

    IPC分类号: G03C1/76

    CPC分类号: G03F7/0382 G03F7/0381

    摘要: Provided are negative-type photosensitive resin compositions which may be used in forming interlayer insulating layers on a silicon wafer or printed wiring board. The compositions include a vinylphenol resin, a biphenyl-phenol resin and epoxy-containing materials. Also provided are methods of forming patterned dielectric films using such compositions. The resin compositions can be used in the manufacture of wafer-level chip-scale packages and LSIs, for example, as interlayer insulating layers.

    摘要翻译: 提供可以用于在硅晶片或印刷线路板上形成层间绝缘层的负型感光性树脂组合物。 组合物包括乙烯基苯酚树脂,联苯酚树脂和含环氧树脂的材料。 还提供了使用这种组合物形成图案化电介质膜的方法。 树脂组合物可用于制造晶片级芯片级封装和LSI,例如作为层间绝缘层。

    Cutting tool and wear resistant material
    8.
    发明授权
    Cutting tool and wear resistant material 失效
    切削刀具和耐磨材料

    公开(公告)号:US06314798B2

    公开(公告)日:2001-11-13

    申请号:US09841591

    申请日:2001-04-25

    IPC分类号: G01N348

    摘要: Cutting tools and wear-resistant materials formed of a silicon-nitride-based sintered body having excellent characteristics, such as high wear resistance. Cutting tool 1 is in the form of a negative chip having a shape prescribed by ISO standard: SNGN 120408. Specifically, the cutting tool 1 is a chip of a rectangular parallelepiped shape which has a thickness of 4.76 mm and in which each of four sides (cutting edges) 5 on a rake face 3 side has a length of 12.7 mm. In the region having a width of 0.2 mm or less and extending from the cutting edges 5 of the cutting tool 1, the cutting tool 1 has a microhardness H. Plast of 21.2 GPa or greater and a microhardness HU of 11.2 GPa or greater. The Vickers hardness of the cutting tool 1 as measured at a substantial center of the rake face 3 is 14.5 GPa or greater. Further, the amount of oxygen within the cutting tool 1 is 1.0 to 2.0 wt. %. Also disclosed is a method of quality control of an article having a surface, at least a portion of which is curved, which includes measuring one or both of microhardness H. Plast and microhardness HU in the vicinity of the curved portion of the surface, and either accepting or rejecting the article based on the measurement values.

    摘要翻译: 由氮化硅类烧结体形成的切削工具和耐磨材料,具有优异的耐磨性等特性。 切削刀具1是具有由ISO标准规定的形状的负片的形式:SNGN 120408.具体而言,切削工具1是厚度为4.76mm的长方体形状的切屑,其中, (切削刃)5在前刀面3侧的长度为12.7mm。 在宽度为0.2mm以下且从切削工具1的切削刃5延伸的区域中,切削工具1具有显微硬度H.21.0GPa以上的显微硬度,11.2GPa以上的显微硬度HU。 在前刀面3的大致中心处测量的切削工具1的维氏硬度为14.5GPa以上。 此外,切削工具1内的氧量为1.0〜2.0重量%。 %。 还公开了一种具有表面的质量控制方法,该表面的至少一部分是弯曲的,其包括测量微硬度H之一或两者。表面弯曲部分附近的塑性和显微硬度HU,以及 基于测量值接受或拒绝文章。