摘要:
Provided are negative-type photosensitive resin compositions which may be used in forming interlayer insulating layers on a silicon wafer or printed wiring board. The compositions include a vinylphenol resin, a biphenyl-phenol resin and epoxy-containing materials. Also provided are methods of forming patterned dielectric films using such compositions. The resin compositions can be used in the manufacture of wafer-level chip-scale packages and LSIs, for example, as interlayer insulating layers.
摘要:
This invention relates to a process for forming photo-polymerized images in light sensitive layers containing an activated component, a light sensitive resin and a colorable or decolorable component. Upon exposure to activating radiation the colored component is decolored or the decolorable component is colored and the energy involved is transferred to the light sensitive resin for polymerization.
摘要:
It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH2OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).
摘要:
A compound of the formula (I) where the symbols and indices are each defined as follows: A is A′, R or O—R; where R is a straight-chain, branched or cyclic, saturated or unsaturated aliphatic radical having 1-8 carbon atoms; A′ is the same or different and is B is a bond, —O—C(O)—, —C(O)—O—, —O—C(O)—, —C(O)—NH—, —NH—C(O)—, —C(O)—O—CH2—CH(OH)—CH2—O, —O—CH2—CH(OH)—CH2—O—(O)C—, —O—C(O)—O—, —O—C(O)—NH— or —NH—C(O)—O—; R1 is H or OH; m is 1, 2, 3, 4 or 5; Y is n is a positive rational number ≧3; E is the same or different and is —CH—CHR2—, —CHR2—CH2—, —CH2—CHR2—O—, —O—CHR2—CH2—, —(CH2)r—O— or —O—(CH2)—; R2 is H or CH3 and r is 1 or 4, is suitable as a light-sensitive component for photoresists.
摘要:
A composition of matter including an onium salt and a method of forming images. The onium salt has a chromophore which absorbs ultraviolet radiation, an S, Se, As, N or P atom which is free of substituents exhibiting a higher energy occupied molecular orbital than the chromophore; an insulating group which links the chromophore to the S, Se, As, N or P atom of the salt and substantially prevents .pi. resonance from the chromophore through the S, Se, As, N or P atom; and an anion. The onium salt is capable of forming a Bronsted acid upon exposure to ultraviolet radiation in the presence of a proton source. In the method of forming images, the onium salt is exposed to ultraviolet radiation in the presence of a proton source, to convert said onium salt to a Bronsted acid.
摘要:
Mixtures of light-sensitive compounds with vinylphenol resins constitute new light-sensitive compositions which are especially valuable for use as light-sensitive coatings of materials such as printing plates. The resin advantageously is a polymer or copolymer of ortho-vinylphenol, and the light-sensitive compound an aromatic ester or amide of an ortho-naphthoquinone diazide sulfonic or carboxylic acid. Aluminum foil offset plates coated with the compositions give remarkably long printing runs, due to the exceptional wear resistance and good adhesion exhibited by image areas which contain a vinylphenol resin.
摘要:
A one-component reactive resin system which is stable in storage but nevertheless can readily be cured completely comprises a mixture of commercially available epoxy resins and phosphorus-containing glycidyl esters, in particular phosphonic acid diglycidyl esters, as well as cationic photoinitiators. The low-viscosity reactive resin systems cannot be cured purely by means of heat and can be processed at high temperatures and in particular can have a high filler content. The reactive resin systems, which are stable to storage even after UV activation, can be cured to flame-resistant molded materials under moderate conditions.
摘要:
A PRINTING PLATE BASE COMPOSITION OF (1) AN ASSOCIATION PRODUCE OF A NORMALLY WATER SOLUBLE ETHYLENE OXIDE POLYMER AND A HEAT FUSIBLE PHENOLIC RESIN, AND (2) 2 TO 50 PERCENT BY WEIGHT OF AN OXIDIZING ACIDIC COMPOUND BASED ON THE WEIGHT OF THE PHENOLIC RESIN.