公开(公告)号：US6049074A

公开(公告)日：2000-04-11

申请号：US379630

申请日：1999-08-24

申请人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

发明人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

IPC分类号： G01T1/20 ,  H01J35/10 ,  H01L27/00 ,  H01L27/14 ,  H01L27/144 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/115 ,  H04N5/32

CPC分类号： H01L27/14663 ,  H01L27/1446 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14676 ,  H01L31/02 ,  H01L31/02322 ,  H01L31/024 ,  H01L31/085 ,  H01L31/115 ,  H01L2924/0002 ,  H04N5/32

摘要： In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

摘要翻译： 在包括外围IC的光电转换装置中，外围IC通过导热部件与具有光电转换元件的基板和底板热接触，该基板覆盖外围IC并具有高导热性，以消除不利影响 的外部IC产生的热量，例如低S / N比。

公开(公告)号：US5965872A

公开(公告)日：1999-10-12

申请号：US107283

申请日：1998-06-30

申请人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

发明人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

IPC分类号： G01T1/20 ,  H01J35/10 ,  H01L27/00 ,  H01L27/14 ,  H01L27/144 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/115 ,  H04N5/32

CPC分类号： H01L27/14663 ,  H01L27/1446 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14676 ,  H01L31/02 ,  H01L31/02322 ,  H01L31/024 ,  H01L31/085 ,  H01L31/115 ,  H01L2924/0002 ,  H04N5/32

摘要： In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

摘要翻译： 在包括外围IC的光电转换装置中，外围IC通过导热部件与具有光电转换元件的基板和底板热接触，该基板覆盖外围IC并具有高导热性，以消除不利影响 的外部IC产生的热量，例如低S / N比。

公开(公告)号：US5811790A

公开(公告)日：1998-09-22

申请号：US803106

申请日：1997-02-20

申请人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

发明人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

IPC分类号： G01T1/20 ,  H01J35/10 ,  H01L27/00 ,  H01L27/14 ,  H01L27/144 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/115 ,  H04N5/32

CPC分类号： H01L27/14663 ,  H01L27/1446 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14676 ,  H01L31/02 ,  H01L31/02322 ,  H01L31/024 ,  H01L31/085 ,  H01L31/115 ,  H01L2924/0002 ,  H04N5/32

摘要： In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

摘要翻译： 在包括外围IC的光电转换装置中，外围IC通过导热部件与具有光电转换元件的基板和底板热接触，该基板覆盖外围IC并具有高导热性，以消除不利影响 的外部IC产生的热量，例如低S / N比。

公开(公告)号：US5777335A

公开(公告)日：1998-07-07

申请号：US721947

申请日：1996-09-27

申请人： Chiori Mochizuki ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Tadao Endo ,  Toshikazu Tamura

发明人： Chiori Mochizuki ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Tadao Endo ,  Toshikazu Tamura

IPC分类号： G01T1/20 ,  H01L27/14 ,  H01L27/146 ,  H04N5/32 ,  G01T1/29

CPC分类号： G01T1/2018

摘要： An imaging apparatus whose substrate or base stand is arranged to be a member to absorb or shield radiation in order to prevent semiconductor element, such as ICs, provided for driving photoelectric elements from making any malfunction or from being deteriorated by the irradiation of radiation, such as X-rays or .gamma.-rays, transmitted from the photoelectric conversion element substrate or base stand or in order to prevent radiation from being scattered.

摘要翻译： 一种成像装置，其基板或基座被布置为吸收或屏蔽辐射的部件，以便防止为驱动光电元件而导致的光电元件的半导体元件（例如IC）发生故障或由辐射照射而劣化 作为从光电转换元件基板或基座传送的X射线或γ射线，或者为了防止辐射被散射。

公开(公告)号：US06352875B1

公开(公告)日：2002-03-05

申请号：US09176258

申请日：1998-10-21

申请人： Shinichi Hayashi ,  Akira Funakoshi ,  Akira Tago ,  Satoshi Okada ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura

发明人： Shinichi Hayashi ,  Akira Funakoshi ,  Akira Tago ,  Satoshi Okada ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura

IPC分类号： H01L310203

CPC分类号： H01L27/14618 ,  H01L24/14 ,  H01L27/14634 ,  H01L27/14676 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/12042 ,  H01L2924/351 ,  Y10T156/1077 ,  Y10T156/1092 ,  H01L2924/00

摘要： In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrates, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.

摘要翻译： 在通过使用粘合剂将多个半导体元件基板布置并固定到基底上而获得的光电转换装置中，以期望的粘合剂厚度调整基板的上表面的水平，以将上表面设置在 从基板的上表面到每个基板的半导体元件表面的距离保持相同的平面，从而实现由二维排列的多个基板构成的光电转换装置，从而消除了 基板，因此没有诸如分辨率降低，灵敏度降低和荧光体剥离等问题。

公开(公告)号：US5856699A

公开(公告)日：1999-01-05

申请号：US733772

申请日：1996-10-18

申请人： Shinichi Hayashi ,  Akira Funakoshi ,  Akira Tago ,  Satoshi Okada ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura

发明人： Shinichi Hayashi ,  Akira Funakoshi ,  Akira Tago ,  Satoshi Okada ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura

IPC分类号： G01J1/44 ,  G01T1/20 ,  H01L27/14 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/042 ,  H01L31/09 ,  H01L31/14 ,  H04N1/028 ,  H04N1/04 ,  H04N5/335 ,  H05K3/30

CPC分类号： H01L27/14618 ,  H01L24/14 ,  H01L27/14634 ,  H01L31/0203 ,  H01L31/02322 ,  H01L27/14676 ,  H01L2924/12042 ,  H01L2924/351 ,  Y10T156/1077 ,  Y10T156/1092

摘要： In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrate, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.

摘要翻译： 在通过使用粘合剂将多个半导体元件基板布置并固定到基底上而获得的光电转换装置中，以期望的粘合剂厚度调整基板的上表面的水平，以将上表面设置在 从基板的上表面到每个基板的半导体元件表面的距离保持相同的平面，从而实现由二维排列的多个基板构成的光电转换装置，从而消除了 基板，因此没有诸如分辨率降低，灵敏度劣化和荧光体剥离等问题。

公开(公告)号：US5793047A

公开(公告)日：1998-08-11

申请号：US710948

申请日：1996-09-24

申请人： Isao Kobayashi ,  Akira Funakoshi ,  Akira Tago ,  Noriyuki Kaifu ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura ,  Kazuaki Tashiro

发明人： Isao Kobayashi ,  Akira Funakoshi ,  Akira Tago ,  Noriyuki Kaifu ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura ,  Kazuaki Tashiro

IPC分类号： G01J1/44 ,  G01T1/24 ,  H01L21/02 ,  H01L27/12 ,  H01L27/146 ,  H04N1/028 ,  H04N1/04 ,  H04N5/335 ,  H04N5/369 ,  H04N9/07 ,  G01T1/20

CPC分类号： H01L27/14609 ,  H01L27/14623 ,  H01L27/14663

摘要： A photoelectric conversion apparatus comprises a plurality of transparent substrates. Each of the substrates has a a plurality of photoelectric conversion elements on a front surface thereof on a base. A light-absorbing member is provided on at least one of a rear surface and end faces of the substrate.

摘要翻译： 光电转换装置包括多个透明基板。 每个基板在其前表面上具有多个光电转换元件。 光吸收构件设置在基板的后表面和端面中的至少一个上。

公开(公告)号：US08436314B2

公开(公告)日：2013-05-07

申请号：US13393396

申请日：2010-08-31

申请人： Toshio Kameshima ,  Tadao Endo ,  Tomoyuki Yagi ,  Katsuro Takenaka ,  Keigo Yokoyama ,  Sho Sato ,  Toshikazu Tamura

发明人： Toshio Kameshima ,  Tadao Endo ,  Tomoyuki Yagi ,  Katsuro Takenaka ,  Keigo Yokoyama ,  Sho Sato ,  Toshikazu Tamura

IPC分类号： H01L27/146 ,  H04N3/14

CPC分类号： H04N5/341 ,  A61B6/00 ,  A61B6/465 ,  G01T1/17 ,  H04N5/32

摘要： An imaging apparatus includes a control unit and a detector that includes multiple pixels and that performs an image capturing operation to output image data corresponding to radiation or light that is emitted. The image capturing operation includes a first image capturing operation in a first scanning area corresponding to part of the multiple pixels to output image data in the first scanning area and a second image capturing operation in a second scanning area larger than the first scanning area to output image data in the second scanning area. The control unit causes the detector to perform an accumulation operation in the second image capturing operation in a time determined so that an image artifact caused by the scanning area is lower than a predetermined allowable value on the basis of information about the amount of integration of accumulation times in the first image capturing operation.

摘要翻译： 成像装置包括控制单元和包括多个像素的检测器，并执行图像捕获操作以输出对应于所发射的辐射或光的图像数据。 图像拍摄操作包括在与多个像素的一部分相对应的第一扫描区域中的第一图像拍摄操作，以在第一扫描区域中输出图像数据，以及在大于第一扫描区域的第二扫描区域中进行第二图像拍摄操作，以输出 第二扫描区域中的图像数据。 控制单元使得检测器在第二图像拍摄操作中执行累积操作，该时间确定为使得由扫描区域引起的图像伪影基于关于累积量的积分量的信息而低于预定的允许值 次在第一次图像捕获操作。

公开(公告)号：US06944266B2

公开(公告)日：2005-09-13

申请号：US10685534

申请日：2003-10-16

申请人： Tatsuya Yamazaki ,  Masakazu Morishita ,  Isao Kobayashi ,  Osamu Tsujii ,  Akira Hirai ,  Toshikazu Tamura ,  Hideki Nonaka ,  Takamasa Ishii

发明人： Tatsuya Yamazaki ,  Masakazu Morishita ,  Isao Kobayashi ,  Osamu Tsujii ,  Akira Hirai ,  Toshikazu Tamura ,  Hideki Nonaka ,  Takamasa Ishii

IPC分类号： A61B6/00 ,  H05G1/44 ,  H05G1/64

CPC分类号： A61B6/107 ,  A61B6/06 ,  A61B6/4291 ,  A61B6/542 ,  A61B6/544 ,  H05G1/44

摘要： An X-ray imaging apparatus including an X-ray generation means for emitting X-rays, and an X-ray detector on which a grid selected from a plurality of different types of grids is removably mountable. The X-ray detector receives the X-rays emitted from the X-ray generation means, and obtains an X-ray image. The X-ray detector includes an automatic exposure control (AEC) detector for detecting the quantity of X-rays emitted from the X-ray generation means and for outputting a signal based on the detected quantity. The X-ray imaging apparatus also includes a control means for controlling the X-ray generation means and the AEC detector, where the control means controls the X-ray generation means based on the signal output from the AEC detector, and where the control means controls the AEC detector using correction data to correct an exposure detection element forming a part of the AEC detector.

摘要翻译： 一种X射线成像装置，包括用于发射X射线的X射线产生装置以及从多个不同类型的网格中选择的格栅可移除地安装的X射线检测器。 X射线检测器接收从X射线产生装置发射的X射线，并获得X射线图像。 X射线检测器包括自动曝光控制（AEC）检测器，用于检测从X射线产生装置发射的X射线的量并且基于检测到的量输出信号。 X射线成像装置还包括用于控制X射线产生装置和AEC检测器的控制装置，其中控制装置基于从AEC检测器输出的信号控制X射线产生装置，并且其中控制装置 使用校正数据控制AEC检测器，以校正形成AEC检测器的一部分的曝光检测元件。

公开(公告)号：US06952465B2

公开(公告)日：2005-10-04

申请号：US10690559

申请日：2003-10-23

申请人： Akira Hirai ,  Masakazu Morishita ,  Tatsuya Yamazaki ,  Isao Kobayashi ,  Osamu Tsujii ,  Toshikazu Tamura ,  Hideki Nonaka ,  Takamasa Ishii

发明人： Akira Hirai ,  Masakazu Morishita ,  Tatsuya Yamazaki ,  Isao Kobayashi ,  Osamu Tsujii ,  Toshikazu Tamura ,  Hideki Nonaka ,  Takamasa Ishii

IPC分类号： A61B6/00 ,  G01T1/20 ,  G01T1/24 ,  G01T1/29 ,  H05G1/64

CPC分类号： G01T1/2018

摘要： A radiographic apparatus capable of detecting radiation in a stable manner and in an amount suitable for a good image includes AEC detectors arranged in a stripe pattern in the space between pixels converting incident radiation into an electrical signal. The stripes of the AEC detectors are arranged so as not to be parallel to those stripes of an anti-scattering grid.

摘要翻译： 能够以稳定的方式并且适合于良好图像的量检测辐射的放射线照相设备包括以像素将空间中的入射辐射转换为电信号的像素之间的条纹图案布置的AEC检测器。 AEC检测器的条纹被布置成不与反散射栅格的条纹平行。