公开(公告)号：US20230369259A1

公开(公告)日：2023-11-16

申请号：US18358991

申请日：2023-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Kai-Chiang Wu ,  Chung-Shi Liu ,  Shou Zen Chang ,  Chao-Wen Shih

IPC: H01L23/66 ,  H01L23/538 ,  H01P3/00 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01Q9/04 ,  H01Q1/38 ,  H01L21/78 ,  H01L23/552 ,  H01L25/00 ,  H01L23/00 ,  H01Q1/22 ,  H01Q21/06

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01P3/003 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/0457 ,  H01L21/486 ,  H01L2221/68331 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/214 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/3025 ,  H01Q21/065

Abstract: An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.

公开(公告)号：US20210225786A1

公开(公告)日：2021-07-22

申请号：US17222249

申请日：2021-04-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Kai-Chiang Wu ,  Chung-Shi Liu ,  Shou Zen Chang ,  Chao-Wen Shih

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/552 ,  H01L25/10 ,  H01L25/00 ,  H01P3/00 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/31 ,  H01Q9/04 ,  H01L21/683

Abstract: An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.

公开(公告)号：US11749626B2

公开(公告)日：2023-09-05

申请号：US17222249

申请日：2021-04-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Kai-Chiang Wu ,  Chung-Shi Liu ,  Shou Zen Chang ,  Chao-Wen Shih

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L21/78 ,  H01L23/552 ,  H01L25/10 ,  H01L25/00 ,  H01P3/00 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/31 ,  H01Q9/04 ,  H01L21/683 ,  H01Q21/06

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01P3/003 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/0457 ,  H01L21/486 ,  H01L2221/68331 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/214 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/3025 ,  H01Q21/065

Abstract: An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.

公开(公告)号：US12266619B2

公开(公告)日：2025-04-01

申请号：US18358991

申请日：2023-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Kai-Chiang Wu ,  Chung-Shi Liu ,  Shou Zen Chang ,  Chao-Wen Shih

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L25/00 ,  H01L25/10 ,  H01P3/00 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q21/06

Abstract: An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.