公开(公告)号：US11682593B2

公开(公告)日：2023-06-20

申请号：US16932948

申请日：2020-07-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzuan-Horng Liu ,  Chen-Hua Yu ,  Hsien-Pin Hu ,  Tzu-Yu Wang ,  Wei-Cheng Wu ,  Shang-Yun Hou ,  Shin-Puu Jeng

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/498 ,  G01R1/073 ,  H01L23/522 ,  H01L23/58 ,  H01L21/56 ,  H01L21/683

CPC classification number: H01L22/32 ,  G01R1/07378 ,  H01L21/486 ,  H01L21/4853 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/585 ,  H01L21/561 ,  H01L21/6835 ,  H01L2221/68331 ,  H01L2224/05001 ,  H01L2224/056 ,  H01L2224/05026 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2224/056 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014

Abstract: An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads.

公开(公告)号：US20190057912A1

公开(公告)日：2019-02-21

申请号：US16148169

申请日：2018-10-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzuan-Horng Liu ,  Chen-Hua Yu ,  Hsien-Pin Hu ,  Tzu-Yu Wang ,  Wei-Cheng Wu ,  Shang-Yun Hou ,  Shin-Puu Jeng

IPC: H01L21/66 ,  H01L21/48 ,  H01L23/58 ,  G01R1/073 ,  H01L23/522 ,  H01L23/498 ,  H01L21/683 ,  H01L21/56

Abstract: An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads.

公开(公告)号：US20200350221A1

公开(公告)日：2020-11-05

申请号：US16932948

申请日：2020-07-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzuan-Horng Liu ,  Chen-Hua Yu ,  Hsien-Pin Hu ,  Tzu-Yu Wang ,  Wei-Cheng Wu ,  Shang-Yun Hou ,  Shin-Puu Jeng

IPC: H01L21/66 ,  H01L23/498 ,  G01R1/073 ,  H01L23/522 ,  H01L23/58 ,  H01L21/48

Abstract: An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads.

公开(公告)号：US10734295B2

公开(公告)日：2020-08-04

申请号：US16148169

申请日：2018-10-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzuan-Horng Liu ,  Chen-Hua Yu ,  Hsien-Pin Hu ,  Tzu-Yu Wang ,  Wei-Cheng Wu ,  Shang-Yun Hou ,  Shin-Puu Jeng

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/498 ,  G01R1/073 ,  H01L23/522 ,  H01L23/58 ,  H01L21/56 ,  H01L21/683

Abstract: An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads.