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    Cross-linked optical siloxane polymer
    1.
    发明授权
    Cross-linked optical siloxane polymer 失效
    交联光硅氧烷聚合物

    公开(公告)号：US4780510A

    公开(公告)日：1988-10-25

    申请号：US860178

    申请日：1986-05-06

    申请人： Takafumi Uemiya ,  Yoshitaka Osawa ,  Shin-ichiro Niwa ,  Akira Nishimura ,  Yutaka Shibata

    发明人： Takafumi Uemiya ,  Yoshitaka Osawa ,  Shin-ichiro Niwa ,  Akira Nishimura ,  Yutaka Shibata

    IPC分类号： C08G77/38 ,  C08G77/50 ,  C08L83/04 ,  C08L83/05 ,  G02B1/04 ,  C08F130/08 ,  C08F283/12

    CPC分类号： G02B1/04 ,  C08G77/38 ,  C08G77/50 ,  C08L83/04 ,  C08G77/20 ,  C08G77/24 ,  C08G77/70

    摘要： A cross-linked optical siloxane polymer having a group for modifying a refractive index of the polymer which is introduced in a side chain of the polymer by a hydrosilyl reaction of one of the following systems:(1) a compound (A) having a carbon-carbon unsaturated bond and a group for modifying a refractive index, and a siloxane polymer (B) having a silicon hydride group wherein the molar ratio of the silicon hydride group to the carbon-carbon unsaturated bond is more than 1, and(2) a compound (A') having a silicon hydride group and a group for modifying a refractive index, and a siloxane polymer (B') having a carbon-carbon unsaturated bond wherein the molar ratio of the carbon-carbon unsaturated bond to the silicon hydride group is more than 1,the polymer being cross-linked by a hydrosilyl reaction of the unreacted silicon hydride groups of the silixane polymer (B) with a compound (C) having at least two carbon-carbon unsaturated bonds when the system (1) is used, or by a hydrosilyl reaction of the unreacted carbon-carbon unsaturated bonds of the siloxane polymer (B') with a compound (C') having at least two silicon hydride groups when the system (2) is used, the refractive index of which is easily and precisely modified.

    摘要翻译： 一种交联光学硅氧烷聚合物，其具有用于通过以下系统之一的氢化硅烷基反应引入聚合物的侧链中的聚合物的折射率的基团：（1）具有碳的化合物（A） - 碳不饱和键和用于改性折射率的基团，以及具有硅氢化物基团的硅氧烷聚合物（B），其中硅氢化物基团与碳 - 碳不饱和键的摩尔比大于1，和（2） 具有氢化硅基的化合物（A'）和用于改性折射率的基团和具有碳 - 碳不饱和键的硅氧烷聚合物（B'），其中碳 - 碳不饱和键与氢化硅的摩尔比 当系统（1）为1时，聚合物通过硅烷聚合物（B）的未反应的硅氢化物基团与具有至少两个碳 - 碳不饱和键的化合物（C）的氢化硅烷基反应而交联， 被使用，或由水溶液 当使用系统（2）时，硅氧烷聚合物（B'）的未反应的碳 - 碳不饱和键与具有至少两个氢化硅基团的化合物（C'）的反应，其折射率容易且精确 改性。

    Flexible membrane material
    7.
    发明授权
    Flexible membrane material 失效
    柔性膜材料

    公开(公告)号：US4594285A

    公开(公告)日：1986-06-10

    申请号：US663538

    申请日：1984-10-22

    申请人： Yoshitaka Osawa ,  Akira Nishimura ,  Junki Morimi ,  Mitsunobu Tobe

    发明人： Yoshitaka Osawa ,  Akira Nishimura ,  Junki Morimi ,  Mitsunobu Tobe

    IPC分类号： B32B25/04 ,  B32B25/10 ,  H01Q1/42 ,  B32B5/16

    CPC分类号： B32B25/04 ,  Y10T428/254 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/27 ,  Y10T428/273 ,  Y10T442/2189

    摘要： A flexible membrane material of good water repellency comprising a base material and a water repellent layer on the base material, wherein the water repellent layer is a thin rubber layer having therein finely divided fluorinated resin grains scattered and rubbed in. This water repellent layer is firmly adhered to the base material and is substantially free from development of cracks during use. Furthermore the water-repellent layer prevents permeation of water and formation of a water layer on the membrane material. The flexible membrane material of the invention is suitable for use in the production of a radome for a satellite communication system, pneumatic membrane structures, or tents.

    摘要翻译： 一种具有良好防水性的柔性膜材料，其在基材上包含基材和防水层，其中防水层是其中分散和摩擦的细碎的氟化树脂颗粒的薄橡胶层。该防水层牢固 粘附到基材上，并且在使用期间基本上没有裂纹的显现。 此外，防水层防止水渗透并在膜材料上形成水层。 本发明的柔性膜材料适用于制造用于卫星通信系统，气动膜结构或帐篷的天线罩。

    Electronic component placement method
    10.
    发明授权
    Electronic component placement method 有权
    电子元件放置方法

    公开(公告)号：US07007377B2

    公开(公告)日：2006-03-07

    申请号：US10781787

    申请日：2004-02-20

    申请人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

    发明人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

    IPC分类号： H05K3/30

    CPC分类号： H05K13/0452 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

    摘要翻译： 公开了一种电子元件贴装机和电子部件配置方法。 旋转芯片取出和传送机构提供的取出和转印头，从进纸器中取出芯片并翻转。 放置头接收翻转的芯片并将其放置在板上。 在取出和传送操作期间捕获在预定心识别位置处的芯片的图像，在此期间，取出和转印头在接收位置将芯片传送到放置头，以便识别该位置。 基于该位置识别结果，通过控制放置头驱动机构来定位芯片和放置头。 此外，取出转印头旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。