摘要:
A rotary type electronic component includes (a) a bearing formed of a cylindrical section and a substrate on which the cylindrical section is situated, (b) a rotary shaft formed of an upper section protruding from the bearing, a mid section journaled by the bearing, and a lower section having a flange with a hole which communicates with a recess formed axially in the shaft, (c) a case coupled with a lower face of the substrate so that the case covers the lower section of the shaft, and on its bottom plate having fixed contacts corresponding to movable contacts, (d) a spring housed in the recess of the shaft and biasing from inner section of the recess toward the bottom plate of the case, and (e) a frictional plate having a hole in the axial direction, engaging with a rim of recess opening, being urged by the spring against the bottom plate of the case, following the rotation of the shaft and yet moving axially and independently of the shaft. This construction allows the downsized component to keep required high torque with smooth tactile feel as well as a long service-life.
摘要:
The disclosed rotary encoder includes contact substrate 31 and movable contact plate 32. Substrate 31 contains three fan-shaped conductive layers 34A, 34B, and 34C on positions having a same distance from the center of substrate 31. On the other hand, movable contact plate 32 retains three elastic contacts 36A, 36B, 36C, and rotates. The three contacts have continuity with each other and disposed at positions with a same distance from the center of substrate 31, spaced at a radial angle of 120°. When contact plate 32 is rotated, any two out of three elastic contacts 36A, 36B, and 36C consecutively contact with any two out of three conductive layers 34A, 34B, and 34C. Through the continuity, an electric signal is led out from terminals 35A, 35B, and 35C.
摘要:
A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several μms.
摘要:
The resin optical component mold includes a first mold and a second mold for defining a cavity for molding a resin optical component having a minutely concavo-convex shaped surface, on which a plurality of minute concave or convex portions in units of submicrons is formed, by injection molding light transmitting resin. A master mold 36 formed of an inorganic oxide layer having a minutely concavo-convex shaped surface 36a, on which a concavo-convex shape complementary to the concavo-convex shape formed on the minutely concavo-convex shaped surface of the resin optical component is formed, is provided on the internal surface of the first mold.
摘要:
A multiple operation switch that provides electric signal in accordance with the angle of tilting an operating rod protruding from the front panel of an electronic apparatus. The switch comprises a lower case provided at the recessed bottom with a lower switching portion formed of a movable contact and a first fixed contact point. A movable contact body is provided with a conductive flange that makes contact, when tilted by the operating rod, in part with at least two of the second fixed contact points disposed on the reverse surface of upper case. Which movable contact body is supported at the conductive flange by a holding member pushed upward by a coil spring provided in the lower case so that it is engaged in a tiltable manner with an upper case. The second fixed contact points and the conductive flange constitute an upper switching portion.
摘要:
A pressure-resistant explosion-proof electric motor (44) is surrounded by a double casing comprised of inner and outer cases with a motor-cooling oil passage (54) formed therebetween. A flange (26) is detachably fitted to the top surface of a tank to hold the electric motor (44) in the tank. A downwardly-extending pipe (28) is at an upper end fixed to the flange and at a lower end connected through a terminal box (30) to the electric motor (44). A centrifugal pump (67) is fixed to the underside of the electric motor (44) to have its rotary shaft connected to the output shaft (60) of the electric motor (44). A motor cover accommodates therein the electric motor and the terminal box (30) in a watertight manner. A protective pipe (71) extends from the flange (26) to the motor cover (69) and accommodates therein the downwardly-extending pipe (28) in a watertight manner. A cooling oil is circulated through the motor-cooling oil passage (54) to cool the electric motor. This water-immersed cargo handling pump is suitable for transferring the liquid in a tank of a vessel.
摘要:
Provided is a capacitive acceleration sensor including a silicon substrate, which includes a movable electrode having a comb shape and a fixed electrode having a comb shape opposed to the comb shape of the movable electrode, and a pair of glass substrates having a concave portion forming a cavity on at least one side thereof, wherein the silicon substrate and the glass substrates are bonded to each other so that the movable electrode and the fixed electrode is disposed in the cavity. Accordingly, it is possible to provide the capacitive acceleration sensor having a small size and high sensitivity.
摘要:
A pressure sensor includes a gold-silicon eutectic crystal layer interposed between the contact layer and the silicon substrate. Because the contact layer and the silicon substrate are electrically connected to each other by using a gold-silicon eutectic reaction at the time of bonding the silicon substrate and the glass substrate, a contact resistance between the contact layer and the silicon substrate can be stabilized, and a Q value of the sensor can be stabilized. In addition, since the contact layer and the silicon substrate are bonded to each other by the gold-silicon eutectic reaction, the bonding strength is sufficient.