Plasma process apparatus
    2.
    发明授权

    公开(公告)号:US06527908B2

    公开(公告)日:2003-03-04

    申请号:US09813147

    申请日:2001-03-21

    IPC分类号: H05H100

    摘要: A plasma process apparatus capable of preventing generation of plasma in an unwanted location and performing uniform plasma processing with stability is obtained. The plasma process apparatus includes a processing chamber having an internal wall surface; a microwave radiating member having one wall surface and the other wall surface that faces the internal wall surface of the processing chamber, and being disposed such that a space is formed between the other wall surface and a portion of the internal wall surface, and propagating and radiating microwaves within the processing chamber; and a reactive gas supply member, including a reactive gas supply passage having a space formed between the other wall surface of the microwave radiating member and the internal wall surface; and a microwave transmission preventing member disposed on a region, which faces the reactive gas supply passage, of the other wall surface of the microwave radiating member.

    Plasma process device
    3.
    发明授权
    Plasma process device 有权
    等离子体处理装置

    公开(公告)号:US06446573B2

    公开(公告)日:2002-09-10

    申请号:US09925572

    申请日:2001-08-09

    IPC分类号: C23C1600

    摘要: A plasma process device capable of forming homogeneous plasma and coping with a large size substrate less costly can be obtained. The plasma process device includes a processing chamber, microwave guiding means, a shower plate and a reaction gas supply passage. The microwave guiding means guides a microwave into the processing chamber. The shower plate has a gas inlet hole to supply to the processing chamber a reaction gas attaining a plasma state by the microwave, and a lower surface facing the processing chamber and an upper surface positioned on the opposite side of the lower surface. The reaction gas supply passage is positioned on the upper surface of the shower plate and supplies the reaction gas to the gas inlet hole. A wall surface of the reaction gas supply passage includes an upper surface of the shower plate and a conductor wall surface opposing the upper surface.

    摘要翻译: 可以获得能够形成均匀等离子体并且应对较大成本的大尺寸基板的等离子体处理装置。 等离子体处理装置包括处理室,微波引导装置,喷淋板和反应气体供应通道。 微波引导装置引导微波进入处理室。 淋浴板具有气体入口孔,以通过微波向处理室供应达到等离子体状态的反应气体,以及面向处理室的下表面和位于下表面相对侧的上表面。 反应气体供给通路位于喷淋板的上表面,将反应气体供给到气体导入孔。 反应气体供给通道的壁面包括淋浴板的上表面和与上表面相对的导体壁表面。

    Plasma process device
    4.
    发明授权
    Plasma process device 有权
    等离子体处理装置

    公开(公告)号:US06286454B1

    公开(公告)日:2001-09-11

    申请号:US09583161

    申请日:2000-05-30

    IPC分类号: C23C1600

    摘要: A plasma process device capable of forming homogeneous plasma and coping with a large size substrate less costly can be obtained. The plasma process device includes a processing chamber, microwave guiding device, a shower plate and a reaction gas supply passage. The microwave guiding device guides a microwave into the processing chamber. The shower plate has a gas inlet hole to supply to the processing chamber a reaction gas attaining a plasma state by the microwave, and a lower surface facing the processing chamber and an upper surface positioned on the opposite side of the lower surface. The reaction gas supply passage is a positioned on the upper surface of the shower plate and supplies the reaction gas to the gas inlet hole. A wall surface of the reaction gas supply passage includes an upper surface of the shower plate and a conductor wall surface opposing the upper surface.

    摘要翻译: 可以获得能够形成均匀等离子体并且应对较大成本的大尺寸基板的等离子体处理装置。 等离子体处理装置包括处理室,微波引导装置,喷淋板和反应气体供给通道。 微波引导装置引导微波进入处理室。 淋浴板具有气体入口孔,以通过微波向处理室供应达到等离子体状态的反应气体,以及面向处理室的下表面和位于下表面相对侧的上表面。 反应气体供给通道位于淋浴板的上表面上,并将反应气体供给到气体入口孔。 反应气体供给通道的壁面包括淋浴板的上表面和与上表面相对的导体壁表面。

    Plasma processing apparatus
    5.
    发明授权
    Plasma processing apparatus 失效
    等离子体处理装置

    公开(公告)号:US06753496B2

    公开(公告)日:2004-06-22

    申请号:US10010383

    申请日:2001-12-07

    IPC分类号: B23K1000

    CPC分类号: B23K10/003 B23K2101/40

    摘要: On one side of a microwave entrance window that is exposed to the atmosphere, a slot plate having slots and a resonant unit are provided. The slot plate and the resonant unit are integrally placed to be slidable by linear guides with respect to a process chamber. In this way, a plasma processing apparatus can be provided that performs a highly uniform plasma process and is excellent in terms of plasma generation property.

    摘要翻译: 在暴露于大气的微波入口窗的一侧,设有具有狭缝的槽板和谐振单元。 槽板和谐振单元整体地放置成可以通过线性导轨相对于处理室滑动。 以这种方式,可以提供执行高度均匀的等离子体处理的等离子体处理装置,并且在等离子体产生性方面是优异的。

    Plasma processing apparatus
    6.
    发明授权
    Plasma processing apparatus 失效
    等离子体处理装置

    公开(公告)号:US06726802B2

    公开(公告)日:2004-04-27

    申请号:US10211498

    申请日:2002-08-02

    IPC分类号: H05H100

    摘要: A plasma processing apparatus includes a slot plate having a slot-formed region for passing microwave from a waveguide to a microwave entrance window, and a slot plate drive unit driving the slot plate to change the position of the slot plate with respect to the microwave entrance window. The slot plate is thus moved with respect to the microwave entrance window to change at least one of the position, number and area of slot openings where the microwave is passed. The plasma processing apparatus accordingly ensures uniform plasma processing even if the process condition significantly changes when films on a large-area substrate or wafer to be processed are made of different materials or a stacked-layer film composed of layers of different materials is to be processed.

    摘要翻译: 等离子体处理装置包括:槽板,其具有用于将微波从波导传递到微波入口窗口的槽形区域;以及槽板驱动单元,其驱动槽板以改变槽板相对于微波入口的位置 窗口。 狭缝板因此相对于微波入口窗移动,以改变微波通过的槽口的位置,数量和面积中的至少一个。 因此,等离子体处理装置即使在待处理的大面积基板或晶片上的膜由不同的材料制成或由不同材料的层构成的叠层膜将被处理时,即使处理条件显着变化,也能确保均匀的等离子体处理 。

    Plasma process apparatus
    7.
    发明授权
    Plasma process apparatus 失效
    等离子体处理装置

    公开(公告)号:US06638392B2

    公开(公告)日:2003-10-28

    申请号:US09730739

    申请日:2000-12-07

    IPC分类号: H05H100

    CPC分类号: H01J37/32192 H01J37/3244

    摘要: A plasma process apparatus includes a dielectric plate to emit plasma inside a chamber, and dielectric plate support members to support a dielectric plate. A plurality of gas introduction holes to supply reaction gas to the chamber interior are provided at the dielectric plate support members. The outlet of the gas introduction hole is open at the side facing the surface of substrate 8, and arranged at a peripheral region outer than dielectric plate 5. Ground potential is applied to a chamber lid and the dielectric plate support members, and bias voltage is applied to the substrate. Accordingly, a low-cost plasma process apparatus that can process uniformly a substrate of a large area using uniform plasma can be obtained.

    摘要翻译: 等离子体处理装置包括在室内发射等离子体的电介质板和用于支撑电介质板的电介质板支撑构件。 在电介质板支撑构件上设置有用于向反应室内部供应反应气体的多个气体导入孔。 气体导入孔的出口在与基板8的表面相对的一侧开口,并布置在电介质板5外侧的周边区域。接地电位施加到室盖和电介质板支撑构件,偏压为 施加到基底。 因此,可以获得能够使用均匀等离子体均匀地处理大面积的基板的低成本等离子体处理装置。

    Plasma process device
    8.
    发明申请
    Plasma process device 审中-公开
    等离子体处理装置

    公开(公告)号:US20060150914A1

    公开(公告)日:2006-07-13

    申请号:US10545355

    申请日:2004-02-20

    IPC分类号: C23C16/00 C23F1/00

    摘要: A plasma processing apparatus includes: a processing chamber; an inlet waveguide having an interior space in which a first standing wave of a microwave is formed by means of resonance; a dielectric within which a second standing wave of the microwave is formed by means of resonance; and a slot antenna having a slot through which the microwave is passed from the interior space to the dielectric. The slot is generally located at a point where the position of a loop in the first standing wave orthogonally projected to the slot antenna coincides with the position of a loop in the second standing wave orthogonally projected to the slot antenna. The present invention provides a plasma processing apparatus that improves the propagation efficiency of a microwave passed through an aperture of the slot antenna, thereby allowing microwave energy to be efficiently introduced into a processing chamber.

    摘要翻译: 一种等离子体处理装置,包括:处理室; 具有通过谐振形成微波的第一驻波的内部空间的入口波导; 通过谐振形成微波的第二驻波的电介质; 以及具有狭槽的缝隙天线,微波从该槽从内部空间通过电介质。 槽通常位于正交投影到缝隙天线的第一驻波中的环的位置与正交投影到缝隙天线的第二驻波中的环的位置重合的点。 本发明提供一种等离子体处理装置,其提高通过缝隙天线的孔径的微波的传播效率,从而使微波能量被有效地引入处理室。

    Plasma process apparatus
    9.
    发明授权
    Plasma process apparatus 失效
    等离子体处理装置

    公开(公告)号:US06620290B2

    公开(公告)日:2003-09-16

    申请号:US09758292

    申请日:2001-01-12

    IPC分类号: H05H100

    CPC分类号: H01J37/32192 C23C16/511

    摘要: A plurality of microwave introduction windows are placed at the top wall of the reaction chamber. Microwaves of the same power are introduced into, e.g., two microwave introduction windows that are equivalent in location relationship with respect to the sidewall of the reaction chamber, while microwaves of different power are introduced into, e.g., two microwave introduction windows that are non-equivalent in location relationship with respect to the sidewall. Thus, a cost-effective plasma process apparatus is obtained which can realize uniform plasma processing even if the plasma being generated within the reaction chamber has varied load impedance.

    摘要翻译: 多个微波引入窗口放置在反应室的顶壁处。 相同功率的微波被引入到例如两个相对于反应室的侧壁的位置关系相等的微波引入窗口中,而不同功率的微波被引入到例如两个微波引入窗口中, 等同于相对于侧壁的位置关系。 因此,即使在反应室内产生的等离子体具有变化的负载阻抗,也可获得能够实现均匀等离子体处理的成本有效的等离子体处理装置。

    Plasma processing apparatus
    10.
    发明授权
    Plasma processing apparatus 失效
    等离子体处理装置

    公开(公告)号:US06783628B2

    公开(公告)日:2004-08-31

    申请号:US10007127

    申请日:2001-12-03

    IPC分类号: H05H100

    CPC分类号: H01J37/32192 H01J37/32211

    摘要: A slot antenna plate is placed on a second dielectric for radiating microwave into a chamber interior, the slot antenna plate being provided on a side of the second dielectric that faces the chamber interior. The slot antenna plate is made of conductor and includes slots for passing the microwave there through to the chamber interior. In this way, a plasma processing apparatus is provided generating plasma by microwave, the plasma processing apparatus capable of easily adjusting ion irradiation energy for a material to be processed to achieve uniform plasma processing for the material within the plane of the material.

    摘要翻译: 槽缝天线板放置在用于将微波辐射到室内部的第二电介质上,缝隙天线板设置在面向腔室内部的第二电介质的一侧上。 缝隙天线板由导体制成,并且包括用于使微波在那里通过腔室内部的槽。 以这种方式,通过微波提供产生等离子体的等离子体处理装置,等离子体处理装置能够容易地调整待处理材料的离子照射能量,以实现材料平面内材料的均匀等离子体处理。