摘要:
A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.
摘要翻译:通过具有由通式(1)表示的结构的化合物的树脂组合物提供热处理后的耐热性和介电常数低的树脂组合物,其清漆和使用该树脂组合物的半导体装置:其中“Ar “是一个芳香族群; “a”为0或1; R 11是具有一个或多个碳原子的有机基团,并且至少一个是具有脂环结构的基团; 当“q”为2以上的整数时,R 11彼此可以相同也可以不同, R 1至R 5中的至少一个和相应苯上的R 6至R 10中的至少一个 环是Ar结合位点或R 11-11结合位点,其它R 1至R 5和R 6结合位点, R 1至R 10各自为氢,具有脂环结构的基团,具有1-10个碳原子的有机基团,羟基或羧基; 当“a”为0时,R 1至R 5和R 6至R 10中的至少一个为至少一个, 是具有脂环结构的基团; “q”为1以上的整数, “X”是-O-,-NHCO-,-COHN-,-COO-和-OCO-中的任何一个。
摘要:
Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.
摘要:
Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.
摘要:
A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.
摘要:
A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.
摘要:
A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.
摘要:
A heater-attached piping having, a cord-like heater disposed along substantially entire length of a nylon tube forming a pipe for transferring a fluid, and at least a heat-retaining layer disposed around the nylon tube and the cord-like heater. The cord-like heater located at the end of the nylon tube may be, for example, folded back and formed in a duplex arrangement. With this arrangement, heat generating at the end of the heater-attached piping increases and is duplicated to result in suppression of power consumption of the cord-like heater to a possible lowest limit, and the heat-retaining ability and defrosting ability in the end of the heater-attached piping can be enhanced.
摘要:
A physiologically active polypeptide derived from human brain and a DNA fragment comprising the base sequence encoding the polypeptide are disclosed. The polypeptide possesses excellent smooth muscle relaxation activity, diuretic or natriuretic activity, and vasodepressor activity, and is thus useful as a medicine for curing circulation diseases, e.g. cardiac edema, nephric edema, hepatic edema, pulmonary edema, hypertension, congestive heat failure, and acute and chronic renal failure.
摘要:
Disclosed herein is a physiologically-active peptide represented by the following general formula (I): ##STR1## wherein X means H or H-Asp-Ser-Gly- and Y denotes -Asn-Val-Leu-Arg-Arg-Tyr-OH, -Asn-Val-Leu-Arg-Arg-OH, -Asn-Val-Leu-Arg-Tyr-OH, -Asn-Val-Leu-Arg-OH, -Asn-Val-Leu-OH or -Asn-Ser-Phe-Arg-Tyr-OH, or a salt thereof.
摘要:
A pure-water pipe for fuel cell has an innermost layer made of fluoro resin or polyolefin resin wherein an entire body of the pipe is made of resin and the pipe has a value of (a total thickness of the pipe)/(a thickness of the innermost layer) in a range of 1.1 to 40. The pure-water pipe further has a layer in the outside of the innermost layer which contains one of polyamide, polyester elastomer and polyolefin elastomer or a layer in the outside of the innermost layer which contains non-plastic polyamide. The pure-water pipe further has a low hydrogen-permeable layer in the outside of the innermost layer. The low hydrogen-permeable layer contains ethylene-vinyl alcohol copolymer, polymethaxyleneadipamide, or polybutylene naphthalate.