Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same
    1.
    发明申请
    Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same 失效
    树脂组合物,聚酰亚胺树脂组合物,聚苯并恶唑树脂组合物,清漆,树脂膜和使用其的半导体装置

    公开(公告)号:US20080255335A1

    公开(公告)日:2008-10-16

    申请号:US11663854

    申请日:2005-09-29

    IPC分类号: C08G65/40

    摘要: A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

    摘要翻译: 通过具有由通式(1)表示的结构的化合物的树脂组合物提供热处理后的耐热性和介电常数低的树脂组合物,其清漆和使用该树脂组合物的半导体装置:其中“Ar “是一个芳香族群; “a”为0或1; R 11是具有一个或多个碳原子的有机基团,并且至少一个是具有脂环结构的基团; 当“q”为2以上的整数时,R 11彼此可以相同也可以不同, R 1至R 5中的至少一个和相应苯上的R 6至R 10中的至少一个 环是Ar结合位点或R 11-11结合位点,其它R 1至R 5和R 6结合位点, R 1至R 10各自为氢,具有脂环结构的基团,具有1-10个碳原子的有机基团,羟基或羧基; 当“a”为0时,R 1至R 5和R 6至R 10中的至少一个为至少一个, 是具有脂环结构的基团; “q”为1以上的整数, “X”是-O-,-NHCO-,-COHN-,-COO-和-OCO-中的任何一个。

    Resin composition, varnish, resin film and semiconductor device
    2.
    发明授权
    Resin composition, varnish, resin film and semiconductor device 失效
    树脂组合物,清漆,树脂膜和半导体器件

    公开(公告)号:US08178631B2

    公开(公告)日:2012-05-15

    申请号:US11992136

    申请日:2006-09-21

    IPC分类号: C08G73/06 C08G73/22

    摘要: Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

    摘要翻译: 公开了一种树脂组合物,其包含具有通过使二氨基苯酚化合物和二羧酸化合物反应获得的第一重复单元的苯并恶唑树脂前体和交联剂,其中至少一种双氨基苯酚化合物和二羧酸化合物具有金刚石结构 。 苯并恶唑树脂前体还包含通过使不具有类金刚石结构的二氨基苯酚化合物与不具有金刚石结构的二羧酸化合物反应获得的第二重复单元。 还公开了包含树脂组合物的树脂膜。

    Benzoxazole resin precursor, polybenzoxazole resin, resin film and semiconductor device
    4.
    发明授权
    Benzoxazole resin precursor, polybenzoxazole resin, resin film and semiconductor device 失效
    苯并恶唑树脂前体,聚苯并恶唑树脂,树脂膜和半导体器件

    公开(公告)号:US08337982B2

    公开(公告)日:2012-12-25

    申请号:US11722625

    申请日:2005-06-20

    IPC分类号: C08G73/22

    摘要: A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

    摘要翻译: 一种苯并恶唑树脂前体,其包含通过双氨基苯酚化合物和二羧酸化合物的反应获得的第一重复单元,其中至少一个具有金刚石结构; 进一步包含通过不具有金刚石结构的二氨基苯酚化合物与不具有类金刚石结构的二羧酸化合物的反应获得的第二重复单元的苯并恶唑树脂前体; 通过脱水上述苯并恶唑树脂前体进行闭环反应得到的聚苯并恶唑树脂; 由苯并恶唑树脂前体或聚苯并恶唑树脂构成的树脂膜。 可以从苯并恶唑树脂前体获得聚苯并恶唑树脂和具有优异的耐热性和小介电常数的树脂膜和使用树脂膜的半导体器件。

    Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same
    5.
    发明授权
    Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same 失效
    树脂组合物,聚酰亚胺树脂组合物,聚苯并恶唑树脂组合物,清漆,树脂膜和使用其的半导体器件

    公开(公告)号:US07652125B2

    公开(公告)日:2010-01-26

    申请号:US11663854

    申请日:2005-09-29

    IPC分类号: C08G65/40 C08G65/38

    摘要: A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

    摘要翻译: 通过具有由通式(1)表示的结构的化合物的树脂组合物提供热处理后的耐热性和介电常数低的树脂组合物,其清漆和使用该树脂组合物的半导体装置:其中“Ar “是一个芳香族群; “a”为0或1; R11是具有一个或多个碳原子的有机基团,并且至少一个是具有脂环结构的基团; 当“q”为2以上的整数时,R 11可以相同也可以不同, R 1〜R 5中的至少一个和各苯环上的R 6〜R 10中的至少一个为Ar结合位点或R 11结合位点,其中R 1〜R 5,R 6〜R 10为氢,具有脂环结构 具有1-10个碳原子的有机基团,羟基或羧基; 当“a”为0时,R 1至R 5和R 6至R 10中的至少一个为具有脂环结构的基团; “q”为1以上的整数, “X”是-O-,-NHCO-,-COHN-,-COO-和-OCO-中的任何一个。

    Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device
    6.
    发明申请
    Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device 失效
    苯并恶唑树脂前体,聚苯并恶唑树脂,树脂膜和半导体器件

    公开(公告)号:US20080206548A1

    公开(公告)日:2008-08-28

    申请号:US11722625

    申请日:2005-06-20

    IPC分类号: B32B27/00 C08G73/22

    摘要: A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

    摘要翻译: 一种苯并恶唑树脂前体,其包含通过双氨基苯酚化合物和二羧酸化合物的反应获得的第一重复单元,其中至少一个具有金刚石结构; 进一步包含通过不具有金刚石结构的二氨基苯酚化合物与不具有类金刚石结构的二羧酸化合物的反应获得的第二重复单元的苯并恶唑树脂前体; 通过脱水上述苯并恶唑树脂前体进行闭环反应得到的聚苯并恶唑树脂; 由苯并恶唑树脂前体或聚苯并恶唑树脂构成的树脂膜。 可以从苯并恶唑树脂前体获得聚苯并恶唑树脂和具有优异的耐热性和小介电常数的树脂膜和使用树脂膜的半导体器件。

    Piping with heater and connecting method of the piping
    7.
    发明申请
    Piping with heater and connecting method of the piping 审中-公开
    配管加热器和管道连接方式

    公开(公告)号:US20080041841A1

    公开(公告)日:2008-02-21

    申请号:US11498126

    申请日:2006-08-03

    IPC分类号: H05B3/58

    CPC分类号: H05B3/58

    摘要: A heater-attached piping having, a cord-like heater disposed along substantially entire length of a nylon tube forming a pipe for transferring a fluid, and at least a heat-retaining layer disposed around the nylon tube and the cord-like heater. The cord-like heater located at the end of the nylon tube may be, for example, folded back and formed in a duplex arrangement. With this arrangement, heat generating at the end of the heater-attached piping increases and is duplicated to result in suppression of power consumption of the cord-like heater to a possible lowest limit, and the heat-retaining ability and defrosting ability in the end of the heater-attached piping can be enhanced.

    摘要翻译: 一种加热器连接的管道,具有沿着形成用于传送流体的管的尼龙管的大致整个长度设置的绳状加热器,以及至少设置在尼龙管和绳状加热器周围的保温层。 位于尼龙管端部的线状加热器可以例如折叠并形成为双面布置。 通过这种布置,在加热器附接管道的端部产生的热量增加并重复,从而将线状加热器的功率消耗抑制到可能的最低限度,并且最终的保温能力和除霜能力 的加热器附接管道可以增强。

    Pure-water pipe for fuel cell
    10.
    发明申请
    Pure-water pipe for fuel cell 审中-公开
    燃料电池纯水管

    公开(公告)号:US20050087249A1

    公开(公告)日:2005-04-28

    申请号:US10973120

    申请日:2004-10-25

    CPC分类号: F16L9/123 Y10T428/1393

    摘要: A pure-water pipe for fuel cell has an innermost layer made of fluoro resin or polyolefin resin wherein an entire body of the pipe is made of resin and the pipe has a value of (a total thickness of the pipe)/(a thickness of the innermost layer) in a range of 1.1 to 40. The pure-water pipe further has a layer in the outside of the innermost layer which contains one of polyamide, polyester elastomer and polyolefin elastomer or a layer in the outside of the innermost layer which contains non-plastic polyamide. The pure-water pipe further has a low hydrogen-permeable layer in the outside of the innermost layer. The low hydrogen-permeable layer contains ethylene-vinyl alcohol copolymer, polymethaxyleneadipamide, or polybutylene naphthalate.

    摘要翻译: 用于燃料电池的纯水管具有由氟树脂或聚烯烃树脂制成的最内层,其中管的整体由树脂制成,并且管具有(管的总厚度)的值/(管的总厚度)/ 最内层)在1.1至40的范围内。纯水管还在最内层的外侧具有包含聚酰胺,聚酯弹性体和聚烯烃弹性体中的一个或最内层的外层的层, 含有非塑性聚酰胺。 纯水管在最内层的外侧还具有低透氢性层。 低氢渗透层含有乙烯 - 乙烯醇共聚物,聚甲基己二酰胺或聚萘二甲酸丁二醇酯。