摘要:
A semiconductor device allowing simplification of a fabrication process is provided. This semiconductor device comprises a first insulator film, consisting of a single material, formed to be in contact with the upper surface of a semiconductor chip including a circuit, a first wire formed to be in contact with the upper surface of the first insulator film and a second wire formed to extend along the side surface and the lower surface of the semiconductor chip and connected to the lower surface of the first wire exposed by partially removing the first insulator film.
摘要:
A semiconductor device allowing simplification of a fabrication process is provided. This semiconductor device comprises a first insulator film, consisting of a single material, formed to be in contact with the upper surface of a semiconductor chip including a circuit, a first wire formed to be in contact with the upper surface of the first insulator film and a second wire formed to extend along the side surface and the lower surface of the semiconductor chip and connected to the lower surface of the first wire exposed by partially removing the first insulator film.
摘要:
A solid-state image pickup device improvable in photosensitivity also in the vicinity of an end of a substrate is provided. This solid-state image pickup device comprises a photodetection part formed on a substrate, a color filter layer and a lens, formed between the substrate and the color filter for condensing light on the photodetection part, having a lens center deviated from the center of the photodetection part by a prescribed distance.
摘要:
A solid-state imaging device capable of suppressing deterioration of the image quality is provided. This solid-state imaging device comprises a substrate provided with a photodetection area, a color filter layer formed above the photodetection area and a lens formed between the substrate and the color filter layer for condensing light on the photodetection area. The lens has a substantially flat upper surface portion, and the ratio (w/t) of the width w of the substantially flat upper surface portion of the lens to the thickness t of the lens is not more than about 0.86.
摘要:
A solid-state image pickup device improvable in photosensitivity also in the vicinity of an end of a substrate is provided. This solid-state image pickup device comprises a photodetection part formed on a substrate, a color filter layer and a lens, formed between the substrate and the color filter for condensing light on the photodetection part, having a lens center deviated from the center of the photodetection part by a prescribed distance.
摘要:
A solid-state imaging apparatus allowing miniaturization in a structure having a lens provided between a substrate and a color filter layer is provided. This solid-state imaging apparatus comprises a photodetection part formed on the substrate, the color filter layer formed on the substrate and the lens formed between the substrate and the color filter layer for concentrating light on the photodetection part. The lens has an upwardly projecting upper surface portion, while the upper end of the upper surface portion substantially comes into contact with the lower surface of the color filter layer.
摘要:
A solid-state imaging apparatus allowing miniaturization in a structure having a lens provided between a substrate and a color filter layer is provided. This solid-state imaging apparatus comprises a photodetection part formed on the substrate, the color filter layer formed on the substrate and the lens formed between the substrate and the color filter layer for concentrating light on the photodetection part. The lens has an upwardly projecting upper surface portion, while the upper end of the upper surface portion substantially comes into contact with the lower surface of the color filter layer.
摘要:
A solid-state image sensor capable of suppressing color mixture while suppressing increase of load capacitances of transfer gates and a short circuit between two adjacent transfer gates is provided. This solid-state image sensor comprises a plurality of transfer gates and a shielding material line blocking light incident from above a prescribed pixel upon another pixel adjacent to the prescribed pixel. The shielding material line has a downward projecting portion on a region corresponding to at least one transfer gate entering an ON-state in photoreception.
摘要:
This image sensor is so formed as to control at least either the potential of a portion of a transfer channel corresponding to a third electrode or the potential of another portion of the transfer channel corresponding to a fourth electrode to be lower than the potentials of portions of the transfer channel corresponding to a first electrode and a second electrode respectively in a signal charge transferring operation and a signal charge increasing operation.
摘要:
An image sensor includes a charge storage portion for storing and transferring signal charges, a first electrode for forming an electric field storing the signal charges in the charge storage portion, a charge increasing portion for increasing the signal charges stored in the charge storage portion and a second electrode for forming another electric field increasing the signal charges in the charge increasing portion, wherein the quantity of the signal charges storable in the charge storage portion is not less than the quantity of the signal charges storable in the charge increasing portion.