公开(公告)号：US07967495B2

公开(公告)日：2011-06-28

申请号：US12003097

申请日：2007-12-20

申请人： Takayuki Kamiya ,  Yasuyuki Higuchi ,  Kazuo Takeda ,  Chiharu Totani ,  Tatsuya Oba ,  Shuji Inui

发明人： Takayuki Kamiya ,  Yasuyuki Higuchi ,  Kazuo Takeda ,  Chiharu Totani ,  Tatsuya Oba ,  Shuji Inui

IPC分类号： F21V7/04

CPC分类号： B60Q1/323 ,  B60Q3/217

摘要： Luminous surfaces 25 of a concave-convex shape are formed on a light guide member 2 of a scuff plate, and a screen member 4 made of a non-transparent material is disposed between the light guide member 2 and a wire harness 31 of the scuff plate. The light guide member 2 luminously displays a design in a three-dimensional manner, and also the wire harness 31 will not be visually recognized through the light guide member 2, and therefore the design is enhanced.

摘要翻译： 在刮板的导光部件2上形成有凹凸形状的发光面25，在导光部件2和磨损线束31之间设置由不透明材料构成的丝网部件4 盘子。 导光构件2以三维方式显示出设计，并且线束31将不会通过导光构件2被视觉识别，因此增强了设计。

公开(公告)号：US20080170405A1

公开(公告)日：2008-07-17

申请号：US12003097

申请日：2007-12-20

申请人： Takayuki Kamiya ,  Yasuyuki Higuchi ,  Kazuo Takeda ,  Chiharu Totani ,  Tatsuya Oba ,  Shuji Inui

发明人： Takayuki Kamiya ,  Yasuyuki Higuchi ,  Kazuo Takeda ,  Chiharu Totani ,  Tatsuya Oba ,  Shuji Inui

IPC分类号： B60Q1/32

CPC分类号： B60Q1/323 ,  B60Q3/217

摘要： Luminous surfaces 25 of a concave-convex shape are formed on a light guide member 2 of a scuff plate, and a screen member 4 made of a non-transparent material is disposed between the light guide member 2 and a wire harness 31 of the scuff plate. The light guide member 2 luminously displays a design in a three-dimensional manner, and also the wire harness 31 will not be visually recognized through the light guide member 2, and therefore the design is enhanced.

摘要翻译： 在刮板的导光部件2上形成有凹凸形状的发光面25，在导光部件2和磨损线束31之间配置有由不透明材料构成的丝网部件4 盘子。 导光构件2以三维方式显示出设计，并且线束31将不会通过导光构件2被视觉识别，因此增强了设计。

公开(公告)号：US07931295B2

公开(公告)日：2011-04-26

申请号：US12588319

申请日：2009-10-13

申请人： Shuji Inui ,  Yu Hishida ,  Yasuyuki Higuchi ,  Hikaru Ando

发明人： Shuji Inui ,  Yu Hishida ,  Yasuyuki Higuchi ,  Hikaru Ando

IPC分类号： B60R21/20

CPC分类号： B60R21/215 ,  B60R13/025 ,  B60R13/0275 ,  B60R21/213 ,  B60R2021/161

摘要： A garnish includes a garnish body which covers a folded air bag and a locking portion which is inserted to be locked in a mounting hole in a mounting base on a vehicle body. The locking portion holds the garnish body which is pressed by the air bag when the air bag is inflated to move so as to form a projecting space for the air bag. The locking portion includes a locking main body portion which is inserted to be locked in the mounting hole and a connecting piece portion. The connecting piece portion includes a locking base portion on which the locking main body portion is provided, connecting portions which are connected to a rear surface of the garnish body, and deformable portions lying between the locking base portion and the connecting portions and is molded integrally with the garnish body. The deformable portions deform to extend a distance between the locking base portion and the connecting portion when the garnish body moves towards a vehicle interior side.

摘要翻译： 装饰品包括覆盖折叠气囊的装饰体和插入以锁定在车身上的安装基座中的安装孔中的锁定部。 当气囊被充气移动时，锁定部分保持由气囊按压的装饰体，以形成用于气囊的突出空间。 锁定部分包括被插入以锁定在安装孔中的锁定主体部分和连接件部分。 连接片部分包括锁定基体部分，锁定主体部分设置在该基部上，连接部分连接到装饰体的后表面，并且可变形部分位于锁定基部和连接部分之间， 与装饰的身体。 当装饰主体朝向车辆内侧移动时，可变形部分变形以在锁定基部和连接部分之间延伸一定距离。

公开(公告)号：US20100109300A1

公开(公告)日：2010-05-06

申请号：US12588319

申请日：2009-10-13

申请人： Shuji Inui ,  Yu Hishida ,  Yasuyuki Higuchi ,  Hikaru Ando

发明人： Shuji Inui ,  Yu Hishida ,  Yasuyuki Higuchi ,  Hikaru Ando

IPC分类号： B60R21/20

CPC分类号： B60R21/215 ,  B60R13/025 ,  B60R13/0275 ,  B60R21/213 ,  B60R2021/161

摘要： A garnish includes a garnish body which covers a folded air bag and a locking portion which is inserted to be locked in a mounting hole in a mounting base on a vehicle body. The locking portion holds the garnish body which is pressed by the air bag when the air bag is inflated to move so as to form a projecting space for the air bag.The locking portion includes a locking main body portion which is inserted to be locked in the mounting hole and a connecting piece portion. The connecting piece portion includes a locking base portion on which the locking main body portion is provided, connecting portions which are connected to a rear surface of the garnish body, and deformable portions lying between the locking base portion and the connecting portions and is molded integrally with the garnish body. The deformable portions deform to extend a distance between the locking base portion and the connecting portion when the garnish body moves towards a vehicle interior side.

摘要翻译： 装饰品包括覆盖折叠气囊的装饰体和插入以锁定在车身上的安装基座中的安装孔中的锁定部。 当气囊被充气移动时，锁定部分保持由气囊按压的装饰体，以形成用于气囊的突出空间。 锁定部分包括被插入以锁定在安装孔中的锁定主体部分和连接件部分。 连接片部分包括锁定基体部分，锁定主体部分设置在该基部上，连接部分连接到装饰体的后表面，并且可变形部分位于锁定基部和连接部分之间， 与装饰的身体。 当装饰主体朝向车辆内侧移动时，可变形部分变形以在锁定基部和连接部分之间延伸一定距离。

公开(公告)号：US5666009A

公开(公告)日：1997-09-09

申请号：US661144

申请日：1996-06-10

申请人： Hiroshi Kumano ,  Yasuyuki Higuchi

发明人： Hiroshi Kumano ,  Yasuyuki Higuchi

IPC分类号： H01L21/60 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/48 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48456 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181

摘要： In a transistor of a structure where a bonding pad formed on the surface of a chip and an end portion of a lead terminal are connected by a bonding wire, by forming the bonding pad to be long and narrow so that its length is parallel to a straight line between the bonding pad and the terminal end. The bonding pad and the terminal end are connected along the shortest line The width of the bonding pad is reduced to a minimum.

摘要翻译： 在通过接合线将形成在芯片的表面上的接合焊盘与引线端子的端部连接的结构的晶体管中，通过将焊盘形成为长而窄，使其长度平行于 焊盘和终端之间的直线。 接合焊盘和端子沿着最短的线连接。焊盘的宽度减小到最小。

公开(公告)号：US08522319B2

公开(公告)日：2013-08-27

申请号：US13019025

申请日：2011-02-01

申请人： Yasuyuki Higuchi

发明人： Yasuyuki Higuchi

IPC分类号： G06F21/00

CPC分类号： G06Q10/10

摘要： A computer readable medium storing a program causing a computer to execute a process is provided. The process includes obtaining note content information representing note content included in a note if the note has been input to registered information; obtaining user specification information for specifying a user who has input the note; causing the note content information and the user specification information to be stored in a memory in association with the registered information; and outputting at least one of the registered information, and the note content information and the user specification information stored in the memory to a user as a request source, and not outputting at least the user specification information if the user as the request source is different from the user who has input the note, in response to a request for outputting information from the user as the request source.

摘要翻译： 提供了存储使计算机执行处理的程序的计算机可读介质。 该过程包括：如果该笔记已被输入到注册信息，则获取表示包含在笔记中的音符内容的音符内容信息; 获取用户指定信息，用于指定输入该笔记的用户; 使得音符内容信息和用户指定信息与登记信息相关联地存储在存储器中; 并且将作为请求源的用户存储在存储器中的登记信息，音符内容信息和用户指定信息中的至少一个作为请求源输出，并且如果作为请求源的用户不同，则至少不输出用户指定信息 响应于从用户输出作为请求源的信息的请求，输入了该笔记的用户。

公开(公告)号：US5407857A

公开(公告)日：1995-04-18

申请号：US170896

申请日：1993-12-21

申请人： Yasuyuki Higuchi

发明人： Yasuyuki Higuchi

IPC分类号： H01L21/225 ,  H01L29/417 ,  H01L29/73 ,  H01L21/22

CPC分类号： H01L29/41708 ,  H01L21/2257 ,  H01L29/7304

摘要： There is provided a semiconductor device wherein a resistor layer is interposed between a semiconductor region and a surface electrode metal so as to improve a safe operation area of the device and enhance the secondary breakdown strength thereof, and a method for producing such a semiconductor device including steps of forming a n-type semiconductor region and/or a p-type semiconductor region in a semiconductor substrate by impurity doping; forming contact holes in a protective film formed on the semiconductor substrate; forming polysilicon electrode films on the semiconductor regions exposed in the contact holes, respectively; making respective impurities of the semiconductor regions diffuse into the polysilicon electrode films by a heat treatment; and forming a surface electrode metal on the polysilicon electrode films.

摘要翻译： 提供了一种半导体器件，其中在半导体区域和表面电极金属之间插入电阻层，以改善器件的安全操作区域并提高其二次击穿强度;以及制造这种半导体器件的方法，包括 通过杂质掺杂在半导体衬底中形成n型半导体区域和/或p型半导体区域的步骤; 在形成在半导体衬底上的保护膜中形成接触孔; 在暴露在接触孔中的半导体区域上分别形成多晶硅电极膜; 通过热处理使半导体区域的各个杂质扩散到多晶硅电极膜中; 以及在所述多晶硅电极膜上形成表面电极金属。