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    Solder alloy, solder ball and electronic member having solder bump
    1.
    发明授权
    Solder alloy, solder ball and electronic member having solder bump 失效
    焊锡合金，焊球和具有焊锡凸块的电子部件

    公开(公告)号：US08501088B2

    公开(公告)日：2013-08-06

    申请号：US12345942

    申请日：2008-12-30

    申请人： Takayuki Kobayashi ,  Tsutomu Sasaki ,  Masamoto Tanaka ,  Katsuichi Kimura

    发明人： Takayuki Kobayashi ,  Tsutomu Sasaki ,  Masamoto Tanaka ,  Katsuichi Kimura

    IPC分类号： C22C13/00

    CPC分类号： B23K35/262 ,  B23K2101/36 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3463

    摘要： To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.

    摘要翻译： 为了提供用于焊料合金的熔融温度低于250℃的焊料合金，焊球和具有用于与母板等连接的焊料凸块的电子部件，实现高的耐跌落冲击强度 在移动设备等中需要。 使用焊料合金，其由不低于0.1质量ppm的硼和不大于200质量ppm的硼组成，剩余部分包含基本上不小于40质量％的Sn，其中其熔化温度低于250℃ C。

    LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP
    3.
    发明申请
    LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP 审中-公开
    无铅焊接合金，焊枪和电子元件，包括焊锡膏

    公开(公告)号：US20120038042A1

    公开(公告)日：2012-02-16

    申请号：US13264625

    申请日：2010-04-12

    申请人： Tsutomu Sasaki ,  Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

    发明人： Tsutomu Sasaki ,  Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

    IPC分类号： H01L23/498 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  C22C13/00

    CPC分类号： H05K3/3463 ,  B23K35/262 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  H01L2924/0002 ,  H05K3/3436 ,  H01L2924/00

    摘要： A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.

    摘要翻译： 一种无铅焊料合金，焊球和包括焊料凸块的电子部件，其能够防止在焊接之后在焊料表面上发生黄色变色，在焊料形成之后的焊料凸块的表面 BGA，以及在BGA的老化测试之后的焊料凸块的表面。 具体公开的是：无铅焊料合金; 焊球; 以及包含焊料凸块的电子部件，其含有选自Li，Na，K，Ca，Be，Mg，Sc，Y，镧系元素中的至少一种添加元素，Ti，Zr，Hf，Nb，Ta，Mo，Zn ，Al，Ga，In，Si和Mn，总量为1质量ppm〜0.1质量％，余量为Sn的40质量％以上。

    LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER
    4.
    发明申请
    LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER 有权
    无铅焊接合金，焊球和电子部件，以及无铅焊接合金，焊球和电子部件，用于汽车安装电子部件

    公开(公告)号：US20090304545A1

    公开(公告)日：2009-12-10

    申请号：US12281430

    申请日：2007-03-08

    申请人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

    发明人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

    IPC分类号： C22C13/02 ,  C22C13/00

    CPC分类号： C22C13/00 ,  B23K35/26 ,  B23K35/262 ,  H05K3/3463

    摘要： A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.

    摘要翻译： 在耐冲击性和抗振性方面表现出良好性能的无铅焊料合金。 还提供了使用这种无铅焊料合金的焊球，以及使用这种无铅合金的具有焊锡凸块的电子部件。 具体地说，无铅焊料合金由1.0〜2.0质量％的Ag，0.3〜1.0质量％的Cu，0.005〜0.1质量％的Ni组成，余量包含Sn和不可避免的杂质。 在Cu电极上的Sn-Ag-Cu基焊料部中，在Cu电极上直接形成Cu 3 Sn金属间化合物层，然后在其上形成Cu6Sn5金属间化合物层。 Cu6Sn5金属间化合物层中的Cu原子位置被原子半径小于Cu的Ni代替，从而减小Cu6Sn5金属间化合物层的应变，从而可以提高耐冲击性和抗振性。

    Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
    5.
    发明授权
    Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member 有权
    无铅焊料合金，焊球和电子部件，无铅焊料合金，焊球和汽车电子部件用电子部件

    公开(公告)号：US08562906B2

    公开(公告)日：2013-10-22

    申请号：US12281430

    申请日：2007-03-08

    申请人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

    发明人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

    IPC分类号： C22C13/00 ,  C22C13/02

    CPC分类号： C22C13/00 ,  B23K35/26 ,  B23K35/262 ,  H05K3/3463

    摘要： A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.

    摘要翻译： 在耐冲击性和抗振性方面表现出良好性能的无铅焊料合金。 还提供了使用这种无铅焊料合金的焊球，以及使用这种无铅合金的具有焊锡凸块的电子部件。 具体地说，无铅焊料合金由1.0〜2.0质量％的Ag，0.3〜1.0质量％的Cu，0.005〜0.1质量％的Ni组成，余量包含Sn和不可避免的杂质。 在Cu电极上的Sn-Ag-Cu基焊料部中，在Cu电极上直接形成Cu 3 Sn金属间化合物层，然后在其上形成Cu6Sn5金属间化合物层。 Cu6Sn5金属间化合物层中的Cu原子位置被原子半径小于Cu的Ni代替，从而减小Cu6Sn5金属间化合物层的应变，从而可以提高耐冲击性和抗振性。

    Image forming apparatus
    6.
    发明授权
    Image forming apparatus 有权
    图像形成装置

    公开(公告)号：US08998379B2

    公开(公告)日：2015-04-07

    申请号：US12486109

    申请日：2009-06-17

    申请人： Masashi Ohnishi ,  Junji Seto ,  Tsutomu Sasaki

    发明人： Masashi Ohnishi ,  Junji Seto ,  Tsutomu Sasaki

    IPC分类号： B41J2/165 ,  B41J2/17

    CPC分类号： B41J2/16523 ,  B41J2/1721 ,  B41J2002/1728

    摘要： An image forming apparatus prevents the problem of reduced utilization efficiency of a waste fluid tank caused by the storage of waste fluids with high and low viscosities in the same open-type waste fluid tank. The image forming apparatus includes a first waste fluid tank for storing waste ink fluid ejected from a recording head, and a second waste fluid tank for storing waste ink fluid ejected into a cap of the recording head. The waste ink fluid ejected into the cap is guided to the second waste fluid tank via a tube. The second waste fluid tank is an airtight structure having an inlet at one end to which the tube is detachably connected via a needle or a valve. At the other end of the second waste fluid tank, there is disposed an opening communicating the inside and the outside of the tank.

    摘要翻译： 图像形成装置防止在相同的开放型废液箱中存储具有高和低粘度的废液的废液槽的利用效率降低的问题。 图像形成装置包括用于存储从记录头喷出的废墨液的第一废液槽和用于存储喷射到记录头的盖中的废墨液的第二废液箱。 喷射到盖中的废墨液通过管被引导到第二废液箱。 第二废液箱是气密结构，其一端具有入口，管可通过针或阀可拆卸地连接。 在第二废液箱的另一端，设置有连通罐体内外的开口。

    Image forming apparatus and image forming method
    7.
    发明授权
    Image forming apparatus and image forming method 失效
    图像形成装置及图像形成方法

    公开(公告)号：US08693908B2

    公开(公告)日：2014-04-08

    申请号：US13351787

    申请日：2012-01-17

    申请人： Kazuhiro Nishiyama ,  Akihiro Gomi ,  Tsutomu Sasaki ,  Naotaka Higuchi

    发明人： Kazuhiro Nishiyama ,  Akihiro Gomi ,  Tsutomu Sasaki ,  Naotaka Higuchi

    IPC分类号： G03G15/10

    CPC分类号： G03G15/11 ,  G03G15/104 ,  G03G21/0088

    摘要： An image forming apparatus of the invention includes; a cleaning member that collects liquid developer by cleaning a developer carrier; a first transporting path that moves the liquid developer collected by the cleaning member; an oscillating member that applies vibration to the liquid developer transported from the first transporting path; a developer supply unit that stores the liquid developer transported from a first transporting mechanism; a second transporting mechanism that includes a second transporting path that transports the liquid developer stored in the developer supply unit to a developer storage in a developing unit; and a control unit that adjusts a toner charge current applied to the toner charging unit and controls vibration applied to the oscillating member on the basis of the adjusted toner charge current.

    摘要翻译： 本发明的图像形成装置包括： 清洁构件，其通过清洁显影剂载体收集液体显影剂; 第一传送路径，其移动由清洁部件收集的液体显影剂; 摆动构件，其对从第一输送路径输送的液体显影剂施加振动; 显影剂供应单元，其存储从第一输送机构输送的液体显影剂; 第二输送机构，其包括将存储在显影剂供应单元中的液体显影剂输送到显影单元中的显影剂储存器的第二输送路径; 以及控制单元，其调节施加到调色剂充电单元的调色剂充电电流，并且基于经调节的调色剂充电电流来控制施加到振荡构件的振动。

    Cleaning apparatus and image forming apparatus
    8.
    发明授权
    Cleaning apparatus and image forming apparatus 失效
    清洁装置和图像形成装置

    公开(公告)号：US08611776B2

    公开(公告)日：2013-12-17

    申请号：US13090295

    申请日：2011-04-20

    申请人： Itaru Kozuma ,  Tomoyuki Shiiya ,  Tsutomu Sasaki

    发明人： Itaru Kozuma ,  Tomoyuki Shiiya ,  Tsutomu Sasaki

    IPC分类号： G03G15/00

    CPC分类号： G03G15/161 ,  G03G21/0076 ,  G03G2221/001

    摘要： A cleaning apparatus includes a first cleaning roller, and a second cleaning roller. The first cleaning roller is contrived to contact to a circumferential surface against a moving member to be cleaned and to apply a bias to the member to be cleaned while rotating such that the circumferential surface of the first cleaning roller moves in a same direction as the member to be cleaned moves. The second cleaning roller is contrived to contact to the member to be cleaned after the member has been cleaned by the first cleaning roller and to rotate such that a circumferential surface of the second cleaning roller moves in a direction opposite a direction in which the member being cleaned moves.

    摘要翻译： 清洁装置包括第一清洁辊和第二清洁辊。 第一清洁辊被设计成抵靠要被清洁的移动构件的圆周表面接触，并且在旋转的同时向待清洁的构件施加偏压，使得第一清洁辊的圆周表面沿与构件相同的方向移动 被清洗移动。 第二清洁辊被设计成在构件被第一清洁辊清洁之后与待清洁的构件接触并旋转，使得第二清洁辊的圆周表面沿着与构件成为 清洁的动作。

    Electronic supporting system for musicians and musical instrument equipped with the same
    10.
    发明授权
    Electronic supporting system for musicians and musical instrument equipped with the same 失效
    电子支持系统为音乐家和乐器配备相同

    公开(公告)号：US08350142B2

    公开(公告)日：2013-01-08

    申请号：US12767281

    申请日：2010-04-26

    申请人： Yuji Fujiwara ,  Tsutomu Sasaki

    发明人： Yuji Fujiwara ,  Tsutomu Sasaki

    IPC分类号： G10H1/00

    CPC分类号： G10H1/0016 ,  G10F1/02 ,  G10H1/0066 ,  G10H2230/011

    摘要： An automatic player piano is equipped with an electronic supporting system, which makes a player learn an optimum pedal stroke to a half pedal region; while the player is practicing a music tune on the piano, the electronic supporting system monitors the damper pedal; when the player starts to depress the damper pedal, the electronic supporting system exerts an assisting force on the damper pedal so as to make the player feel the damper pedal light; when the damper pedal reaches an entrance of the half pedal region, the electronic supporting system removes the assisting force from the damper pedal so that the player feels the damper pedal heavy, whereby the player learns the pedal stroke to the half pedal region through the change of load borne by the player.

    摘要翻译： 自动演奏器钢琴配有电子支撑系统，使玩家学习到一个半踏板区域的最佳踏板行程; 当玩家正在钢琴上练习音乐曲线时，电子支撑系统监视制音踏板; 当玩家开始按压减震踏板时，电子支撑系统对减震踏板施加辅助力，使玩家感觉到制动踏板亮; 当阻尼器踏板到达半踏板区域的入口时，电子支撑系统从减震踏板移除辅助力，使得玩家感觉到减震踏板变重，由此玩家通过改变来学习踏板行程到半踏板区域 的负载由玩家承担。