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公开(公告)号：US08501088B2
公开(公告)日：2013-08-06
申请号：US12345942
申请日：2008-12-30
IPC分类号： C22C13/00
CPC分类号： B23K35/262 , B23K2101/36 , C22C13/00 , C22C13/02 , H05K3/3463
摘要： To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.
摘要翻译： 为了提供用于焊料合金的熔融温度低于250℃的焊料合金，焊球和具有用于与母板等连接的焊料凸块的电子部件，实现高的耐跌落冲击强度 在移动设备等中需要。 使用焊料合金，其由不低于0.1质量ppm的硼和不大于200质量ppm的硼组成，剩余部分包含基本上不小于40质量％的Sn，其中其熔化温度低于250℃ C。
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公开(公告)号：US20090196789A1
公开(公告)日：2009-08-06
申请号：US12345942
申请日：2008-12-30
CPC分类号： B23K35/262 , B23K2101/36 , C22C13/00 , C22C13/02 , H05K3/3463
摘要： To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.
摘要翻译： 为了提供用于焊料合金的熔融温度低于250℃的焊料合金，焊球和具有用于与母板等连接的焊料凸块的电子部件，实现高的耐跌落冲击强度 在移动设备等中需要。 使用焊料合金，其由不低于0.1质量ppm的硼和不大于200质量ppm的硼组成，剩余部分包含基本上不小于40质量％的Sn，其中其熔化温度低于250℃ C。
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3.发明申请LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP 审中-公开无铅焊接合金，焊枪和电子元件，包括焊锡膏公开(公告)号：US20120038042A1
公开(公告)日：2012-02-16
申请号：US13264625
申请日：2010-04-12
IPC分类号： H01L23/498 , C22C13/02 , C22C30/02 , C22C30/04 , C22C13/00
CPC分类号： H05K3/3463 , B23K35/262 , C22C12/00 , C22C13/00 , C22C13/02 , H01L2924/0002 , H05K3/3436 , H01L2924/00
摘要： A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.
摘要翻译： 一种无铅焊料合金，焊球和包括焊料凸块的电子部件，其能够防止在焊接之后在焊料表面上发生黄色变色，在焊料形成之后的焊料凸块的表面 BGA，以及在BGA的老化测试之后的焊料凸块的表面。 具体公开的是：无铅焊料合金; 焊球; 以及包含焊料凸块的电子部件，其含有选自Li，Na，K，Ca，Be，Mg，Sc，Y，镧系元素中的至少一种添加元素，Ti，Zr，Hf，Nb，Ta，Mo，Zn ，Al，Ga，In，Si和Mn，总量为1质量ppm〜0.1质量％，余量为Sn的40质量％以上。
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4.发明授权公开(公告)号：US09024442B2
公开(公告)日：2015-05-05
申请号：US13508864
申请日：2011-08-04
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , B23K35/26 , C22C13/00 , H01L23/00 , H01L23/498 , H01L23/31 , H05K3/34
CPC分类号： B23K35/262 , C22C13/00 , H01L23/3114 , H01L23/49816 , H01L23/49866 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/05082 , H01L2224/05083 , H01L2224/11334 , H01L2224/13005 , H01L2224/13099 , H01L2224/13111 , H01L2224/13688 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/351 , H01L2924/3512 , H01L2924/3651 , H01L2924/37 , H05K3/3436 , H05K3/3463 , H05K2203/041 , H01L2224/05644 , H01L2224/05164 , H01L2224/05155 , H01L2224/05147 , H01L2924/01083 , H01L2924/01028 , H01L2924/01015 , H01L2924/01027 , H01L2924/01026 , H01L2924/2076 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： The present invention relates to a solder ball for semiconductor packaging and an electronic member having such solder ball. Specifically there are provided: a solder ball capable of ensuring a sufficient thermal fatigue property even when a diameter thereof is not larger than 250 μm as observed in recent years; and an electronic member having such solder ball. More specifically, there are provided: a solder ball for semiconductor packaging that is made of a solder alloy containing Sn as a main element, 0.1-2.5% Ag by mass, 0.1-1.5% Cu by mass and at least one of Mg, Al and Zn in a total amount of 0.0001-0.005% by mass, such solder ball having a surface including a noncrystalline phase that has a thickness of 1-50 nm and contains at least one of Mg, Al and Zn, O and Sn, and an electronic member having such solder ball.
摘要翻译： 本发明涉及一种用于半导体封装的焊球和具有这种焊球的电子部件。 具体地说，提供了一种能够确保近年来观察到的直径不大于250μm时的足够的热疲劳特性的焊球; 以及具有这种焊球的电子部件。 更具体地说，提供一种半导体封装用焊料球，其由以Sn为主要元素的焊料合金制成，质量％为0.1〜2.5质量％，Cu为0.1〜1.5质量％，Mg，Al 和Zn，其总量为0.0001-0.005质量％，这种焊球具有包括厚度为1-50nm并且包含Mg，Al和Zn，O和Sn中的至少一种的非晶相的表面，以及 具有这种焊球的电子部件。
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5.发明申请SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING THE SAME 有权用于半导体封装的焊球和使用该半导体封装的电子元件公开(公告)号：US20120223430A1
公开(公告)日：2012-09-06
申请号：US13508864
申请日：2011-08-04
IPC分类号： B23K35/26 , H01L23/488
CPC分类号： B23K35/262 , C22C13/00 , H01L23/3114 , H01L23/49816 , H01L23/49866 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/05082 , H01L2224/05083 , H01L2224/11334 , H01L2224/13005 , H01L2224/13099 , H01L2224/13111 , H01L2224/13688 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/351 , H01L2924/3512 , H01L2924/3651 , H01L2924/37 , H05K3/3436 , H05K3/3463 , H05K2203/041 , H01L2224/05644 , H01L2224/05164 , H01L2224/05155 , H01L2224/05147 , H01L2924/01083 , H01L2924/01028 , H01L2924/01015 , H01L2924/01027 , H01L2924/01026 , H01L2924/2076 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： The present invention relates to a solder ball for semiconductor packaging and an electronic member having such solder ball. Specifically there are provided: a solder ball capable of ensuring a sufficient thermal fatigue property even when a diameter thereof is not larger than 250 μm as observed in recent years; and an electronic member having such solder ball. More specifically, there are provided: a solder ball for semiconductor packaging that is made of a solder alloy containing Sn as a main element, 0.1-2.5% Ag by mass, 0.1-1.5% Cu by mass and at least one of Mg, Al and Zn in a total amount of 0.0001-0.005% by mass, such solder ball having a surface including a noncrystalline phase that has a thickness of 1-50 nm and contains at least one of Mg, Al and Zn, O and Sn, and an electronic member having such solder ball.
摘要翻译： 本发明涉及一种用于半导体封装的焊球和具有这种焊球的电子部件。 具体地说，提供了一种能够确保近年来观察到的直径不大于250μm时的足够的热疲劳特性的焊球; 以及具有这种焊球的电子部件。 更具体地说，提供一种半导体封装用焊料球，其由以Sn为主要元素的焊料合金制成，质量％为0.1〜2.5质量％，Cu为0.1〜1.5质量％，Mg，Al 和Zn，其总量为0.0001-0.005质量％，这种焊球具有包括厚度为1-50nm并且包含Mg，Al和Zn，O和Sn中的至少一种的非晶相的表面，以及 具有这种焊球的电子部件。
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