摘要:
A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120° C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120° C. to foam the polymer.
摘要:
A porous article having excellent heat resistance, a finely cellular structure, and a low dielectric constant; and a process for producing the porous article which comprises subjecting a polymer composition having a micro-domain structure comprising a continuous polymer phase and dispersed therein a discontinuous phase having an average diameter smaller than 10 &mgr;m to a treatment for removing the ingredient constituting the discontinuous phase by at least one operation selected from vaporization and decomposition and by an extraction operation to thereby make the polymer porous. The ingredient constituting the discontinuous phase has a weight average molecular weight of, e.g., 10,000 or lower. Liquefied carbon dioxide, supercritical carbon dioxide, or the like can be used as an extraction solvent for the ingredient constituting the discontinuous phase.
摘要:
The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.
摘要:
The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.
摘要:
An acrylic pressure-sensitive adhesive composition which contains a high molecular weight polymer, is excellent in cohesive force and adhesive strength and can be prepared without using an organic solvent. The acrylic pressure-sensitive adhesive composition is produced by a process which comprises radical-polymerizing monomers containing an alkyl (meth)acrylate using carbon dioxide as a diluent to thereby prepare a pressure-sensitive adhesive composition containing an acrylic polymer having a weight average molecular weight of 400,000 or more. The polymerization pressure ranges from, for example, about 5.7 to 40 MPa, AND the polymerization temperature ranges from, for example, about 20 to 100° C.
摘要:
A method and apparatus for producing a foamed pressure-sensitive adhesive tape or sheet having a fine cell structure with a good production efficiency without through complicated steps are provided. The method comprises subjecting a mixture containing monomers of a polymer constituting a foamed pressure-sensitive adhesive layer to polymerization in an inert fluid in a supercritical state or a liquid state under pressure, and ejecting the polymerized composition obtained on a substrate under a pressure lower than the pressure in the polymerization to form a foamed pressure-sensitive adhesive layer applied on the substrate. The apparatus comprises a pressure vessel for polymerizing monomers of a polymer constituting a foamed pressure-sensitive adhesive layer under pressure, an inert fluid supplying means for supplying an inert fluid in a supercritical state or a liquid state to the pressure vessel, and an ejection means for ejecting the polymerized composition obtained by polymerizing the monomers.
摘要:
A composition for a polyolefin resin foam, which comprises a polymer component comprising a polyolefin resin, and at least one of a rubber and a thermoplastic olefin elastomer, and powdery particles, wherein said composition has a melt tension of at least 20 cN when measured in a range between a first temperature at a melting point of said composition and a second temperature that is 20 degrees Celsius higher than said first temperature.
摘要:
A finely foamed pressure-sensitive adhesive tape or sheet possessing a pressure-sensitive adhesive layer having a fine cell size and cell wall thickness is disclosed. The tape or sheet is obtained by impregnating the pressure-sensitive adhesive tape or sheet with carbon dioxide in a liquid state or a supercritical state, and reducing the pressure to foam the pressure-sensitive adhesive layer. The main component of the pressure-sensitive adhesive layer is, for example, an acrylic resin or a rubber-based resin. The method provides a finely foamed pressure-sensitive adhesive tape or resin possessing a pressure-sensitive adhesive layer having a fine cell structure such that an average cell size d is from 0.01 to 1000 &mgr;m, an average cell wall thickness t is from 0.01 to 2000 &mgr;m, and the ratio t/d is in the range of from 0.5 to 3.5.
摘要:
A method of efficiently removing a low molecular weight substance from a polyimide precursor or polyimide in which the low molecular weight substance is dispersed as micro-domains, without using a large amount of an organic solvent. The method of removing a low molecular weight substance comprises subjecting either a polymer composition having a micro-domain structure made up of a continuous phase comprising a polyimide precursor and, dispersed therein, a discontinuous phase comprising a low molecular weight substance or a polyimide composition obtained from the polymer composition by converting the polyimide precursor into a polyimide to extraction with a combination of supercritical carbon dioxide and a co-solvent to thereby remove the low molecular weight substance. The co-solvent is preferably an aprotic polar solvent, more preferably a nitrogen compound solvent or a sulfur compound solvent.
摘要:
A porous polyimide having a finely cellular structure and having a low dielectric constant and heat resistance. The porous polyimide can be produced by a process comprising adding a dispersible compound to a polyimide precursor to form a micro-domain structure in which the dispersible compound is dispersed in the polymer so as to have a size smaller than 10 &mgr;m and then removing the dispersible compound by extraction with supercritical carbon dioxide to thereby make the precursor porous, wherein the interaction parameter &khgr;AB between the polyimide precursor A and the dispersible compound B is larger than 3. This porous polyimide has an average cell diameter smaller than 5 &mgr;m and a dielectric constant of 3 or lower.