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1.发明授权公开(公告)号：US06461725B1
公开(公告)日：2002-10-08
申请号：US09456911
申请日：1999-12-07
IPC分类号： C09J702
CPC分类号： B29C44/3453 , B29C44/3446 , C09J7/383 , C09J7/385 , C09J2421/00 , C09J2423/00 , Y02P20/544 , Y10T428/1462 , Y10T428/249982 , Y10T428/249983 , Y10T428/249984 , Y10T428/249985 , Y10T428/2852
摘要： A finely foamed pressure-sensitive adhesive tape or sheet possessing a pressure-sensitive adhesive layer having a fine cell size and cell wall thickness is disclosed. The tape or sheet is obtained by impregnating the pressure-sensitive adhesive tape or sheet with carbon dioxide in a liquid state or a supercritical state, and reducing the pressure to foam the pressure-sensitive adhesive layer. The main component of the pressure-sensitive adhesive layer is, for example, an acrylic resin or a rubber-based resin. The method provides a finely foamed pressure-sensitive adhesive tape or resin possessing a pressure-sensitive adhesive layer having a fine cell structure such that an average cell size d is from 0.01 to 1000 &mgr;m, an average cell wall thickness t is from 0.01 to 2000 &mgr;m, and the ratio t/d is in the range of from 0.5 to 3.5.
摘要翻译： 公开了具有细孔尺寸和细胞壁厚度的压敏粘合剂层的精细发泡的压敏粘合带或片。 通过用液态或超临界状态的二氧化碳浸渍压敏粘合带或片而获得胶带或片，并降低压力以使压敏粘合剂层发泡。 粘合剂层的主要成分例如为丙烯酸树脂或橡胶类树脂。 该方法提供具有细孔结构使得平均泡孔尺寸d为0.01-1000μm，平均泡孔壁厚t为0.01-2000μm的压敏粘合剂层的精细发泡压敏粘合带或树脂 妈妈，比例t / d在0.5-3.5的范围内。
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2.发明授权Acrylic pressure-sensitive adhesive composition and process for producing the same 有权丙烯酸类压敏粘合剂组合物及其制造方法公开(公告)号：US06376633B1
公开(公告)日：2002-04-23
申请号：US09472870
申请日：1999-12-28
IPC分类号： C08F12018
CPC分类号： C08F220/18 , C08F20/12
摘要： An acrylic pressure-sensitive adhesive composition which contains a high molecular weight polymer, is excellent in cohesive force and adhesive strength and can be prepared without using an organic solvent. The acrylic pressure-sensitive adhesive composition is produced by a process which comprises radical-polymerizing monomers containing an alkyl (meth)acrylate using carbon dioxide as a diluent to thereby prepare a pressure-sensitive adhesive composition containing an acrylic polymer having a weight average molecular weight of 400,000 or more. The polymerization pressure ranges from, for example, about 5.7 to 40 MPa, AND the polymerization temperature ranges from, for example, about 20 to 100° C.
摘要翻译： 含有高分子量聚合物的丙烯酸类压敏粘合剂组合物的内聚力和粘合强度优异，可以在不使用有机溶剂的情况下制备。丙烯酸类压敏粘合剂组合物通过包括自由基聚合 使用二氧化碳作为稀释剂的含有（甲基）丙烯酸烷基酯的单体，由此制备含有重均分子量为40万以上的丙烯酸类聚合物的压敏粘合剂组合物。 聚合压力范围为例如约5.7〜40MPa，聚合温度为例如约20〜100℃。
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公开(公告)号：US06224938B1
公开(公告)日：2001-05-01
申请号：US09456910
申请日：1999-12-07
IPC分类号： B05D100
CPC分类号： C09J7/385 , Y02P20/544
摘要： A method and apparatus for producing a foamed pressure-sensitive adhesive tape or sheet having a fine cell structure with a good production efficiency without through complicated steps are provided. The method comprises subjecting a mixture containing monomers of a polymer constituting a foamed pressure-sensitive adhesive layer to polymerization in an inert fluid in a supercritical state or a liquid state under pressure, and ejecting the polymerized composition obtained on a substrate under a pressure lower than the pressure in the polymerization to form a foamed pressure-sensitive adhesive layer applied on the substrate. The apparatus comprises a pressure vessel for polymerizing monomers of a polymer constituting a foamed pressure-sensitive adhesive layer under pressure, an inert fluid supplying means for supplying an inert fluid in a supercritical state or a liquid state to the pressure vessel, and an ejection means for ejecting the polymerized composition obtained by polymerizing the monomers.
摘要翻译： 提供了一种不经过复杂步骤生产具有良好生产效率的细胞结构的泡沫压敏粘合带或片材的方法和装置。该方法包括使构成发泡压敏粘合剂的聚合物的混合物 在超临界状态或压力状态的惰性流体中进行聚合，并在低于聚合反应压力的压力下喷射在基材上得到的聚合组合物，形成施加在基材上的发泡压敏粘合剂层 该装置包括用于在压力下聚合构成发泡压敏粘合剂层的聚合物的单体的压力容器，用于将超临界状态或液态的惰性流体供应到压力容器的惰性流体供给装置，以及喷射 用于喷射通过聚合得到的聚合组合物的方法 单体。
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4.发明授权Photosensitive resin composition, porous resin, circuit board, and wireless suspension board 失效感光树脂组合物，多孔树脂，电路板和无线悬挂板公开(公告)号：US07115673B2
公开(公告)日：2006-10-03
申请号：US10736529
申请日：2003-12-17
CPC分类号： H05K1/056 , G03F7/037 , H05K1/024 , H05K1/0346 , H05K3/0023 , H05K3/28 , H05K3/4676 , H05K2201/0116 , H05K2201/0154 , Y10S522/903 , Y10S522/915 , Y10T428/31721
摘要： The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.
摘要翻译： 本发明的感光性树脂组合物2包含聚酰胺酸树脂4，光敏剂，分散在聚酰胺酸树脂4中的分散性化合物3和溶剂。 多孔树脂通过从感光性树脂组合物2中除去溶剂而形成分散性化合物3分散在聚酰胺酸树脂4中的组合物，除去分散性化合物，使组合物多孔，并使多孔感光性树脂 组成。 多孔树脂能够形成精细电路图案并且具有低介电常数，并且当用作电路板的绝缘层时，会带来改善的高频特性。
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公开(公告)号：US06387969B1
公开(公告)日：2002-05-14
申请号：US09655441
申请日：2000-09-05
IPC分类号： C08J926
CPC分类号： H05K3/0011 , C08J9/26 , C08J2201/042 , C08J2201/046 , C08J2203/08 , H05K2201/0116 , H05K2203/0773 , H05K2203/0783 , H05K2203/083 , Y02P20/544
摘要： A porous article having excellent heat resistance, a finely cellular structure, and a low dielectric constant; and a process for producing the porous article which comprises subjecting a polymer composition having a micro-domain structure comprising a continuous polymer phase and dispersed therein a discontinuous phase having an average diameter smaller than 10 &mgr;m to a treatment for removing the ingredient constituting the discontinuous phase by at least one operation selected from vaporization and decomposition and by an extraction operation to thereby make the polymer porous. The ingredient constituting the discontinuous phase has a weight average molecular weight of, e.g., 10,000 or lower. Liquefied carbon dioxide, supercritical carbon dioxide, or the like can be used as an extraction solvent for the ingredient constituting the discontinuous phase.
摘要翻译： 具有优异的耐热性，细孔结构和低介电常数的多孔制品; 以及一种制造多孔制品的方法，该方法包括使包含连续聚合物相的微结构结构的聚合物组合物分散在平均直径小于10μm的不连续相中，以除去构成不连续相的成分 通过选自蒸发和分解的至少一种操作和通过萃取操作，从而使聚合物多孔。 构成不连续相的成分的重均分子量例如为10,000以下。 可以使用液化二氧化碳，超临界二氧化碳等作为构成不连续相的成分的提取溶剂。
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6.发明申请Composition for polyolefin resin foam and foam thereof, and method for producing foam 审中-公开聚烯烃树脂发泡体及其泡沫体用组合物及其制造方法公开(公告)号：US20070149630A1
公开(公告)日：2007-06-28
申请号：US11711777
申请日：2007-02-28
IPC分类号： B29C44/34
CPC分类号： C08J9/0061 , C08J9/0066 , C08J9/122 , C08J2203/08 , C08J2323/02 , C08J2421/00
摘要： A composition for a polyolefin resin foam, which comprises a polymer component comprising a polyolefin resin, and at least one of a rubber and a thermoplastic olefin elastomer, and powdery particles, wherein said composition has a melt tension of at least 20 cN when measured in a range between a first temperature at a melting point of said composition and a second temperature that is 20 degrees Celsius higher than said first temperature.
摘要翻译： 一种用于聚烯烃树脂泡沫的组合物，其包含聚烯烃树脂的聚合物组分和橡胶和热塑性烯烃弹性体中的至少一种和粉末颗粒，其中所述组合物在熔体张力为至少20cN时测量 所述组合物的熔点的第一温度和比所述第一温度高20摄氏度的第二温度之间的范围。
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7.发明授权公开(公告)号：US06696529B1
公开(公告)日：2004-02-24
申请号：US09721666
申请日：2000-11-27
IPC分类号： C08G6948
CPC分类号： H05K1/056 , G03F7/037 , H05K1/024 , H05K1/0346 , H05K3/0023 , H05K3/28 , H05K3/4676 , H05K2201/0116 , H05K2201/0154 , Y10S522/903 , Y10S522/915 , Y10T428/31721
摘要： The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.
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8.发明授权Heat-resistant polymer foam, process for producing the same, and foam substrate 有权耐热聚合物泡沫，其制造方法和泡沫基材公开(公告)号：US06503427B1
公开(公告)日：2003-01-07
申请号：US09588240
申请日：2000-06-06
申请人： Takayuki Yamamoto , Amane Mochizuki , Takami Hikita , Tomohiro Taruno , Tomohide Banba , Mitsuhiro Kanada
发明人： Takayuki Yamamoto , Amane Mochizuki , Takami Hikita , Tomohiro Taruno , Tomohide Banba , Mitsuhiro Kanada
IPC分类号： B32B1508
CPC分类号： C08J9/12 , B29C44/348 , C08J2201/032 , C08J2203/06 , C08J2203/08 , C08J2379/08 , Y10T428/31681
摘要： A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120° C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120° C. to foam the polymer.
摘要翻译： 公开了一种耐热聚合物泡沫体，其具有优异的耐热性，细微结构和低表观密度。 耐热聚合物泡沫体包含玻璃化转变点为120℃以上的耐热聚合物，例如聚酰亚胺或聚醚酰亚胺，平均泡孔直径为0.01〜10μm。 该耐热性聚合物泡沫体可以通过例如在耐压聚合物中用非反应性气体如二氧化碳浸渍，例如二氧化碳，例如超临界状态，降低压力，然后加热 聚合物在超过120℃的温度下使聚合物发泡。
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公开(公告)号：US06984413B2
公开(公告)日：2006-01-10
申请号：US09735892
申请日：2000-12-14
IPC分类号： C09J7/02
CPC分类号： H01L21/6836 , C08G18/4063 , C08G18/62 , C08G2170/40 , C09J7/385 , C09J175/04 , C09J2203/326 , H01L2221/68327 , H01L2924/3025 , Y02P20/544 , Y10T428/28 , Y10T428/2809 , Y10T428/2852 , Y10T428/2861 , Y10T428/2891
摘要： A removable pressure-sensitive adhesive sheet is disclosed which, when used for fixing adherends thereto in work processing or the like, has such a degree of tackiness as not to peel off the adherends and which, after the work processing or the like, can be easily removed from the adherends without fouling them. The removable pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer constituted of a pressure-sensitive adhesive comprising a polymer in which the content of low-molecular components having a molecular weight of 105 or lower is 10% by weight or lower. The polymer constituting the pressure-sensitive adhesive may be an acrylic polymer obtained by polymerizing one or more monomers in liquid or supercritical carbon dioxide. The removable pressure-sensitive adhesive sheet can be used, e.g., as a pressure-sensitive adhesive sheet for semiconductor wafer processing.
摘要翻译： 公开了一种可拆卸的压敏粘合片，其用于在工件加工等中将被粘物固定时具有这样的粘合度，不会剥离被粘物，并且在加工等之后，可以 容易从被粘物体上移除而不会污染它们。 可除去的粘合片包括由包含聚合物的压敏粘合剂构成的压敏粘合剂层，其中分子量为10以上的低分子量成分的含量为 10重量％以下。 构成压敏粘合剂的聚合物可以是通过在液体或超临界二氧化碳中聚合一种或多种单体获得的丙烯酸类聚合物。 可除去的压敏粘合片可以用作例如半导体晶片加工用的粘合片。
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公开(公告)号：US20050032924A1
公开(公告)日：2005-02-10
申请号：US10898326
申请日：2004-07-26
申请人： Tomohiro Taruno , Takayuki Yamamoto
发明人： Tomohiro Taruno , Takayuki Yamamoto
IPC分类号： B29C47/20 , B29C44/00 , B29C44/34 , B29C44/46 , B29K101/12 , B29K105/04 , B29L23/00 , C08J9/04 , C08J9/18 , C08J9/00
CPC分类号： B29C44/461 , B29C44/348 , B29C44/356
摘要： A process for producing a polymer foam, which comprises (I) a melting step of melting a thermoplastic resin composition by heating, (II) a gas feed step of quantitatively feeding an inert gas into the molten resin composition, (III) a kneading step of mixing and kneading the inert gas and the molten resin composition, (IV) a cooling step of cooling the kneaded material, and (V) a specific expansion step of expanding the cooled kneaded material.
摘要翻译： 一种制造聚合物泡沫体的方法，其包括（I）通过加热熔化热塑性树脂组合物的熔融步骤，（II）将惰性气体定量供给到熔融树脂组合物中的气体进料步骤，（III）捏合步骤 混合和捏合惰性气体和熔融树脂组合物，（IV）冷却捏合材料的冷却步骤，和（V）膨胀冷却的捏合材料的比膨胀步骤。
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