摘要:
The present invention reduces crosstalk noise, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap. The semiconductor device includes a first semiconductor chip (1) having a first electrode pad (2) and a first wiring layer (9), and a second semiconductor chip (5) having a second electrode pad (6) and a second wiring layer (10). A bump (4) is provided for electrically coupling the first electrode pad (2) and the second electrode pad (6). An insulation layer 8 is disposed between confronting surfaces of the first semiconductor chip (1) and the second semiconductor chip (5). An electro-conductive layer (7) is disposed between the confronting surfaces of the first semiconductor chip and the second semiconductor chip.
摘要:
The present invention reduces crosstalk, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap. The semiconductor device includes a first semiconductor chip 1 having a first electrode pad 2 and a first wiring layer 9 in the main surface, and a second semiconductor chip 5 having a second electrode pad 6 and a second wiring layer 10 in the main surface confronting the first semiconductor chip. A bump 4 is provided for electrically coupling the first electrode pad 2 and the second electrode pad 6 together. An insulation layer 8 is disposed between the main surfaces of first semiconductor chip 1 and second semiconductor chip 5. An electro-conductive layer 7 is disposed between the main confronting surfaces of the first semiconductor chip and the second semiconductor chip.
摘要:
A microcomputer chip is formed with a CPU core, a peripheral circuit, a built-in ROM, and a built-in RAM. An emulation functional chip is formed with an emulation control circuit for controlling the whole process of emulation. First electrode pads formed on the functional surface of the microcomputer chip are electrically interconnected to second electrode pads formed on the functional surface of the emulation functional chip with connecting bumps interposed therebetween. The microcomputer chip and the emulation functional chip are modularized using an insulating resin with the first electrode pads being connected to the second electrode pads.
摘要:
Automatic band strapping apparatus with a table for supporting an article during banding. An arch frame extends in the form of an upright loop from one side to another of the table. The arch frame has an elongated side wall also in the form of an upright loop in a plane substantially normal to the table. An elongated U-sectioned arch guide made of flexible plastics material such as ultra-high molecular polyethylene has a loop shape following the contour of the arch frame side wall, and one edge surface facing that side wall is opened by means of a groove. Springs press the grooved edge surface of the arch guide against the arch frame side wall thereby defining a band passage through the arch guide which is normally closed. The arch guide is locally separable from the side wall against the urgence of the springs, progressively around the length of the arch frame, providing a moderate draw-out resistance to enable release and withdrawal of band progressively and continuously from the band passage. This maintains continuous tension in the band while it is being wrapped about the article in a straight path without twisting or meandering. The plastics arch guide has sufficient flexibility in a direction normal to the side wall to enable the springs to keep it seated against the side wall despite minor dimensional variations of the parts within manufacturing tolerances. Further, the arch guide is sufficiently flexible in the direction parallel to the side wall that it will remain seated against it, and the band passage thereby kept closed against inadvertent loss of band despite local or overall self-adjusting squirming or sliding movement of the arch guide against the arch frame side wall when in use.
摘要:
A method of transferring data through a bus includes the steps of: occupying the bus by a first device serving as a bus master; transferring a first predetermined number of data items of all data items to be transferred while the first device is occupying the bus; determining if the first predetermined number of data items have been transferred; determining if the first device should release the bus based on whether or not there is a request from a second device after it is determined that the first predetermined number of data items have been transferred; and releasing the bus by the first deice when it is determined that the first device should release the bus.
摘要:
A band feeding and tightening apparatus for a band strapping machine comprises a main shaft rotatably placed at a lateral position of a serial connection of a motor and a reduction gear device; a high speed revolution transmitting means to transmit a rotational force at the high speed side of the reduction gear device to the main shaft; a low speed revolution transmitting means to transmit a rotational force at the low speed side of the reduction gear to the main shaft through an electromagnetic clutch; a stationary shaft placed in parallel to the main shaft, the stationary shaft rotatably supporting a feed roller and a power transmitting means to transmit a rotational force of the high speed revolution transmitting mean to the feed roller through a friction clutch; and the return roller mounted on the main shaft through a one-way clutch.
摘要:
A strapping machine comprises a return roller having a high friction outer peripheral surface and a feed roller having a low friction outer peripheral surface which are contacted with each other under pressure and the return roller is disposed in free condition during the rotation of the feed roller in one direction and when the feeding resistance of the band is increased, the band is slipped on the outer peripheral surface of the feed roller to prevent the feeding of the band and in order to tighten the band around the package, both of the rollers are reversely rotated at a high speed to tighten the band around an object to be packed and then continuously rotated at a low speed to impart high torque to the band for an attainment of further tightening thereof.
摘要:
A strapping machine comprises a roller for reversely rotating by a one way motor to tighten a package with a band, a differential reducing mechanism engaged to a clutch whereby the roller is reversely rotated at high speed before sliding the clutch and is further reversely rotated at low speed and high torque after sliding the clutch and a seal forming shaft starts when a return roller is stopped under a predetermined tension applied by tightening the band. The strapping machine further comprises a cutter anvil to contact the inner surfaces of the bands at the superposed part with a heating element inserted into the superposed part of the bands and a cutter for cutting the band under suitable tension after cooling the heat-sealed bands.
摘要:
A method of transferring data through a bus includes the steps of: occupying the bus by a first device serving as a bus master; transferring a first predetermined number of data items of all data items to be transferred while the first device is occupying the bus; determining if the first predetermined number of data items have been transferred; determining if the first device should release the bus based on whether or not there is a request from a second device after it is determined that the first predetermined number of data items have been transferred; and releasing the bus by the first device when it is determined that the first device should release the bus.
摘要:
A semiconductor integrated circuit includes a functional block realizing at least part of a function of the semiconductor integrated circuit. The functional block includes a plurality of basic cells and a plurality of terminal cells. Each of the plurality of terminal cells has a connector for mediating a communication between another semiconductor integrated circuit and one of the plurality of basic cells.