公开(公告)号：US4610718A

公开(公告)日：1986-09-09

申请号：US726651

申请日：1985-04-24

申请人： Takeshi Araya ,  Ryoji Okada ,  Yoshiro Ibaraki ,  Susumu Hioki ,  Masatoshi Kanamaru ,  Yoshishige Endo ,  Mitsuaki Haneda

发明人： Takeshi Araya ,  Ryoji Okada ,  Yoshiro Ibaraki ,  Susumu Hioki ,  Masatoshi Kanamaru ,  Yoshishige Endo ,  Mitsuaki Haneda

IPC分类号： B22F9/14 ,  H05H1/28 ,  B01J2/04

CPC分类号： B22F9/14 ,  H05H1/28 ,  B22F2998/00

摘要： In a method wherein arcs are struck across a material to vaporize into ultra-fine particles and an electrode, thereby to manufacture the ultra-fine particles; the material to turn into the ultra-fine particles is arranged for at least either of the electrodes, and plasma currents are generated from the material and the electrode, whereby the formation rate of the ultra-fine particles per unit input is increased, and the material is formed in the shape of a rod or a wire, and a feeder capable of continuously supplying the material is disposed, whereby the ultra-fine particles can be continuously manufactured.

摘要翻译： 在将电弧撞击穿过材料蒸发成超细颗粒和电极的方法中，从而制造超细颗粒; 对于电极中的至少任一个设置变成超细颗粒的材料，并且从材料和电极产生等离子体电流，由此每单位输入的超细颗粒的形成速率增加，并且 材料形成为棒状或线状，并且配置能够连续供给材料的馈线，由此可以连续地制造超细颗粒。

公开(公告)号：US4732369A

公开(公告)日：1988-03-22

申请号：US898600

申请日：1986-08-21

申请人： Takeshi Araya ,  Yoshiro Ibaraki ,  Yoshishige Endo ,  Susumu Hioki ,  Masatoshi Kanamaru

发明人： Takeshi Araya ,  Yoshiro Ibaraki ,  Yoshishige Endo ,  Susumu Hioki ,  Masatoshi Kanamaru

IPC分类号： B22F9/14 ,  C04B35/626

CPC分类号： B22F9/14 ,  C04B35/626

摘要： An apparatus for producing ultrafine particles by arc energy characterized by disposing an electrode inclinedly as to a base material so as to generate a magnetic blow to arc, disposing a suction opening at the direction of the arc blown, and cooling vapors generated, followed by collection thereof can improve the production efficiency of ultrafine particles with a uniform particle size.

摘要翻译： 一种用于通过电弧能生产超细颗粒的装置，其特征在于，将电极倾斜放置在基材上，以便产生电弧的磁力冲击，在电弧吹制的方向设置吸入口，并产生冷却蒸汽，随后进行收集 可以提高均匀粒径的超微粒子的生产效率。

公开(公告)号：US5032248A

公开(公告)日：1991-07-16

申请号：US362619

申请日：1989-06-07

申请人： Masatoshi Kanamaru ,  Takeshi Harada ,  Yoshiro Ibaraki ,  Sadayasu Ueno ,  Norio Ichikawa

发明人： Masatoshi Kanamaru ,  Takeshi Harada ,  Yoshiro Ibaraki ,  Sadayasu Ueno ,  Norio Ichikawa

IPC分类号： G01N27/407 ,  G01N27/416

CPC分类号： G01N27/4075 ,  G01N27/4077

摘要： The invention relates to a gas sensor for measuring an air-fuel ratio of an air-fuel mixture of an internal combustion engine and to a method of manufacturing the gas sensor. The sensor of the invention comprises: a solid state electrolyte layer made of an oxygen ion conductive metal oxide; a first electrode of a porous thin film having the catalyst function which was coated on one surface of the solid state electrolyte layer; a second electrode of a porous thin film having the catalyst function which was coated on the other surface of the solid state electrolyte layer; an electrode shielding layer made of a sintered material of ultra fine particulates whose average grain diameter is 1 .mu.m or less which covers the surface other than the region of a predetermined area of the second electrode; and a gas diffusion layer made of a porous electric insulative metal oxide which covers the region of the predetermined area of at least the second electrode.

公开(公告)号：US4915814A

公开(公告)日：1990-04-10

申请号：US250238

申请日：1988-09-28

申请人： Takeshi Harada ,  Masatoshi Kanamaru ,  Yoshiro Ibaraki ,  Katsuyoshi Terakado ,  Sadayasu Ueno ,  Norio Ichikawa

发明人： Takeshi Harada ,  Masatoshi Kanamaru ,  Yoshiro Ibaraki ,  Katsuyoshi Terakado ,  Sadayasu Ueno ,  Norio Ichikawa

IPC分类号： B05D5/12 ,  G01N25/20 ,  G01N27/407 ,  G01N27/416 ,  G01N27/417

CPC分类号： G01N27/4075

摘要： An air/fuel ratio (A/F) sensor for detecting the A/F over a wide range covering a lean region and a rich region which are partitioned by the stoichiometric A/F comprises a solid electrolyte made of an oxygen ion conductive metal oxide, first and second electrodes sandwiching the solid electrolyte and being operable by a predetermined voltage applied thereacross to ionize oxygen near the solid electrolyte and diffuse oxygen ions into the solid electrolyte, and a gas diffusion layer in the form of a porous sintered layer covering the second electrode and made of electrically insulative metal oxide fine particles having a mean particulate size of 1 .mu.m or less so that oxygen or molecules of other gas components in the exhaust gas can move through pores of the gas diffusion layer.

公开(公告)号：US06507204B1

公开(公告)日：2003-01-14

申请号：US09522477

申请日：2000-03-09

申请人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Atsushi Hosogane ,  Tatsuya Nagata ,  Ryuji Kohno ,  Hideyuki Aoki ,  Akihiko Ariga

发明人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Atsushi Hosogane ,  Tatsuya Nagata ,  Ryuji Kohno ,  Hideyuki Aoki ,  Akihiko Ariga

IPC分类号： G01R3102

CPC分类号： G01R1/06733 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06761 ,  G01R1/06772 ,  G01R1/07342 ,  G01R3/00

摘要： The conventional semiconductor element testing equipment is arranged to position each probe accurately and need a burdensome operation for fixing, and includes only a limited number of electrode pads and chips to be tested at a batch. An equipment for testing a semiconductor element is arranged to keep each of electrode pads formed on a semiconductor element to be tested in direct contact with each of probes formed on a first substrate composed of silicon, one of electric connecting substrates disposed in the equipment. On the first substrate, each probe is formed on a cantilever and a wire is routed from a tip of each probe along a tip of the cantilever to the electrode pad formed on an opposite surface to the probe forming surface through an insulating layer.

摘要翻译： 常规的半导体元件测试设备被布置成准确地定位每个探针，并且需要用于固定的繁重的操作，并且仅包括有限数量的待批测试的电极焊盘和芯片。 布置了用于测试半导体元件的设备，以使每个形成在要测试的半导体元件上的电极焊盘与形成在由设置在设备中的电连接基板之一的硅构成的第一基板上形成的每个探针直接接触。 在第一基板上，每个探针形成在悬臂上，并且从每个探针的尖端沿着悬臂的尖端布线到通过绝缘层与探针形成表面相对的表面上形成的电极焊盘。

公开(公告)号：US06660541B2

公开(公告)日：2003-12-09

申请号：US10280117

申请日：2002-10-23

申请人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Takanori Aono ,  Ryuji Kohno ,  Hideyuki Aoki

发明人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Takanori Aono ,  Ryuji Kohno ,  Hideyuki Aoki

IPC分类号： H01L2166

CPC分类号： H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device includes forming process of forming a semiconductor element on a semiconductor wafer and testing process of testing electrical performance of the formed semiconductor element. The testing process includes process of electrically connecting a testing apparatus to an electrode pad formed on the semiconductor element to be tested. The testing apparatus has a probe-formed substrate including a plurality of beams having probes to be electrically connected to the electrode pads. The probe-formed substrate has a first beam having at least one probe for electrically connection with the electrode pad and a second beam having a number of probes for electrical connection with the electrode pads of which number is more than the number of the electrode pads electrically connected by said first beam.

公开(公告)号：US06496023B1

公开(公告)日：2002-12-17

申请号：US09722484

申请日：2000-11-28

申请人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Takanorr Aono ,  Ryuji Kohno ,  Toshio Miyatake ,  Hideyuki Aoki ,  Naoto Ban

发明人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Takanorr Aono ,  Ryuji Kohno ,  Toshio Miyatake ,  Hideyuki Aoki ,  Naoto Ban

IPC分类号： G01R3102

CPC分类号： G01R1/07357 ,  Y10S977/874

摘要： A structure is provided such that a plural cantilevers are formed on a first board formed of silicon, probes are respectively formed on the individual cantilevers at positions each offset perpendicularly to a longitudinal center line of the cantilever, and wiring connected continuously from each probe to a secondary electrode pad portion through an insulating layer. A structure is alternatively adopted such that by using a both-ends supported beam formed of silicon as the beam, each probe is formed at a position offset toward a supported portion side of the both-ends supported beam.

摘要翻译： 提供一种结构，使得在由硅形成的第一板上形成多个悬臂，在各个悬臂分别在垂直于悬臂的纵向中心线偏移的位置处形成探针，并且从每个探针连续连接到每个探针 次级电极焊盘部分穿过绝缘层。 可替代地采用结构，使得通过使用由硅形成的两端支撑梁作为梁，每个探针形成在朝向两端支撑梁的支撑部分侧偏移的位置。

公开(公告)号：US06479305B2

公开(公告)日：2002-11-12

申请号：US09396732

申请日：1999-09-15

申请人： Ryuji Kono ,  Akihiko Ariga ,  Hideyuki Aoki ,  Hiroyuki Ohta ,  Yoshishige Endo ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Shinji Tanaka ,  Naoto Ban ,  Hideo Miura

发明人： Ryuji Kono ,  Akihiko Ariga ,  Hideyuki Aoki ,  Hiroyuki Ohta ,  Yoshishige Endo ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Shinji Tanaka ,  Naoto Ban ,  Hideo Miura

IPC分类号： H01L2166

CPC分类号： H01L21/6836 ,  H01L22/20 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/00

摘要： Semiconductor device chips manufacturing and inspecting method is disclosed in which a semiconductor wafer is cut into individual LSI chips. The LSI chips are rearranged and integrated into a predetermined number. The cut LSI chips are integrated in a jig having openings with a size commensurate with the dimensions of the LSI chip. At least one part of the jig having such openings has a coefficient of thermal expansion that is approximately equal to that of the LSI chips. The integrated predetermined number of chips are subjected to an inspection process in a subsequent inspection step thereby improving efficiency and reducing cost.

摘要翻译： 半导体器件芯片制造和检查方法被公开，其中将半导体晶片切割成单独的LSI芯片。 LSI芯片重新排列并集成为预定数量。 切割的LSI芯片集成在具有与LSI芯片的尺寸相当的尺寸的开口的夹具中。 具有这种开口的夹具的至少一部分具有与LSI芯片大致相同的热膨胀系数。 综合预定数量的芯片在随后的检查步骤中进行检查处理，从而提高效率并降低成本。

公开(公告)号：US06358762B1

公开(公告)日：2002-03-19

申请号：US09534302

申请日：2000-03-23

申请人： Ryuji Kohno ,  Hideo Miura ,  Yoshishige Endo ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Hideyuki Aoki ,  Naoto Ban

发明人： Ryuji Kohno ,  Hideo Miura ,  Yoshishige Endo ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Hideyuki Aoki ,  Naoto Ban

IPC分类号： G01R3126

CPC分类号： H01L22/32 ,  G01R1/06711 ,  G01R1/06738 ,  G01R1/07314 ,  G01R3/00 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor inspection apparatus which is possible to inspect a plurality of semiconductor devices collectively at one time, which has conventionally been difficult because of precision or the like of probes. A method of manufacturing the semiconductor inspection apparatus comprises the steps of forming a cover film on a surface of the silicon substrate and forming a plurality of probes of a polygonal cone shape or a circular cone shape through etching after patterning by photolithography, after the cover film is removed, again forming a cover film on the surface of the silicon substrate and forming a beam or a diaphragm for each probe through etching after patterning by photolithography, after the cover film is removed, again forming a cover film on the surface of the silicon substrate and forming a through hole corresponding to the probe through etching after patterning by photolithography, and after the cover film is removed, forming an insulating film on the surface of the silicon substrate, forming a metal film on a surface of the insulating film, and forming a wiring lead through etching after patterning by photolithography.

公开(公告)号：US07119362B2

公开(公告)日：2006-10-10

申请号：US10326663

申请日：2002-12-23

申请人： Ryuji Kono ,  Makoto Kitano ,  Hideo Miura ,  Hiroyuki Ota ,  Yoshishige Endo ,  Takeshi Harada ,  Masatoshi Kanamaru ,  Teruhisa Akashi ,  Atsushi Hosogane ,  Akihiko Ariga ,  Naoto Ban

发明人： Ryuji Kono ,  Makoto Kitano ,  Hideo Miura ,  Hiroyuki Ota ,  Yoshishige Endo ,  Takeshi Harada ,  Masatoshi Kanamaru ,  Teruhisa Akashi ,  Atsushi Hosogane ,  Akihiko Ariga ,  Naoto Ban

IPC分类号： H01L23/58

CPC分类号： G01R1/07314 ,  G01R1/06744 ,  G01R3/00 ,  G01R31/2863

摘要： In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by pressing a testing structure provided with electrically independent projections having a number equal to a number of conductor portions to be tested formed on an area to be tested of a body to be tested to the body to be tested.