摘要:
Embodiments of the invention provide optical lenses comprised of layers of material each having a different index of refraction from that of the other layers wherein the layers of material are arranged in order of increasing index of refraction. The lens region is capable of causing an optical beam that enters the lens region to be focused into an output beam that is smaller in at least one dimension. A waveguide is optically coupled to the optical lens and a photodetector is optically coupled to the waveguide. The optical lens is capable of being manufactured using semiconductor processing techniques and is capable of being integrated into an integrated circuit chip.
摘要:
Embodiments of the invention provide optical lenses comprised of layers of material each having a different index of refraction from that of the other layers wherein the layers of material are arranged in order of increasing index of refraction. The lens region is capable of causing an optical beam that enters the lens region to be focused into an output beam that is smaller in at least one dimension. A waveguide is optically coupled to the optical lens and a photodetector is optically coupled to the waveguide. The optical lens is capable of being manufactured using semiconductor processing techniques and is capable of being integrated into an integrated circuit chip.
摘要:
Optical interfaces that may be employed between large-core optical fibers and chip-scale optoelectronic devices. Described herein are couplers that improve the tolerance of misalignment when a single mode (SM) fiber is used as waveguide input. This enables the possibility of passive/automatic alignment and therefore reduces the production cost. The coupler also serves as a spot-size converter that reduces the spot size and is suitable for applications where a waveguide mode with small cross-section area is of particular importance. One such example can be a waveguide-based SiGe or III-V semiconductor photodetector in which the vertical size of its waveguide mode should be as small as few microns.
摘要:
Deterministic generation of nonclassical photons by producing a dilute gas of exciton-polaritons in a solid-state microcavity that includes a periodic array of potential well traps. A photon-exciton frequency detuning is modulated in the microcavity to produce a polaritonic quantum phase transition from a superfluid state to a Mott-insulator state. The nonclassical photons are then generated simultaneously by radiative decay of exciton-polaritons in the microcavity. The nonclassical photons may be indistinguishable single photons, in which case the dilute gas of exciton-polaritons is produced such that on to average there is one polariton per potential well trap. Alternatively, the generated nonclassical photons may be polarization-entangled photon pairs, in which case the dilute gas of exciton-polaritons is produced such that on average there are two polaritons per potential well trap.
摘要:
A low voltage photodetector structure including a semiconductor device layer, which may be Ge, is disposed over a substrate semiconductor, which may be Si, for example within a portion of a waveguide extending laterally within a photonic integrated circuit (PIC) chip. In exemplary embodiments where the device layer is formed over an insulator layer, the insulator layer is removed to expose a surface of the semiconductor device layer and a passivation material formed as a replacement for the insulator layer within high field regions. In further embodiments, controlled avalanche gain is achieved by spacing electrodes in a metal-semiconductor-metal (MSM) architecture, or complementary doped regions in a p-i-n architecture, to provide a field strength sufficient for impact ionization over a distance not significantly more than an order of magnitude greater than the distance that a carrier must travel so as to acquire sufficient energy for impact ionization.
摘要:
Methods of forming microelectronic structures are described. Embodiments of those methods may include forming a photomask on a (110) silicon wafer substrate, wherein the photomask comprises a periodic array of parallelogram openings, and then performing a timed wet etch on the (110) silicon wafer substrate to form a diffraction grating structure that is etched into the (110) silicon wafer substrate.
摘要:
Methods of forming microelectronic structures are described. Embodiments of those methods may include forming a photomask on a (110) silicon wafer substrate, wherein the photomask comprises a periodic array of parallelogram openings, and then performing a timed wet etch on the (110) silicon wafer substrate to form a diffraction grating structure that is etched into the (110) silicon wafer substrate.