利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

169 条记录 (耗时 0.03 秒)

    Process for producing multilayer printed wiring board
    4.
    发明授权
    Process for producing multilayer printed wiring board 有权
    多层印刷线路板的制造方法

    公开(公告)号：US08584352B2

    公开(公告)日：2013-11-19

    申请号：US12869926

    申请日：2010-08-27

    申请人： Hirohisa Narahashi ,  Shigeo Nakamura ,  Tadahiko Yokota

    发明人： Hirohisa Narahashi ,  Shigeo Nakamura ,  Tadahiko Yokota

    IPC分类号： H05K3/02

    CPC分类号： H05K3/4661 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/181 ,  H05K3/381 ,  H05K2203/1152

    摘要： Multilayer printed wiring boards superior in formation of an ultrafine wiring, which can form a conductive layer superior in peel strength on a flat insulating layer surface, can be prepared by a method including the following steps (A)-(E): (A) a step of laminating a film with a metal film, wherein a metal film layer is formed on a support layer, on an internal-layer circuit substrate via a curable resin composition layer, or laminating an adhesive film with a metal film, wherein a curable resin composition layer is formed on a metal film layer of the film with a metal film, on an internal-layer circuit substrate; (B) a step of curing a curable resin composition layer to form an insulating layer; (C) a step of removing a support layer; (D) a step of removing a metal film layer; and (E) a step of forming a metal film layer on an insulating layer surface by electroless plating.

    摘要翻译： 可以通过包括以下步骤（A） - （E）的方法制备能形成在平坦绝缘层表面上的剥离强度优异的导电层的超细布线形成的多层印刷电路板：（A） 通过固化性树脂组合物层在内层电路基板上形成金属膜的金属膜，其中在支撑层上形成金属膜层，或者用金属膜层压粘合膜的步骤，其中可固化 在金属膜的金属膜层上在内层电路基板上形成树脂组合物层; （B）固化树脂组合物层以固化以形成绝缘层的步骤; （C）去除支撑层的步骤; （D）除去金属膜层的工序; 和（E）通过化学镀在绝缘层表面上形成金属膜层的步骤。

    Position determining system with arm center line crossing expanding/contracting direction of hinged actuator unit
    5.
    发明授权
    Position determining system with arm center line crossing expanding/contracting direction of hinged actuator unit 失效
    位置确定系统具有臂中心线交叉铰接致动器单元的扩展/收缩方向

    公开(公告)号：US08493692B2

    公开(公告)日：2013-07-23

    申请号：US12707834

    申请日：2010-02-18

    申请人： Shigeo Nakamura ,  Yasuhiro Matsuda ,  Toshinori Sugiyama

    发明人： Shigeo Nakamura ,  Yasuhiro Matsuda ,  Toshinori Sugiyama

    IPC分类号： G11B5/455 ,  G11B5/56

    CPC分类号： G11B5/455 ,  G11B5/4826 ,  G11B5/4833 ,  G11B5/4873 ,  G11B19/048 ,  G11B27/105 ,  G11B27/36 ,  G11B2220/2516

    摘要： A magnetic head-positioning system to accurately test a magnetic disk and a magnetic head, comprises a plurality of hinges attached on an end portion of a linear driving element and disposed on both sides of a center line of the linear driving element, which is in parallel with an extension-shrinkage direction of the linear driving element, and an arm having a length longer than a distance between a plurality of hinge joint portions, the plurality of the hinge joint portions each of which join the hinge with a root portion of the arm and which are disposed on both sides of a center line of the arm which is in parallel with a longitudinal direction of the arm. The arm has an extremity portion on which a head gimbal assembly is detachably attached and this head gimbal assembly is positioned.

    摘要翻译： 一种用于精确测试磁盘和磁头的磁头定位系统，包括附接在线性驱动元件的端部上并设置在线性驱动元件的中心线的两侧上的多个铰链，其位于 平行于线性驱动元件的延伸收缩方向，并且臂的长度大于多个铰链接合部之间的距离，所述多个铰链接头部分中的每个铰链接合部分将铰链与根部部分接合 臂，并且设置在与臂的纵向方向平行的臂的中心线的两侧。 臂具有末端部分，头部万向节组件可拆卸地附接在该末端部分上，并且该头部万向架组件被定位。

    Lever switch device
    7.
    发明授权
    Lever switch device 有权
    杠杆开关装置

    公开(公告)号：US08269122B2

    公开(公告)日：2012-09-18

    申请号：US12326480

    申请日：2008-12-02

    申请人： Yusuke Kimura ,  Kenpo Kurachi ,  Shigeo Nakamura

    发明人： Yusuke Kimura ,  Kenpo Kurachi ,  Shigeo Nakamura

    IPC分类号： H01H3/16 ,  H01H9/00

    CPC分类号： B60Q1/1469 ,  B60Q1/1476

    摘要： A lever switch device, includes a lever main body rotatably supported by a body around a predetermined rotation center axis, a first remote shaft rotatably incorporated in the lever main body, and comprising a first operating knob at one end and a first operation portion at another end for operating an operational object by a rotational operation of the first operating knob, a second remote shaft rotatably arranged in the lever main body with a coaxial structure with the first remote shaft, and includes a second operating knob at one end and a second operation portion at another end for operating an operational object by a rotational operation of the second operating knob. Rotation centers of the first and second operation portions are provided on the rotation center axis of the lever main body.

    摘要翻译： 一种杠杆开关装置，包括：杠杆主体，其主体围绕预定的旋转中心轴线可旋转地支撑，第一远程轴可旋转地结合在杠杆主体中，并且包括一端的第一操作旋钮和另一端的第一操作部 用于通过第一操作旋钮的旋转操作来操作操作对象;第二远程轴，其可旋转地布置在杆主体中，与第一远程轴具有同轴结构，并且在一端包括第二操作旋钮和第二操作 另一端的部分通过第二操作旋钮的旋转操作来操作操作对象。 第一操作部和第二操作部的旋转中心设置在杆主体的旋转中心轴上。

    PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
    8.
    发明申请
    PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD 有权
    生产多层印刷线路板的工艺

    公开(公告)号：US20100206471A1

    公开(公告)日：2010-08-19

    申请号：US12721891

    申请日：2010-03-11

    申请人： Shigeo Nakamura ,  Seiichiro Ohashi ,  Eiichi Hayashi ,  Tadahiko Yokota

    发明人： Shigeo Nakamura ,  Seiichiro Ohashi ,  Eiichi Hayashi ,  Tadahiko Yokota

    IPC分类号： B32B38/10

    CPC分类号： H05K3/4673 ,  B32B37/025 ,  B32B38/0004 ,  B32B2038/0076 ,  B32B2305/076 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2309/12 ,  B32B2309/68 ,  B32B2311/00 ,  B32B2457/08 ,  H05K3/4644 ,  H05K2203/0228 ,  H05K2203/066 ,  H05K2203/085 ,  Y10T29/49155 ,  Y10T156/1052 ,  Y10T156/1054

    摘要： A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.

    摘要翻译： 一种包含以下步骤（1） - （5）的多层印刷线路板的制造方法：（1）临时配合准备步骤，包括从粘合片辊输送粘合片，其中，将具有预浸渍体的粘合片形成在 将支撑膜缠绕在卷筒中并放置粘合片，使得预浸料表面接触电路板的一个或两个表面，（2）临时安装步骤，用于将粘合片临时装配到电路板，包括部分 通过从支撑膜侧加热和压制粘合片的一部分，将粘合片粘合到电路板上，并用切割机根据电路板的尺寸切割粘合片，（3）层压步骤，包括加热和 在减压下按压临时贴合的粘合片以将粘合片层合在电路板上，（4）热固化步骤，包括通过热固化该制备形成绝缘层 （5）包括在热固化步骤之后分离支撑膜的分离步骤，能够连续制备具有预浸料的多层印刷线路板的绝缘层，而不使用单个晶片。

    HEAD SUPPORTING MECHANISM
    9.
    发明申请
    HEAD SUPPORTING MECHANISM 审中-公开
    头部支持机制

    公开(公告)号：US20100165514A1

    公开(公告)日：2010-07-01

    申请号：US12625620

    申请日：2009-11-25

    申请人： Irizo NANIWA ,  Takuya Matsumoto ,  Shigeo Nakamura ,  Shigeyuki Sasaki

    发明人： Irizo NANIWA ,  Takuya Matsumoto ,  Shigeo Nakamura ,  Shigeyuki Sasaki

    IPC分类号： G11B21/16

    CPC分类号： G11B5/4833 ,  G11B5/4826 ,  G11B5/4866

    摘要： A head supporting mechanism equipped with a waveguide is provided by which stiffness of the waveguide does not give a large influence to flying-heights and attitudes of a slider. In the head supporting mechanism, the waveguide provided on a suspension is arranged in such a manner that a portion of the waveguide is bent in either an in-plane direction or an out-plane direction of the suspension.

    摘要翻译： 提供了配备有波导的头部支撑机构，其中波导的刚度对滑块的飞行高度和姿态没有很大的影响。 在头支撑机构中，设置在悬架上的波导以这样的方式布置，使得波导的一部分在悬架的面内方向或外平面方向上弯曲。