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    Electronic device having molded resin case, and molding tool and method of manufacturing the same
    1.
    发明申请
    Electronic device having molded resin case, and molding tool and method of manufacturing the same 审中-公开
    具有模制树脂外壳的电子设备和成型工具及其制造方法

    公开(公告)号：US20080287008A1

    公开(公告)日：2008-11-20

    申请号：US12152206

    申请日：2008-05-13

    申请人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    发明人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    IPC分类号： H01R13/66 ,  B29C70/72

    CPC分类号： G01P1/023 ,  B29C33/123 ,  G01P15/125 ,  H01L21/565 ,  H01L2924/0002 ,  H01R43/24 ,  H05K5/0034 ,  H05K5/0078 ,  H05K5/065 ,  H01L2924/00

    摘要： An electronic device includes an electronic circuit section, a case, and a connector housing. The electronic circuit section includes a connector terminal. The case seals the electronic circuit section in such a manner that the connector terminal protrudes to an outside of the case. The connector housing is integrated with the case and has an approximately cylindrical shape to surround an outer circumference of the connector terminal. The case and the connector housing are made of resin with a molding tool by filling resin into a case cavity and a connector-housing cavity of the molding tool in a state where the electronic circuit section is held by a holding portion of the molding tool.

    摘要翻译： 电子设备包括电子电路部分，壳体和连接器壳体。 电子电路部分包括连接器端子。 壳体以使得连接器端子突出到壳体的外部的方式密封电子电路部分。 连接器壳体与壳体一体化并且具有围绕连接器端子的外圆周的大致圆柱形形状。 壳体和连接器壳体由具有模制工具的树脂制成，其通过在模制工具的保持部分保持电子电路部分的状态下将树脂填充到模腔中的壳体空腔和连接器壳体腔中。

    Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case
    2.
    发明授权
    Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case 有权
    制造具有树脂模制外壳的电子装置和用于形成树脂模制壳体的模制工具的方法

    公开(公告)号：US07776247B2

    公开(公告)日：2010-08-17

    申请号：US12156518

    申请日：2008-06-02

    申请人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    发明人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    IPC分类号： B29C45/14

    CPC分类号： H01L21/565 ,  B29C45/0046 ,  B29C45/14639 ,  B29C45/2708 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

    摘要翻译： 在制造电子设备的方法中，电子元件设置在与连接器端子电耦合的布线板上，布线板的第一表面被第一壳体元件覆盖，并且布线板的第二表面是 覆盖有第二壳体元件以形成电子电路部分，电子电路部分设置在模制工具的壳体腔中，并且将树脂填充到壳体腔中以形成树脂模制壳体，同时保持 将第一壳体元件推向布线板并随时间变化的第一压力基本上等于将第二壳体元件推向布线板并随时间变化的第二压力。

    Physical quantity sensor and semiconductor device having package and cover
    4.
    发明授权
    Physical quantity sensor and semiconductor device having package and cover 有权
    物理量传感器和具有封装和封盖的半导体器件

    公开(公告)号：US07719006B2

    公开(公告)日：2010-05-18

    申请号：US12072319

    申请日：2008-02-26

    申请人： Tatsuya Watanabe ,  Masahiko Imoto

    发明人： Tatsuya Watanabe ,  Masahiko Imoto

    IPC分类号： H01L23/58

    CPC分类号： H01L23/04 ,  H01L23/053 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.

    摘要翻译： 半导体器件包括：半导体芯片; 用于容纳所述芯片的封装，其中所述封装具有带有开口和底部的盒形; 以及用于密封包装的开口的盖。 半导体芯片设置在封装的底部。 盖板具有板形。 该盖包括设置在板形中心的突出部。 突出部朝向包装体的外侧突出。

    Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case
    5.
    发明申请
    Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case 有权
    制造具有树脂模制外壳的电子装置和用于形成树脂模制壳体的模制工具的方法

    公开(公告)号：US20080296796A1

    公开(公告)日：2008-12-04

    申请号：US12156518

    申请日：2008-06-02

    申请人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    发明人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    IPC分类号： B29C45/00

    CPC分类号： H01L21/565 ,  B29C45/0046 ,  B29C45/14639 ,  B29C45/2708 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

    摘要翻译： 在制造电子设备的方法中，电子元件设置在与连接器端子电耦合的布线板上，布线板的第一表面被第一壳体元件覆盖，并且布线板的第二表面是 覆盖有第二壳体元件以形成电子电路部分，电子电路部分设置在模制工具的壳体腔中，并且将树脂填充到壳体腔中以形成树脂模制壳体，同时保持 将第一壳体元件推向布线板并随时间变化的第一压力基本上等于将第二壳体元件推向布线板并随时间变化的第二压力。

    Sensor apparatus
    7.
    发明申请
    Sensor apparatus 审中-公开
    传感器装置

    公开(公告)号：US20080236307A1

    公开(公告)日：2008-10-02

    申请号：US12079029

    申请日：2008-03-24

    申请人： Tatsuya Watanabe ,  Masahiko Imoto

    发明人： Tatsuya Watanabe ,  Masahiko Imoto

    IPC分类号： G01M19/00

    CPC分类号： G01D11/245

    摘要： A sensor apparatus includes a sensor body made of resin, an electronic circuit housed in the sensor body and constructed with electronic devices configured to detect a physical quantity and output a sensor signal indicative of the detected physical quantity, connector terminals for electrically connecting the electronic circuit to an external apparatus. The terminals are supported by the sensor body and have first end portions located outside the sensor body and second end portions located inside the sensor body. The electronic devices are physically and electrically connected directly to the second end portions of the terminals. The electronic devices and the second end portions of the terminals are integrally molded in the sensor body.

    摘要翻译： 一种传感器装置，包括由树脂制成的传感器主体，容纳在传感器主体中的电子电路，其构造为具有检测物理量的电子装置，并输出表示检测到的物理量的传感器信号，用于电连接电子电路的连接器端子 到外部设备。 端子由传感器主体支撑，并且具有位于传感器主体外部的第一端部和位于传感器主体内部的第二端部。 电子设备物理地和电连接到终端的第二端部。 电子装置和端子的第二端部一体地模制在传感器主体中。

    Physical quantity sensor and semiconductor device having package and cover
    10.
    发明申请
    Physical quantity sensor and semiconductor device having package and cover 有权
    物理量传感器和具有封装和封盖的半导体器件

    公开(公告)号：US20080224304A1

    公开(公告)日：2008-09-18

    申请号：US12072319

    申请日：2008-02-26

    申请人： Tatsuya Watanabe ,  Masahiko Imoto

    发明人： Tatsuya Watanabe ,  Masahiko Imoto

    IPC分类号： H01L23/055

    CPC分类号： H01L23/04 ,  H01L23/053 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.

    摘要翻译： 半导体器件包括：半导体芯片; 用于容纳所述芯片的封装，其中所述封装具有带有开口和底部的盒形; 以及用于密封包装的开口的盖。 半导体芯片设置在封装的底部。 盖板具有板形。 该盖包括设置在板形中心的突出部。 突出部朝向包装体的外侧突出。