公开(公告)号：US06457235B1

公开(公告)日：2002-10-01

申请号：US09590288

申请日：2000-06-09

申请人： Te-Tsung Chuo ,  Hui-Chin Fang

发明人： Te-Tsung Chuo ,  Hui-Chin Fang

IPC分类号： H01R900

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49111 ,  H01L2224/4942 ,  H01L2224/49429 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： An integrated circuit device includes a substrate with a contact unit, an integrated circuit chip with a bonding pad unit, and a bonding wire interconnecting the bonding pad unit and the contact unit. The bonding wire has a electrical bonding contact attached to the bonding pad unit, a first extension portion extending from the electrical bonding contact in a direction that inclines slightly and upwardly relative to a plane of the substrate toward the contact unit, and a second extension portion extending from the first extension portion and attached to the contact unit.

摘要翻译： 集成电路装置包括具有接触单元的基板，具有接合焊盘单元的集成电路芯片和将接合焊盘单元和接触单元互连的接合线。 所述接合线具有附接到所述接合焊盘单元的电接合触点，所述第一延伸部从所述电接合触点沿相对于所述基板的平面朝向所述接触单元的略微向上倾斜的方向延伸，以及第二延伸部 从第一延伸部延伸并附接到接触单元。

公开(公告)号：US06391759B1

公开(公告)日：2002-05-21

申请号：US09558836

申请日：2000-04-27

申请人： Te-Tsung Chao ,  Hui-Chin Fang

发明人： Te-Tsung Chao ,  Hui-Chin Fang

IPC分类号： H01L2144

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49179 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01039 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/48095

摘要： A bonding method which prevents wire sweep and the wire structure thereof mainly provide the pre-shifted wire between the first bonding point and the second bonding point and counter to the mold flow from the side thus intensifying the strength of the wire structure and increasing the deformation space of the wire sustaining mold flow.

摘要翻译： 防止线扫及其线结构的接合方法主要在第一接合点和第二接合点之间提供预换线，并且与侧面的模具流相反，从而增强线结构的强度并增加变形 电线维持模具空间。