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107 条记录 (耗时 0.027 秒)

    Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins
    1.
    发明授权
    Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins 失效
    用于LGA安装集成电路的背板有助于IC引脚的探测

    公开(公告)号：US5883788A

    公开(公告)日：1999-03-16

    申请号：US741649

    申请日：1996-10-31

    申请人： Douglas S. Ondricek ,  Terrel L. Morris ,  Eric C. Peterson

    发明人： Douglas S. Ondricek ,  Terrel L. Morris ,  Eric C. Peterson

    IPC分类号： H05K1/14 ,  G01R1/04 ,  G01R1/073 ,  H01L23/32 ,  H05K7/12 ,  H01R9/09

    CPC分类号： G01R1/07314 ,  G01R1/0483

    摘要： A backing plate facilitates electrical probing of VLSI IC signals in an array of signal via pads on the back side of a printed circuit board and which correspond to an LGA of socket pads on the front side of the printed circuit board. The backing plate is constructed of electrically non conductive mechanically stiff material that already has drilled therein a hole for each signal via pad that might be probed. Polyamide is a suitable material for such a backing plate. Special symbols, legends and suitable grid identification axes can be silk screened onto the side of the backing plate that remains visible when installed. The drilled insulative backing plate can be equipped with captive threaded studs, if desired. Alternatively, it may simply have holes to receive fasteners, or have captive female threaded fasteners in lieu of holes.

    摘要翻译： 背板有助于在印刷电路板背面的信号通孔焊盘阵列中对VLSI IC信号进行电探测，并且其对应于印刷电路板正面上的插座焊盘的LGA。 背板由非导电的机械刚性材料构成，其已经在其中钻有用于可能被探测的每个信号通孔垫的孔。 聚酰胺是这种背板的合适材料。 特殊符号，图例和合适的网格识别轴可以丝网印刷到背板上，安装时仍然可见。 如果需要，钻孔的绝缘背板可以装有固定螺柱。 或者，它可以简单地具有用于接收紧固件的孔，或者具有用于代替孔的固定内螺纹紧固件。

    Power module for a plurality of processors
    2.
    发明授权
    Power module for a plurality of processors 有权
    用于多个处理器的电源模块

    公开(公告)号：US07464280B2

    公开(公告)日：2008-12-09

    申请号：US11158430

    申请日：2005-06-22

    申请人： Terrel L Morris ,  Eric C. Peterson

    发明人： Terrel L Morris ,  Eric C. Peterson

    IPC分类号： G06F1/00

    CPC分类号： G06F1/26

    摘要： In at least some embodiments, a multi-processor power module comprises components that are replicated at least for each of the plurality of processors. The multi-processor power module further comprises control logic that is configured to detect a demand from each of the plurality of processors and to direct the replicated components to provide a regulated power based on the demand, the regulated power being output for sharing among the plurality of processors.

    摘要翻译： 在至少一些实施例中，多处理器功率模块包括至少针对多个处理器中的每一个复制的组件。 多处理器功率模块还包括控制逻辑，其被配置为检测来自多个处理器中的每一个的需求，并且基于需求来引导复制组件提供调节功率，输出的稳压功率用于在多个处理器之间共享 的处理器。

    Packaging architecture for 32 processor server
    3.
    发明授权
    Packaging architecture for 32 processor server 有权
    32处理器服务器的包装架构

    公开(公告)号：US06452789B1

    公开(公告)日：2002-09-17

    申请号：US09562593

    申请日：2000-04-29

    申请人： Lisa Heid Pallotti ,  Eric C. Peterson ,  Christian L Belady ,  Terrel L. Morris ,  Michael C. Day

    发明人： Lisa Heid Pallotti ,  Eric C. Peterson ,  Christian L Belady ,  Terrel L. Morris ,  Michael C. Day

    IPC分类号： G06F1200

    CPC分类号： G06F15/16

    摘要： The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.

    摘要翻译： 本发明的系统使用背板来互连多个模块化单元板。 每个单元板包括多个处理器，处理器控制器芯片，存储器子系统和电源子系统。 处理器控制器芯片管理单元板上的组件之间的通信。 机械子组件为电池板提供支撑，以及用于冷却的通风通道。 控制器芯片连接到背板的一侧，而单元板连接到另一侧。 控制器芯片管理单元板到单元板通信，以及背板和计算机系统之间的通信。 单元板布置成背靠背对，其中最外面的单元板具有其组件延伸超出背板的高度。 这允许相邻电池板的前面与前面之间的间隔增加。

    Grounding clip for shielded modular connector
    4.
    发明授权
    Grounding clip for shielded modular connector 失效
    屏蔽模块连接器接地夹

    公开(公告)号：US5838550A

    公开(公告)日：1998-11-17

    申请号：US919461

    申请日：1997-08-28

    申请人： Terrel L. Morris ,  Eric C. Peterson ,  Jeffrey N. Metcalf

    发明人： Terrel L. Morris ,  Eric C. Peterson ,  Jeffrey N. Metcalf

    IPC分类号： H01R13/658 ,  H01R13/74 ,  H01R24/64 ,  H05K9/00

    CPC分类号： H01R13/65802 ,  H01R13/74 ,  H01R24/64 ,  Y10S439/939

    摘要： A shortened ground path for the shield of a shielded modular connector (e.g., RJ-45, etc.) mounted against a bracket that is to be seated against a slot in a chassis is provided by a metallic grounding clip that slips over the bracket. The clip has edges that have been folded to slidably engage the bracket, and an orifice shaped to match the opening of the modular jack, so that the modular plug may pass through that orifice as it mates with the jack. The clip also has two opposing curved metal contacts along the perimeter of the orifice that engage and bear against the exposed shield portion of the modular plug as it mates with the modular jack. A pair of metal tabs engage the opening of the modular jack to align, or register, the orifice in the clip with the opening of the jack, and prevent the clip from easily sliding along the bracket once registration has been achieved. Since the grounding clip is as wide as the bracket, when the circuit assembly (I/O board) having the bracket is installed in the chassis the clip contacts the chassis directly, just as the bracket does. But the clip is also in direct contact with the shield of the modular plug whenever it is connected to the jack. Thus the grounding clip provides a direct path from the shield on the modular plug to the chassis.

    摘要翻译： 屏蔽模块化连接器（例如，RJ-45等）的屏蔽层的一个缩短的接地路径是通过滑动在支架上的金属接地夹提供的。 夹子具有已经被折叠以可滑动地接合支架的边缘，以及形状为匹配模块插座的开口的孔口，使得模块化插头可以在与插座配合时通过该孔口。 夹子还具有沿着孔口周边的两个相对的弯曲金属触点，其与模块化插座配合时接合并抵靠模块化插头的暴露的屏蔽部分。 一对金属突片接合模块插座的开口，以将夹子中的孔与插座的开口对准或对准，并且一旦实现了对准，就防止夹子沿着支架容易地滑动。 由于接地夹与支架一样宽，当带有支架的电路组件（I / O板）安装在机箱中时，夹具就像支架一样直接接触机箱。 但是当夹子连接到插孔时，夹子也与模块插头的屏蔽件直接接触。 因此，接地夹提供从模块化插头上的屏蔽到机箱的直接路径。

    Localized weather prediction through utilization of cameras
    5.
    发明授权
    Localized weather prediction through utilization of cameras 有权
    通过利用摄像机进行本地化天气预报

    公开(公告)号：US09069103B2

    公开(公告)日：2015-06-30

    申请号：US12970972

    申请日：2010-12-17

    申请人： Charles Joseph Williams ,  Gabriel Kliot ,  Chia-Chi Lin ,  Shaun L. Harris ,  Christian L. Belady ,  Eric C. Peterson

    发明人： Charles Joseph Williams ,  Gabriel Kliot ,  Chia-Chi Lin ,  Shaun L. Harris ,  Christian L. Belady ,  Eric C. Peterson

    IPC分类号： G01D3/00 ,  G01W1/00 ,  G06K9/00

    CPC分类号： G05F1/66 ,  G01W1/00 ,  G06K9/0063 ,  G06N5/048

    摘要： Described herein are various technologies pertaining to predicting an amount of electrical power that is to be generated by a power system at a future point in time, wherein the power system utilizes a renewable energy resource to generate electrical power. A camera is positioned to capture an image of sky over a geographic region of interest. The image is analyzed to predict an amount of solar radiation that is to be received by the power source at a future point in time. The predicted solar radiation is used to predict an amount of electrical power that will be output by the power system at the future point in time. A computational resource of a data center that is powered by way of the power source is managed as a function of the predicted amount of power.

    摘要翻译： 这里描述的是关于预测在未来时间点由电力系统产生的电力量的各种技术，其中电力系统利用可再生能源来产生电力。 相机被定位成在感兴趣的地理区域上捕获天空的图像。 分析图像以预测未来时间点将由电源接收的太阳辐射量。 预测的太阳辐射用于预测未来时间点将由电力系统输出的电力量。 通过电源供电的数据中心的计算资源根据预测的功率量进行管理。

    Hierarchical power smoothing
    8.
    发明授权
    Hierarchical power smoothing 有权
    分层功率平滑

    公开(公告)号：US08487473B2

    公开(公告)日：2013-07-16

    申请号：US12822949

    申请日：2010-06-24

    申请人： Eric C. Peterson ,  Shaun L. Harris ,  Christian L. Belady ,  Frank J. Wirtz

    发明人： Eric C. Peterson ,  Shaun L. Harris ,  Christian L. Belady ,  Frank J. Wirtz

    IPC分类号： H02J1/10 ,  H02J3/00 ,  H02J3/14

    CPC分类号： G06F1/263 ,  G06F1/3206 ,  G06F1/3234 ,  H02J9/06 ,  Y10T307/305 ,  Y10T307/391 ,  Y10T307/615 ,  Y10T307/696

    摘要： Power is provided to one or more devices in a system that includes a hierarchical power smoothing environment having multiple tiers. In response to a peak in power usage by the one or more devices, power is provided from a first power smoothing component in a first tier of the multiple tiers. Additionally, power is provided to the one or more devices from power smoothing components in each of other tiers of the multiple tiers if the power smoothing component in a next lower tier of the multiple tiers is unable to provide sufficient power for the peak in power usage. If the power smoothing components in the multiple tiers are unable to provide sufficient power for the peak in power usage, then performance of at least one of the one or more devices is reduced in response to the peak in power usage.

    摘要翻译： 电力被提供给系统中的一个或多个设备，该系统包括具有多个层的分层功率平滑环境。 响应于一个或多个设备的电力使用的峰值，从多层的第一层中的第一功率平滑组件提供功率。 此外，如果多层下一层较低层中的功率平滑分量不能为功率使用中的峰值提供足够的功率，则向多个设备中的功率平滑组件提供功率平滑组件给多个层的每个其他层中的功率平滑组件 。 如果多层中的功率平滑分量不能为功率使用中的峰值提供足够的功率，则响应于功率使用的峰值来降低一个或多个设备中的至少一个的性能。