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公开(公告)号:US06504968B1
公开(公告)日:2003-01-07
申请号:US09650990
申请日:2000-08-30
申请人: Terry D. Zhu , John S. McKillop , Mark D. Walters
发明人: Terry D. Zhu , John S. McKillop , Mark D. Walters
IPC分类号: G02B635
CPC分类号: G02B6/3584 , G02B6/3514 , G02B6/3546 , G02B6/355 , G02B6/357 , G02B6/358 , G02B6/3596 , G02B26/0833 , G02B26/085
摘要: Embodiments of the present invention can provide a substrate and a moveable reflector, on the substrate, having first and second opposing surfaces, wherein the moveable reflector moves to first and second positions on the substrate. A latch is located on the substrate adjacent to the first surface of the moveable reflector opposite the second surface and coupled to the moveable reflector, wherein the latch holds the moveable reflector in the first and second positions. An actuator is located on the substrate adjacent to the first surface of the moveable reflector opposite the second surface and is coupled to the latch, wherein the actuator moves the moveable reflector to the first and second positions. Also disclosed are moveable reflectors having a first reflecting position along an input beam path that reflects optical radiation from the input beam path along a first reflected beam path and a second reflecting position along the input beam path spaced-apart from the first reflecting position that reflects optical radiation from the input beam path along a second reflected beam path parallel to the first reflected beam path. Related methods are also disclosed.
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2.
公开(公告)号:US5387777A
公开(公告)日:1995-02-07
申请号:US903644
申请日:1992-06-24
申请人: Reid S. Bennett , Albert R. Ellingboe , George G. Gifford , Kurt L. Haller , John S. McKillop , Gary S. Selwyn , Jyothi Singh
发明人: Reid S. Bennett , Albert R. Ellingboe , George G. Gifford , Kurt L. Haller , John S. McKillop , Gary S. Selwyn , Jyothi Singh
IPC分类号: C23F4/00 , C23C16/44 , C23C16/515 , H01J37/32 , H01L21/302 , B23K10/00 , B05D3/06 , B44C1/22
CPC分类号: H01J37/32862 , C23C16/44 , C23C16/4401 , C23C16/515 , H01J2237/022 , Y10S156/916
摘要: Contamination levels in plasma processes are reduced during plasma processing, by prevention of formation of particles, by preventing entry of particles externally introduced or by removing particles spontaneously formed from chemical and/or mechanical sources. Some techniques for prevention of formation of particles include interruption of the plasma by pulsing the source of plasma energy periodically, or application of energy to provide mechanical agitation such as mechanical shockwaves, acoustic stress, ultrasonic stress, vibrational stress, thermal stress, and pressure stress. Following a period of applied stress, a tool is pumped out (if a plasma is used, the glow is first discontinued), vented, opened and flaked or particulate material is cleaned from the lower electrode and other surfaces. A burst of filtered air or nitrogen, or a vacuum cleaner is used for removal of deposition debris while the vented tool is open. Following this procedure, the tool is then be used for product runs. Alternatively, improvement of semiconductor process yields can be achieved by addition of reagents to getter chemical precursors of contamination particulates and by filtration of particulates from feedgas before plasma processing. The efficiency and endpoint for the applied stress are determined, by laser light scattering, using a pulsed or continuous laser source, e.g. a HeNe laser.
摘要翻译: 等离子体处理中的污染水平通过防止颗粒的形成,通过防止外部引入的颗粒进入或通过除去由化学和/或机械源自发形成的颗粒而减少等离子体处理中的污染水平。 用于防止颗粒形成的一些技术包括通过周期性地脉冲等离子体能量源或者施加能量以提供诸如机械冲击波,声应力,超声应力,振动应力,热应力和压力应力之类的机械搅拌来中断等离子体 。 经过一段时间的施加应力,泵出一个工具(如果使用等离子体,则首先停止发光),从下部电极和其他表面清除通风,打开和剥落或颗粒物质。 过滤的空气或氮气的爆裂或真空吸尘器用于在通风工具打开时去除沉积物。 按照此过程,然后将该工具用于产品运行。 或者,半导体工艺产量的改善可以通过添加试剂来吸收污染物颗粒的化学前体并且在等离子体处理之前通过过滤来自原料气的颗粒来实现。 通过激光散射确定施加的应力的效率和终点,使用脉冲或连续的激光源,例如, HeNe激光。
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3.
公开(公告)号:US5367139A
公开(公告)日:1994-11-22
申请号:US425659
申请日:1989-10-23
申请人: Reid S. Bennett , Albert R. Ellingboe , George G. Gifford , Kurt L. Haller , John S. McKillop , Gary S. Selwyn , Jyothi Singh
发明人: Reid S. Bennett , Albert R. Ellingboe , George G. Gifford , Kurt L. Haller , John S. McKillop , Gary S. Selwyn , Jyothi Singh
IPC分类号: C23F4/00 , C23C16/44 , C23C16/515 , H01J37/32 , H01L21/302 , B23K9/00
CPC分类号: H01J37/32862 , C23C16/44 , C23C16/4401 , C23C16/515 , H01J2237/022 , Y10S156/916
摘要: Contamination levels in plasma processes are reduced during plasma processing, by prevention of formation of particles, by preventing entry of particles externally introduced or by removing particles spontaneously formed from chemical and/or mechanical sources. Some techniques for prevention of formation of particles include interruption of the plasma by pulsing the source of plasma energy periodically, or application of energy to provide mechanical agitation such as mechanical shockwaves, acoustic stress, ultrasonic stress, vibrational stress, thermal stress, and pressure stress. Following a period of applied stress, a tool is pumped out (if a plasma is used, the glow is first discontinued), vented, opened and flaked or particulate material is cleaned from the lower electrode and other surfaces. A burst of filtered air or nitrogen, or a vacuum cleaner is used for removal of deposition debris while the vented tool is open.
摘要翻译: 等离子体处理中的污染水平通过防止颗粒的形成,通过防止外部引入的颗粒进入或通过除去由化学和/或机械源自发形成的颗粒而减少等离子体处理中的污染水平。 用于防止颗粒形成的一些技术包括通过周期性地脉冲等离子体能量源或者施加能量以提供诸如机械冲击波,声应力,超声应力,振动应力,热应力和压力应力之类的机械搅拌来中断等离子体 。 经过一段时间的施加应力,泵出一个工具(如果使用等离子体,则首先停止发光),从下部电极和其他表面清除通风,打开和剥落或颗粒物质。 过滤的空气或氮气的爆裂或真空吸尘器用于在通风工具打开时去除沉积物。
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