METHODS FOR FORMING COMPOSITIONS CONTAINING GLASS
    2.
    发明申请
    METHODS FOR FORMING COMPOSITIONS CONTAINING GLASS 审中-公开
    用于形成包含玻璃的组合物的方法

    公开(公告)号:US20100071418A1

    公开(公告)日:2010-03-25

    申请号:US12526900

    申请日:2008-02-27

    IPC分类号: C03B17/00

    摘要: Methods for molding glass and glass composites, including providing a first structure having a first surface, providing a second structure having a second surface, the second surface being patterned and porous, and disposing between the first and second surfaces an amount of a composition comprising a glass, then heating together the first and second structures and the first amount of the composition sufficiently to soften the first amount of the composition such that the first and second structures, under gravity or an otherwise applied force, move toward each other, such that the pattern of the second surface is formed into the first amount of the composition, then cooling the composition sufficiently to stabilize it, the second structure comprising porous carbon having an open porosity of at least 5% and wherein the amount of the composition is removable from the second surface, without damage to the amount of the composition or to the second surface, such that the second surface is in condition for re-use.

    摘要翻译: 用于模制玻璃和玻璃复合材料的方法,包括提供具有第一表面的第一结构,提供具有第二表面的第二结构,第二表面被图案化和多孔化,并且在第一表面和第二表面之间设置一定量的组合物, 玻璃,然后将第一和第二结构和第一量的组合物充分加热以软化第一量的组合物,使得第一和第二结构在重力或以其他方式施加的力下朝向彼此移动,使得 将第二表面的图案形成为第一量的组合物,然后充分冷却组合物以使其稳定,第二结构包括具有至少5%的开放孔隙率的多孔碳,并且其中组合物的量可从 第二表面,而不损害组合物的量或第二表面,使得第二表面是 在重新使用的条件下。

    ENERGY CONVERSION DEVICES AND METHODS
    8.
    发明申请
    ENERGY CONVERSION DEVICES AND METHODS 审中-公开
    能量转换装置和方法

    公开(公告)号:US20110197941A1

    公开(公告)日:2011-08-18

    申请号:US13125396

    申请日:2009-10-23

    IPC分类号: H01L35/30 F01N3/10

    摘要: An energy conversion device may include at least one hot source chamber (255, 355) configured to receive a hot fluid, at least one cold source chamber (275, 375) configured to receive a coolant, and a plurality of thermoelectric elements (272, 273, 773) in thermal communication with the at least one hot source chamber (255, 355) and at least one cold source chamber (275, 375), the thermoelectric elements being configured to create an electric potential when exposed to a temperature gradient. The at least one hot source chamber (255, 355) can be configured to perform catalytic conversion of the hot fluid received therein. The at least one hot source chamber (255, 355) and the at least one cold source chamber (275, 375) may be formed from a material having a relatively low coefficient of thermal expansion.

    摘要翻译: 能量转换装置可包括至少一个被配置为接收热流体的热源室(255,355),至少一个被配置为容纳冷却剂的冷源室(275,375)和多个热源元件 273,773)与所述至少一个热源室(255,355)和至少一个冷源室(275,375)热连通,所述热电元件被配置为当暴露于温度梯度时产生电位。 所述至少一个热源室(255,355)可被构造成对其中接收的热流体进行催化转化。 至少一个热源室(255,355)和至少一个冷源室(275,375)可以​​由具有相对低的热膨胀系数的材料形成。

    Thermoelectric Device
    10.
    发明申请
    Thermoelectric Device 审中-公开
    热电装置

    公开(公告)号:US20090277489A1

    公开(公告)日:2009-11-12

    申请号:US12376886

    申请日:2006-12-08

    IPC分类号: H01L35/34 H01L35/00

    CPC分类号: H01L35/34 H01L35/32

    摘要: A thermoelectric device is provided which comprises a plurality of elements of a thermoelectric material, which are preferably either all of n-type material or all p-type. In this preferred device, each element has a first end region for exposure to a first temperature, and a second end region for exposure to a second temperature, with the temperature gradient being in the same direction in each of the elements, so each element develops a voltage between its end regions in the same direction. The first end regions of the elements are mounted on a substrate, but the second end regions of the elements are at least substantially free to move with respect to one another. The elements are connected electrically in series, so that the series connection produces a net voltage, the electrical connections being designed to produce only a small amount of heat conduction.

    摘要翻译: 提供了一种热电装置,其包括热电材料的多个元件,其优选地是n型材料或全部是p型。 在该优选装置中,每个元件具有用于暴露于第一温度的第一端部区域和用于暴露于第二温度的第二端部区域,其中温度梯度在每个元件中沿相同的方向,因此每个元件产生 其端部区域之间的电压在相同方向。 元件的第一端部区域安装在基板上,但是元件的第二端部区域至少基本上相对于彼此自由移动。 这些元件串联电连接,使得串联连接产生净电压,电连接被设计成仅产生少量的热传导。