摘要:
The present invention is a two-layer shadow mask with small dimension apertures and method of making and using same. The two-layer shadow mask of the present invention is suitable for use for manufacturing an electronic device via deposition in a production system. The two-layer shadow mask of the present invention is formed by a first thick mask, which includes a plurality of apertures that has been formed, for example, by etching, bonded to a second, comparatively thin mask, that has been formed by an electrolytic process, and which includes a plurality of apertures that has been patterned by a photoresist. The second mask is aligned and bonded atop the first mask, with their respective apertures desirably offset one to another. The offset amount of the respective apertures of the two-layer shadow mask determines the resulting final aperture dimension, which may approach 0 microns, through which material is deposited upon a substrate in a deposition production system.
摘要:
A shadow mask deposition system includes a plurality of identical shadow masks arranged in a number of stacks to form a like number of compound shadow masks, each of which is disposed in a deposition vacuum vessel along with a material deposition source. Materials from the material deposition sources are deposited on the substrate via openings in corresponding compound shadow masks, each opening being formed by the whole or partial alignment of apertures in the shadow masks forming the compound shadow mask, to form an array of electronic elements on the substrate.
摘要:
A multi-layer electronic device can be formed to include an insulative substrate (212), a first vapor deposited conductor layer (312) on the insulative substrate (212), a first vapor deposited insulator layer (314) on the first conductor layer (312), the first insulator layer (314) having at least one via hole (316) therein, and a vapor deposited conductive filler (320) in the via hole (316) of the first insulator layer (314). Desirably, the conductive filler (320) is deposited in the via hole (316) of the first insulator layer (314) such that the surface of the conductive filler (320) opposite the first conductor layer (312) is substantially planar with the surface of the first insulator layer (314) opposite the first conductor layer (312).
摘要:
Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least two shadow masks associated therewith. Each of the two masks is alternately positioned within the corresponding deposition vessel for patterning the deposition material onto the substrate through apertures in the mask positioned therein, and positioned in an adjacent cleaning vessel for mask cleaning. The patterning onto the substrate and the cleaning of at least one of the masks are performed concurrently.
摘要:
Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.
摘要:
A deposition system uses the same low coefficient of thermal expansion (CTE) material, for example, a CTE of below 10 ppm/° C. in the temperature range of 0-200° C., for forming both a shadow mask and a substrate upon which depositions occur in order to overcome the heating effects of a high-temperature deposition process, thereby ensuring a uniform expansion and contraction rate of the shadow mask and the substrate.
摘要:
Evaporated receptacles for inkjet deposited polymeric light-emitting diode (PLED)/organic light-emitting diode (OLED) and a method of making the same. The evaporated receptacles are formed via a shadow mask vacuum deposition process. The method of forming a light-emitting display includes forming an electrode on a substrate, forming a receptacle structure over the electrode via a shadow mask vacuum deposition process, and delivering a quantity of polymeric solution, which contains a light-emitting material, into the receptacle via a standard inkjet deposition process.
摘要:
Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.
摘要:
Evaporated receptacles for inkjet deposited polymeric light-emitting diode (PLED)/organic light-emitting diode (OLED) and a method of making the same. The evaporated receptacles are formed via a shadow mask vacuum deposition process. The method of forming a light-emitting display includes forming an electrode on a substrate, forming a receptacle structure over the electrode via a shadow mask vacuum deposition process, and delivering a quantity of polymeric solution, which contains a light-emitting material, into the receptacle via a standard inkjet deposition process.
摘要:
A scalable tiled display assembly that includes an array of independently addressed active-matrix organic light-emitting diode (OLED) display tiles cabled to a central control module. Each display tile includes a frame, a driver sub-module, and a flat ribbon cable for connecting the driver sub-module to the display tile. Furthermore, column and row drivers are integrated within each display tile for improved performance and minimal external connections. The invention further includes a method of forming a scalable tiled display system that includes the steps of assembling a plurality of display tile assemblies, determining the viewable area of the display, assembling an array of display tile assemblies according to the desired viewable area, and activating the scalable tiled display system.