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公开(公告)号：US5922628A
公开(公告)日：1999-07-13
申请号：US28591
申请日：1998-02-23
CPC分类号： C04B41/5059 , C04B37/005 , C04B37/006 , C04B37/008 , C04B41/009 , C04B41/87 , C04B2235/5244 , C04B2235/5256 , C04B2235/5268 , C04B2235/528 , C04B2235/5436 , C04B2235/6562 , C04B2235/6567 , C04B2235/661 , C04B2235/665 , C04B2237/083 , C04B2237/121 , C04B2237/126 , C04B2237/128 , C04B2237/36 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/38 , C04B2237/708 , C04B2237/78 , Y10S977/776 , Y10S977/777 , Y10S977/897 , Y10T428/252 , Y10T428/31678
摘要： A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or ceramic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix.
摘要翻译： 在相对低的接合温度下接合类似或不同的陶瓷和陶瓷复合材料如SiC连续纤维陶瓷复合材料的方法使用无溶剂的三组分粘结剂，其有效地促进机械粘结韧性和提高的温度强度至约1200的操作温度 粘合剂包括预陶瓷前体，铝合金粉末，例如铝合金粉末，以及铝金属或合金粉末与另一种粉末的混合物，以及选定比例的硼粉末。 粘合剂作为待接合的相似或不同的陶瓷或陶瓷复合材料之间的中间层设置，并在环境空气或惰性气氛中加热至不超过约1200摄氏度的温度，以在材料之间形成牢固且坚韧的粘合接头 。 所生产的粘合接头的特征在于具有分散在陶瓷基体中的具有相对柔软的柔性铝轴承微粒区域的复合接头微结构。
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公开(公告)号：US5858144A
公开(公告)日：1999-01-12
申请号：US631259
申请日：1996-04-12
IPC分类号： C04B37/00
CPC分类号： C04B41/5059 , C04B37/005 , C04B37/006 , C04B37/008 , C04B41/009 , C04B41/87 , C04B2235/5244 , C04B2235/5256 , C04B2235/5268 , C04B2235/528 , C04B2235/5436 , C04B2235/6562 , C04B2235/6567 , C04B2235/661 , C04B2235/665 , C04B2237/083 , C04B2237/121 , C04B2237/126 , C04B2237/128 , C04B2237/36 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/38 , C04B2237/708 , C04B2237/78 , Y10S977/776 , Y10S977/777 , Y10S977/897 , Y10T428/252 , Y10T428/31678
摘要： A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or cermaic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix.
摘要翻译： 在相对低的接合温度下接合类似或不同的陶瓷和陶瓷复合材料如SiC连续纤维陶瓷复合材料的方法使用无溶剂的三组分粘结剂，其有效地促进机械粘结韧性和提高的温度强度至约1200的操作温度 粘合剂包括预陶瓷前体，铝合金粉末，例如铝合金粉末，以及铝金属或合金粉末与另一种粉末的混合物，以及选定比例的硼粉末。 粘合剂作为待接合的相似或不同的陶瓷或复合材料之间的中间层设置，并在环境空气或惰性气氛中加热至不超过约1200摄氏度的温度，以在材料之间形成牢固且坚韧的粘合接头 。 所生产的粘合接头的特征在于具有分散在陶瓷基体中的具有相对柔软的柔性铝轴承微粒区域的复合接头微结构。
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公开(公告)号：US06214472B1
公开(公告)日：2001-04-10
申请号：US09291542
申请日：1999-04-14
IPC分类号： B32B904
CPC分类号： C04B41/5059 , C04B37/005 , C04B37/006 , C04B37/008 , C04B41/009 , C04B41/87 , C04B2235/5244 , C04B2235/5256 , C04B2235/5268 , C04B2235/528 , C04B2235/5436 , C04B2235/6562 , C04B2235/6567 , C04B2235/661 , C04B2235/665 , C04B2237/083 , C04B2237/121 , C04B2237/126 , C04B2237/128 , C04B2237/36 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/38 , C04B2237/708 , C04B2237/78 , Y10S977/776 , Y10S977/777 , Y10S977/897 , Y10T428/252 , Y10T428/31678 , C04B35/565 , C04B41/4539 , C04B41/4554 , C04B41/4576 , C04B41/5094 , C04B41/5155
摘要： A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or cermaic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix.
摘要翻译： 在相对低的接合温度下接合类似或不同的陶瓷和陶瓷复合材料如SiC连续纤维陶瓷复合材料的方法使用无溶剂的三组分粘结剂，其有效地促进机械粘结韧性和提高的温度强度至约1200的操作温度 粘合剂包括预陶瓷前体，铝合金粉末，例如铝合金粉末，以及铝金属或合金粉末与另一种粉末的混合物，以及选定比例的硼粉末。 粘合剂作为待接合的相似或不同的陶瓷或复合材料之间的中间层设置，并在环境空气或惰性气氛中加热至不超过约1200摄氏度的温度，以在材料之间形成牢固且坚韧的粘合接头 。 所生产的粘合接头的特征在于具有分散在陶瓷基体中的具有相对柔软的柔性铝轴承微粒区域的复合接头微结构。
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公开(公告)号：US09263305B2
公开(公告)日：2016-02-16
申请号：US13599648
申请日：2012-08-30
申请人： Kevin Ptasienski , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
发明人： Kevin Ptasienski , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.
摘要翻译： 例如，提供一种用于半导体处理设备的加热器，该加热器包括具有至少一个功能区的基本功能层。 将基板固定到基底功能层，并且调谐层固定到与基底功能层相对的基板。 调谐层包括多个区域，其数量大于基底功能层的区域，并且调谐层具有比基底功能层低的功率。 此外，通过示例的方式将诸如卡盘的部件固定到与基板相对的调谐层。 衬底限定热导率以从基底功能层消散所需量的功率。
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公开(公告)号：US09553006B2
公开(公告)日：2017-01-24
申请号：US13599692
申请日：2012-08-30
申请人： Kevin Ptasienski , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
发明人： Kevin Ptasienski , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.
摘要翻译： 提供了一种诸如加热器的装置，其包括具有至少一个流体通道的基座构件。 两相流体设置在流体通道内，两相流体的压力被控制，使得两相流体提供加热和冷却至少一个到基底构件。 调谐层被固定到基底构件上，调谐层包括多个区域。 此外，通过示例的方式将诸如卡盘的部件固定到调谐层。
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公开(公告)号：US20130228548A1
公开(公告)日：2013-09-05
申请号：US13599781
申请日：2012-08-30
申请人： Kevin Ptasienski , Allen Norman Boldt , Janet Lea Smith , Cal Thomas Swanson , Mohammad Nosrati , Kevin Robert Smith
发明人： Kevin Ptasienski , Allen Norman Boldt , Janet Lea Smith , Cal Thomas Swanson , Mohammad Nosrati , Kevin Robert Smith
IPC分类号： H01L21/683
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.
摘要翻译： 提供制造加热器的方法，其通常包括形成具有介电层，第一双面粘合介电层和导电层的层压体。 接下来，在导电层中形成电路图案，然后用第二双面粘合介电层覆盖电路图案。 第二双面粘合介电层被牺牲层覆盖，然后形成加热器，加热器包括电介质层，第一双面粘合介电层，导电层和第二双面粘合介电层 层。 随后，除去牺牲层。
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公开(公告)号：US4704934A
公开(公告)日：1987-11-10
申请号：US5479
申请日：1987-01-20
申请人： Mohammad Nosrati
发明人： Mohammad Nosrati
CPC分类号： A63H5/00 , A63H27/10 , A63H2027/1058 , A63H2027/1091
摘要： A musical balloon has an electronic music-producing device contained within an inner, nearly opaque balloon. An outer balloon of any desired color and design, more light transmissive than the inner balloon, covers the inner balloon. The electronic music-producing device includes an on/off switch sensitive to light. When the balloons are deflated, the rubber material is dense enough to keep light from activating the music. However, when the balloons are inflated, the rubber material is stretched to a more translucent condition, and sufficient light permeates the balloons to activate the switch and the music.
摘要翻译： 音乐气球具有包含在内部几乎不透明气球内的电子音乐制作装置。 任何期望的颜色和设计的外球囊，比内气球更透光，覆盖内气球。 电子音乐制作装置包括对光敏感的开/关开关。 当气球放气时，橡胶材料足够密实以防止光线激活音乐。 然而，当气囊膨胀时，橡胶材料被拉伸到更半透明的状态，并且足够的光透过气球以激活开关和音乐。
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公开(公告)号：US10049903B2
公开(公告)日：2018-08-14
申请号：US13599781
申请日：2012-08-30
申请人： Kevin Ptasienski , Allen Norman Boldt , Janet Lea Smith , Cal Thomas Swanson , Mohammad Nosrati , Kevin Robert Smith
发明人： Kevin Ptasienski , Allen Norman Boldt , Janet Lea Smith , Cal Thomas Swanson , Mohammad Nosrati , Kevin Robert Smith
IPC分类号： H01B13/00 , B44C1/22 , C03C15/00 , C03C25/68 , H01L21/67 , H05B3/20 , H05B1/02 , H05B1/00 , H05B3/02 , H01L21/683 , H05B3/06
摘要： Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.
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公开(公告)号：US20130220575A1
公开(公告)日：2013-08-29
申请号：US13599692
申请日：2012-08-30
申请人： Kevin Ptasienski , Kevin Robert SMITH , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
发明人： Kevin Ptasienski , Kevin Robert SMITH , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Robert Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
IPC分类号： H01L21/67 , H05B1/02 , H01L21/683
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.
摘要翻译： 提供了一种诸如加热器的装置，其包括具有至少一个流体通道的基座构件。 两相流体设置在流体通道内，两相流体的压力被控制，使得两相流体提供加热和冷却至少一个到基底构件。 调谐层被固定到基底构件上，调谐层包括多个区域。 此外，通过示例的方式将诸如卡盘的部件固定到调谐层。
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公开(公告)号：US20130161305A1
公开(公告)日：2013-06-27
申请号：US13599648
申请日：2012-08-30
申请人： Kevin PTASIENSKI , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
发明人： Kevin PTASIENSKI , Kevin Robert Smith , Cal Thomas Swanson , Philip Steven Schmidt , Mohammad Nosrati , Jacob Lindley , Allen Norman Boldt , Sanhong Zhang , Louis P. Steinhauser , Dennis Stanley Grimard
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要： An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.
摘要翻译： 例如，提供一种用于半导体处理设备的加热器，该加热器包括具有至少一个功能区的基本功能层。 将基板固定到基底功能层，并且调谐层固定到与基底功能层相对的基板。 调谐层包括多个区域，其数量大于基底功能层的区域，并且调谐层具有比基底功能层低的功率。 此外，通过示例的方式将诸如卡盘的部件固定到与基板相对的调谐层。 衬底限定热导率以从基底功能层消散所需量的功率。
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