利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

221 条记录 (耗时 0.042 秒)

    STRAINED SILICON-ON-INSULATOR BY ANODIZATION OF A BURIED p+ SILICON GERMANIUM LAYER
    3.
    发明申请
    STRAINED SILICON-ON-INSULATOR BY ANODIZATION OF A BURIED p+ SILICON GERMANIUM LAYER 审中-公开
    通过阳极氧化P +硅锗层的分级制备的绝缘硅绝缘体

    公开(公告)号：US20080277690A1

    公开(公告)日：2008-11-13

    申请号：US12176624

    申请日：2008-07-21

    申请人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam Shahidi

    发明人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam Shahidi

    IPC分类号： H01L27/12

    CPC分类号： H01L21/76259 ,  Y10S438/967

    摘要： A cost efficient and manufacturable method of fabricating strained semiconductor-on-insulator (SSOI) substrates is provided that avoids wafer bonding. The method includes growing various epitaxial semiconductor layers on a substrate, wherein at least one of the semiconductor layers is a doped and relaxed semiconductor layer underneath a strained semiconductor layer; converting the doped and relaxed semiconductor layer into a porous semiconductor via an electrolytic anodization process, and oxidizing to convert the porous semiconductor layer into a buried oxide layer. The method provides a SSOI substrate that includes a relaxed semiconductor layer on a substrate; a high-quality buried oxide layer on the relaxed semiconductor layer; and a strained semiconductor layer on the high-quality buried oxide layer. In accordance with the present invention, the relaxed semiconductor layer and the strained semiconductor layer have identical crystallographic orientations.

    摘要翻译： 提供了制造应变半导体绝缘体（SSOI）衬底的成本有效和可制造的方法，其避免晶片接合。 该方法包括在衬底上生长各种外延半导体层，其中半导体层中的至少一个是在应变半导体层下面的掺杂和弛豫半导体层; 通过电解阳极氧化处理将掺杂和松弛的半导体层转化成多孔半导体，并氧化以将多孔半导体层转化为掩埋氧化物层。 该方法提供了在衬底上包括松弛半导体层的SSOI衬底; 在松弛的半导体层上形成高质量的掩埋氧化物层; 以及在高质量掩埋氧化物层上的应变半导体层。 根据本发明，松弛半导体层和应变半导体层具有相同的晶体取向。

    Strained silicon-on-insulator by anodization of a buried p+ silicon germanium layer
    4.
    发明授权
    Strained silicon-on-insulator by anodization of a buried p+ silicon germanium layer 有权
    通过掩埋的p +硅锗层的阳极氧化应变的绝缘体上硅

    公开(公告)号：US07172930B2

    公开(公告)日：2007-02-06

    申请号：US10883887

    申请日：2004-07-02

    申请人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam Shahidi

    发明人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam Shahidi

    IPC分类号： H01L21/00 ,  H01L21/84 ,  H01L21/331 ,  H01L21/8222 ,  H01L21/36

    CPC分类号： H01L21/76259 ,  Y10S438/967

    摘要： A cost efficient and manufacturable method of fabricating strained semiconductor-on-insulator (SSOI) substrates is provided that avoids wafer bonding. The method includes growing various epitaxial semiconductor layers on a substrate, wherein at least one of the semiconductor layers is a doped and relaxed semiconductor layer underneath a strained semiconductor layer; converting the doped and relaxed semiconductor layer into a porous semiconductor via an electrolytic anodization process, and oxidizing to convert the porous semiconductor layer into a buried oxide layer. The method provides a SSOI substrate that includes a relaxed semiconductor layer on a substrate; a high-quality buried oxide layer on the relaxed semiconductor layer; and a strained semiconductor layer on the high-quality buried oxide layer. In accordance with the present invention, the relaxed semiconductor layer and the strained semiconductor layer have identical crystallographic orientations.

    摘要翻译： 提供了制造应变半导体绝缘体（SSOI）衬底的成本有效和可制造的方法，其避免晶片接合。 该方法包括在衬底上生长各种外延半导体层，其中半导体层中的至少一个是在应变半导体层下面的掺杂和弛豫半导体层; 通过电解阳极氧化处理将掺杂和松弛的半导体层转化成多孔半导体，并氧化以将多孔半导体层转化为掩埋氧化物层。 该方法提供了在衬底上包括松弛半导体层的SSOI衬底; 在松弛的半导体层上形成高质量的掩埋氧化物层; 以及在高质量掩埋氧化物层上的应变半导体层。 根据本发明，松弛半导体层和应变半导体层具有相同的晶体取向。

    Strained silicon-on-insulator by anodization of a buried p+ silicon germanium layer
    6.
    发明授权
    Strained silicon-on-insulator by anodization of a buried p+ silicon germanium layer 失效
    通过掩埋的p +硅锗层的阳极氧化应变的绝缘体上硅

    公开(公告)号：US07592671B2

    公开(公告)日：2009-09-22

    申请号：US11620663

    申请日：2007-01-06

    申请人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam Shahidi

    发明人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam Shahidi

    IPC分类号： H01L29/94

    CPC分类号： H01L21/76259 ,  Y10S438/967

    摘要： A cost efficient and manufacturable method of fabricating strained semiconductor-on-insulator (SSOI) substrates is provided that avoids wafer bonding. The method includes growing various epitaxial semiconductor layers on a substrate, wherein at least one of the semiconductor layers is a doped and relaxed semiconductor layer underneath a strained semiconductor layer; converting the doped and relaxed semiconductor layer into a porous semiconductor via an electrolytic anodization process, and oxidizing to convert the porous semiconductor layer into a buried oxide layer. The method provides a SSOI substrate that includes a relaxed semiconductor layer on a substrate; a high-quality buried oxide layer on the relaxed semiconductor layer; and a strained semiconductor layer on the high-quality buried oxide layer. In accordance with the present invention, the relaxed semiconductor layer and the strained semiconductor layer have identical crystallographic orientations.

    摘要翻译： 提供了制造应变半导体绝缘体（SSOI）衬底的成本有效和可制造的方法，其避免晶片接合。 该方法包括在衬底上生长各种外延半导体层，其中半导体层中的至少一个是在应变半导体层下面的掺杂和弛豫半导体层; 通过电解阳极氧化处理将掺杂和松弛的半导体层转化成多孔半导体，并氧化以将多孔半导体层转化为掩埋氧化物层。 该方法提供了在衬底上包括松弛半导体层的SSOI衬底; 在松弛的半导体层上形成高质量的掩埋氧化物层; 以及在高质量掩埋氧化物层上的应变半导体层。 根据本发明，松弛半导体层和应变半导体层具有相同的晶体取向。

    STRAINED SEMICONDUCTOR-ON-INSULATOR BY ADDITION AND REMOVAL OF ATOMS IN A SEMICONDUCTOR-ON-INSULATOR
    7.
    发明申请
    STRAINED SEMICONDUCTOR-ON-INSULATOR BY ADDITION AND REMOVAL OF ATOMS IN A SEMICONDUCTOR-ON-INSULATOR 有权
    通过在半导体绝缘体中添加和去除原子的应变半导体绝缘体

    公开(公告)号：US20120009766A1

    公开(公告)日：2012-01-12

    申请号：US12830626

    申请日：2010-07-06

    申请人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam G. Shahidi

    发明人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam G. Shahidi

    IPC分类号： H01L21/20

    CPC分类号： H01L29/1054 ,  H01L29/7833

    摘要： A method of forming a strained semiconductor-on-insulator (SSOI) substrate that does not include wafer bonding is provided. In this disclosure a relaxed and doped silicon layer is formed on an upper surface of a silicon-on-insulator (SOI) substrate. In one embodiment, the dopant within the relaxed and doped silicon layer has an atomic size that is smaller than the atomic size of silicon and, as such, the in-plane lattice parameter of the relaxed and doped silicon layer is smaller than the in-plane lattice parameter of the underlying SOI layer. In another embodiment, the dopant within the relaxed and doped silicon layer has an atomic size that is larger than the atomic size of silicon and, as such, the in-plane lattice parameter of the relaxed and doped silicon layer is larger than the in-plane lattice parameter of the underlying SOI layer. After forming the relaxed and doped silicon layer on the SOI substrate, the dopant within the relaxed and doped silicon layer is removed from that layer converting the relaxed and doped silicon layer into a strained (compressively or tensilely) silicon layer that is formed on an upper surface of an SOI substrate.

    摘要翻译： 提供了一种形成不包括晶片接合的应变绝缘体上半导体（SSOI）衬底的方法。 在本公开中，在绝缘体上硅（SOI）衬底的上表面上形成松弛和掺杂的硅层。 在一个实施例中，松弛和掺杂硅层内的掺杂剂具有小于硅的原子尺寸的原子尺寸，因此松弛和掺杂硅层的面内晶格参数小于硅的原子尺寸， 下层SOI层的平面晶格参数。 在另一实施例中，松弛和掺杂硅层内的掺杂剂具有大于硅的原子尺寸的原子尺寸，因此松弛和掺杂硅层的面内晶格参数大于硅原子尺寸， 下层SOI层的平面晶格参数。 在SOI衬底上形成松弛和掺杂的硅层之后，从该层去除松弛和掺杂硅层内的掺杂剂，将松散和掺杂的硅层转化成形成在上层的应变（压缩或拉伸）硅层 SOI衬底的表面。

    Strained semiconductor-on-insulator by addition and removal of atoms in a semiconductor-on-insulator
    8.
    发明授权
    Strained semiconductor-on-insulator by addition and removal of atoms in a semiconductor-on-insulator 有权
    通过在绝缘体上半导体中加入和除去原子的绝缘体上的应变半导体

    公开(公告)号：US08361889B2

    公开(公告)日：2013-01-29

    申请号：US12830626

    申请日：2010-07-06

    申请人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam G. Shahidi

    发明人： Thomas N. Adam ,  Stephen W. Bedell ,  Joel P. de Souza ,  Keith E. Fogel ,  Alexander Reznicek ,  Devendra K. Sadana ,  Ghavam G. Shahidi

    IPC分类号： H01L21/20

    CPC分类号： H01L29/1054 ,  H01L29/7833

    摘要： A method of forming a strained semiconductor-on-insulator (SSOI) substrate that does not include wafer bonding is provided. In this disclosure a relaxed and doped silicon layer is formed on an upper surface of a silicon-on-insulator (SOI) substrate. In one embodiment, the dopant within the relaxed and doped silicon layer has an atomic size that is smaller than the atomic size of silicon and, as such, the in-plane lattice parameter of the relaxed and doped silicon layer is smaller than the in-plane lattice parameter of the underlying SOI layer. In another embodiment, the dopant within the relaxed and doped silicon layer has an atomic size that is larger than the atomic size of silicon and, as such, the in-plane lattice parameter of the relaxed and doped silicon layer is larger than the in-plane lattice parameter of the underlying SOI layer. After forming the relaxed and doped silicon layer on the SOI substrate, the dopant within the relaxed and doped silicon layer is removed from that layer converting the relaxed and doped silicon layer into a strained (compressively or tensilely) silicon layer that is formed on an upper surface of an SOI substrate.

    摘要翻译： 提供了一种形成不包括晶片接合的应变绝缘体上半导体（SSOI）衬底的方法。 在本公开中，在绝缘体上硅（SOI）衬底的上表面上形成松弛和掺杂的硅层。 在一个实施例中，松弛和掺杂硅层内的掺杂剂具有小于硅的原子尺寸的原子尺寸，因此松弛和掺杂硅层的面内晶格参数小于硅的原子尺寸， 下层SOI层的平面晶格参数。 在另一实施例中，松弛和掺杂硅层内的掺杂剂具有大于硅的原子尺寸的原子尺寸，因此松弛和掺杂硅层的面内晶格参数大于硅原子尺寸， 下层SOI层的平面晶格参数。 在SOI衬底上形成松弛和掺杂的硅层之后，从该层去除松弛和掺杂硅层内的掺杂剂，将松散和掺杂的硅层转化成形成在上层的应变（压缩或拉伸）硅层 SOI衬底的表面。

    SELECTIVE EPITAXIAL GROWTH BY INCUBATION TIME ENGINEERING
    10.
    发明申请
    SELECTIVE EPITAXIAL GROWTH BY INCUBATION TIME ENGINEERING 审中-公开
    选择性外来成长通过孵化时间工程

    公开(公告)号：US20120295417A1

    公开(公告)日：2012-11-22

    申请号：US13109567

    申请日：2011-05-17

    申请人： Thomas N. Adam ,  Katherina E. Babich ,  Stephen W. Bedell ,  Joel P. de Souza ,  Gerald W. Gibson ,  Alexander Reznicek ,  Devendra K. Sadana ,  Seshadri Subbanna

    发明人： Thomas N. Adam ,  Katherina E. Babich ,  Stephen W. Bedell ,  Joel P. de Souza ,  Gerald W. Gibson ,  Alexander Reznicek ,  Devendra K. Sadana ,  Seshadri Subbanna

    IPC分类号： H01L21/20

    CPC分类号： H01L29/66628 ,  H01L21/0237 ,  H01L21/02524 ,  H01L21/02639 ,  H01L29/165 ,  H01L29/78

    摘要： A method of controlling the nucleation rate (i.e., incubation time) of dissimilar materials in an epitaxial growth chamber that can favor high growth rates and can be compatible with low temperature growth is provided. The nucleation rate of dissimilar materials is controlled in an epitaxial growth chamber by altering the nucleation rate for the growth of a given material film, relative to single crystal growth of the same material film, by choosing an appropriate masking material with a given native nucleation characteristic, or by modifying the surface of the masking layer to achieve the appropriate nucleation characteristic. Alternatively, nucleation rate control can be achieved by modifying the surface of selected areas of a semiconductor substrate relative to other areas in which an epitaxial semiconductor material will be subsequently formed.

    摘要翻译： 提供了一种控制外延生长室中不同材料的成核速率（即孵育时间）的方法，其可以有利于高生长速率并且可以与低温生长相容。 通过选择具有给定的天然成核特性的合适的掩蔽材料，通过相对于相同材料膜的单晶生长改变给定材料膜的生长的成核速率，在外延生长室中控制不同材料的成核速率 ，或通过改变掩模层的表面以获得适当的成核特性。 或者，可以通过相对于其后将形成外延半导体材料的其它区域修改半导体衬底的选定区域的表面来实现成核速率控制。