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    Housing for a semiconductor component
    1.
    发明申请
    Housing for a semiconductor component 有权
    半导体元件的外壳

    公开(公告)号：US20100019375A1

    公开(公告)日：2010-01-28

    申请号：US12460567

    申请日：2009-07-20

    申请人： Thorsten Wallisch ,  Christian Solf ,  Florian Grabmaier

    发明人： Thorsten Wallisch ,  Christian Solf ,  Florian Grabmaier

    IPC分类号： H01L23/498

    CPC分类号： H01L23/49551 ,  B81B7/0077 ,  G01P1/023 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.

    摘要翻译： 一种用于半导体部件的壳体，其中壳体具有设置在壳体的边缘处的距离的多个销，每个销具有宽度，厚度和长度。 为了形成其特征频率在壳体的特征频率不利地影响半导体部件的范围之外的半导体部件的壳体，至少一个距离在1.24mm至1.30mm的范围之外，在 宽度中的至少一个宽度在0.33mm至0.51mm的范围之外，至少一个厚度在0.23至0.32mm的范围之外，或者至少一个长度在2.05至4.12mm的范围之外。

    Housing for a semiconductor component
    2.
    发明授权
    Housing for a semiconductor component 有权
    半导体元件的外壳

    公开(公告)号：US08063479B2

    公开(公告)日：2011-11-22

    申请号：US12460567

    申请日：2009-07-20

    申请人： Thorsten Wallisch ,  Christian Solf ,  Florian Grabmaier

    发明人： Thorsten Wallisch ,  Christian Solf ,  Florian Grabmaier

    IPC分类号： H01L23/48 ,  H01L23/495

    CPC分类号： H01L23/49551 ,  B81B7/0077 ,  G01P1/023 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.

    摘要翻译： 一种用于半导体部件的壳体，其中壳体具有设置在壳体的边缘处的距离的多个销，每个销具有宽度，厚度和长度。 为了形成其特征频率在壳体的特征频率不利地影响半导体部件的范围之外的半导体部件的壳体，至少一个距离在1.24mm至1.30mm的范围之外，在 宽度中的至少一个宽度在0.33mm至0.51mm的范围之外，至少一个厚度在0.23至0.32mm的范围之外，或者至少一个长度在2.05至4.12mm的范围之外。

    COUPLING DEVICE, ASSEMBLY HAVING A COUPLING DEVICE, AND METHOD FOR PRODUCING AN ASSEMBLY HAVING A COUPLING DEVICE
    5.
    发明申请
    COUPLING DEVICE, ASSEMBLY HAVING A COUPLING DEVICE, AND METHOD FOR PRODUCING AN ASSEMBLY HAVING A COUPLING DEVICE 审中-公开
    联接装置，具有联接装置的组装件，以及用于生产具有联接装置的组件的方法

    公开(公告)号：US20120267153A1

    公开(公告)日：2012-10-25

    申请号：US13503581

    申请日：2010-10-05

    申请人： Christian Solf

    发明人： Christian Solf

    IPC分类号： H05K1/18 ,  H05K3/30 ,  H05K1/11

    CPC分类号： H05K1/0271 ,  B29C45/14 ,  H01L2924/0002 ,  H05K3/202 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/09118 ,  H05K2201/10151 ,  H05K2201/10378 ,  Y10T29/49146 ,  H01L2924/00

    摘要： The invention relates to a method for a coupling device (1) for connecting an electrical/electronic component (16), in particular a sensor (17), having a substrate, in particular a circuit board, wherein the coupling device (1) comprises at least one electrical connection (25) for electrical contacting and at least one damper element (12) for movement uncoupling, wherein the electrical connection is formed by a lead frame (3) and the lead frame (3) is overmolded in regions by a damping mass (11) as a damper element (12). The invention furthermore relates to an assembly having a coupling device and a method for producing said type of assembly.

    摘要翻译： 本发明涉及一种用于连接电气/电子部件（16），特别是传感器（17）的耦合装置（1）的方法，该传感器具有基板，特别是电路板，其中联接装置（1）包括 用于电接触的至少一个电连接（25）和用于移动解耦的至少一个阻尼元件（12），其中所述电连接由引线框架（3）形成，并且所述引线框架（3）在区域中被二次模制 阻尼块（11）作为阻尼元件（12）。 本发明还涉及具有联接装置和用于生产所述类型组件的方法的组件。