公开(公告)号：US07163847B2

公开(公告)日：2007-01-16

申请号：US11258092

申请日：2005-10-26

申请人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

发明人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

IPC分类号： H01L21/82

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

摘要翻译： 制造电路化基板的方法，其中在基板上的电路的电镀期间使用的基板的共用条，使用激光从各种导体终止。 在优选实施例中，激光器通过介电层（焊接掩模）进行作用，该电介质层被施加在电路上，包括共用条和连接部分。 激光器还可以用于暴露电路的其他部分中的选定的部分，包括用于容纳引线键（来自芯片）的各种焊盘以及用于最终将衬底放置在较大电路板上的焊球。

公开(公告)号：US07084014B2

公开(公告)日：2006-08-01

申请号：US10679302

申请日：2003-10-07

申请人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

发明人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

IPC分类号： H01L21/82

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

摘要翻译： 制造电路化基板的方法，其中在基板上的电路的电镀期间使用的基板的共用条，使用激光从各种导体终止。 在优选实施例中，激光器通过介电层（焊接掩模）进行作用，该电介质层被施加在电路上，包括共用条和连接部分。 激光器还可以用于暴露电路的其他部分中的选定的部分，包括用于容纳引线键（来自芯片）的各种焊盘以及用于最终将衬底放置在较大电路板上的焊球。

公开(公告)号：US07091066B2

公开(公告)日：2006-08-15

申请号：US11259043

申请日：2005-10-27

申请人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

发明人： Timothy Antesberger ,  James W. Fuller, Jr. ,  John J. Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy L. Wells

IPC分类号： H01L21/82

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which a commoning bar, used during the plating of the circuitry on the substrate and coupled to a second set of conductors which in turn are coupled to a first set of conductors, is terminated from the second set of conductors.

摘要翻译： 一种制造电路化基板的方法，其中在基板上的电路的电镀过程中使用并耦合到第二组导体的公共条被连接到第一组导体，该第二组导体被连接到第二组导体 导体

公开(公告)号：US20050074924A1

公开(公告)日：2005-04-07

申请号：US10679302

申请日：2003-10-07

申请人： Timothy Antesberger ,  James Fuller ,  John Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy Wells

发明人： Timothy Antesberger ,  James Fuller ,  John Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy Wells

IPC分类号： H01L21/48 ,  H01L21/82 ,  H01L23/498 ,  H05K3/00 ,  H05K3/24 ,  H05K3/28

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

摘要翻译： 制造电路化基板的方法，其中在基板上的电路的电镀期间使用的基板的共用条，使用激光从各种导体终止。 在优选实施例中，激光器通过介电层（焊接掩模）进行作用，该电介质层被施加在电路上，包括共用条和连接部分。 激光器还可以用于暴露电路的其他部分中的选定的部分，包括用于容纳引线键（来自芯片）的各种焊盘以及用于最终将衬底放置在较大电路板上的焊球。

公开(公告)号：US20060040426A1

公开(公告)日：2006-02-23

申请号：US11258092

申请日：2005-10-26

申请人： Timothy Antesberger ,  James Fuller ,  John Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy Wells

发明人： Timothy Antesberger ,  James Fuller ,  John Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy Wells

IPC分类号： H01L21/48

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

摘要翻译： 制造电路化基板的方法，其中在基板上的电路的电镀期间使用的基板的共用条，使用激光从各种导体终止。 在优选实施例中，激光器通过介电层（焊接掩模）进行作用，该电介质层被施加在电路上，包括共用条和连接部分。 激光器还可以用于暴露电路的其他部分中的选定的部分，包括用于容纳引线键（来自芯片）的各种焊盘以及用于最终将衬底放置在较大电路板上的焊球。

公开(公告)号：US20060046462A1

公开(公告)日：2006-03-02

申请号：US11259043

申请日：2005-10-27

申请人： Timothy Antesberger ,  James Fuller ,  John Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy Wells

发明人： Timothy Antesberger ,  James Fuller ,  John Konrad ,  John Kresge ,  Stephen Krasniak ,  Timothy Wells

IPC分类号： H01L21/4763 ,  H01L21/44

CPC分类号： H01L21/4846 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/242 ,  H05K3/28 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a circuitized substrate in which a commoning bar, used during the plating of the circuitry on the substrate and coupled to a second set of conductors which in turn are coupled to a first set of conductors, is terminated from the second set of conductors.

摘要翻译： 一种制造电路化基板的方法，其中在基板上的电路的电镀过程中使用并耦合到第二组导体的公共条被连接到第一组导体，该第二组导体被连接到第二组导体 导体

公开(公告)号：US07307022B2

公开(公告)日：2007-12-11

申请号：US11327493

申请日：2006-01-09

申请人： Frank D. Egitto ,  Stephen Krasniak ,  John M. Lauffer ,  Voya R. Markovich ,  Luis J. Matienzo

发明人： Frank D. Egitto ,  Stephen Krasniak ,  John M. Lauffer ,  Voya R. Markovich ,  Luis J. Matienzo

IPC分类号： H01L21/44 ,  C25D5/02

CPC分类号： H05K3/384 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0353 ,  H05K2203/0723

摘要： A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer. The method is extendible to the formation of such substrates, including to the formation of multilayered substrates having many conductive and dielectric layers. Such substrates may include one or more electrical components (e.g., semiconductor chips) mounted thereon and may also be mounted themselves onto other substrates.

摘要翻译： 一种处理导电层以确保该层对用于形成电路化基底的所选电介质层的附着力的方法。 导电层包括具有适当粗糙度的至少一个表面以实现这种粘附，并且如果该层用作信号层，则还具有良好的信号通过。 该方法可扩展到形成这种衬底，包括形成具有许多导电和电介质层的多层衬底。 这样的基板可以包括安装在其上的一个或多个电气部件（例如，半导体芯片），并且也可以将它们本身安装到其它基板上。

公开(公告)号：US20080054476A1

公开(公告)日：2008-03-06

申请号：US11976629

申请日：2007-10-26

申请人： Frank Egitto ,  Stephen Krasniak ,  John Lauffer ,  Voya Markovich ,  Luis Matienzo

发明人： Frank Egitto ,  Stephen Krasniak ,  John Lauffer ,  Voya Markovich ,  Luis Matienzo

IPC分类号： H01L23/52

CPC分类号： H05K3/384 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0353 ,  H05K2203/0723

摘要： A circuitized substrate with a conductive layer which assures enhanced adhesion of the layer to selected dielectric layers used to form the circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer.

摘要翻译： 具有导电层的电路化衬底，其确保该层对用于形成电路化衬底的所选介电层的附着力增强。 导电层包括具有适当粗糙度的至少一个表面以实现这种粘附，并且如果该层用作信号层，则还具有良好的信号通过。

公开(公告)号：US20060121738A1

公开(公告)日：2006-06-08

申请号：US11327493

申请日：2006-01-09

申请人： Frank Egitto ,  Stephen Krasniak ,  John Lauffer ,  Voya Markovich ,  Luis Matienzo

发明人： Frank Egitto ,  Stephen Krasniak ,  John Lauffer ,  Voya Markovich ,  Luis Matienzo

IPC分类号： H01L21/311 ,  C25D5/10

CPC分类号： H05K3/384 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0353 ,  H05K2203/0723

摘要： A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer. The method is extendible to the formation of such substrates, including to the formation of multilayered substrates having many conductive and dielectric layers. Such substrates may include one or more electrical components (e.g., semiconductor chips) mounted thereon and may also be mounted themselves onto other substrates.

摘要翻译： 一种处理导电层以确保该层对用于形成电路化基底的所选介电层的附着力的方法。 导电层包括具有适当粗糙度的至少一个表面以实现这种粘附，并且如果该层用作信号层，则还具有良好的信号通过。 该方法可扩展到形成这种衬底，包括形成具有许多导电和电介质层的多层衬底。 这样的基板可以包括安装在其上的一个或多个电气部件（例如，半导体芯片），并且也可以将它们本身安装到其它基板上。