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    DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE
    1.
    发明申请
    DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE 有权
    直接连接热交换器管段和冷却冷却结构

    公开(公告)号：US20130107453A1

    公开(公告)日：2013-05-02

    申请号：US13283933

    申请日：2011-10-28

    申请人： Timothy J. CHAINER ,  Patrick A. COICO ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    发明人： Timothy J. CHAINER ,  Patrick A. COICO ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： H05K7/20 ,  B21D53/02 ,  B23P11/00 ,  F28D15/00 ,  F28F9/02

    CPC分类号： B23P15/26 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/4935 ,  Y10T29/49826

    摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

    摘要翻译： 提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。 与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合 与冷却剂回路流体连通以便于冷却剂流过管段。 冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。 该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

    COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT
    2.
    发明申请
    COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT 有权
    冷却电子系统与液体冷却冷却板和热传递器耦合到电子元件

    公开(公告)号：US20120279686A1

    公开(公告)日：2012-11-08

    申请号：US13102200

    申请日：2011-05-06

    申请人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    发明人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： F28D15/02 ,  F28D15/00

    CPC分类号： H05K7/20336 ,  F28D15/02 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20936

    摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

    摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷冷板和与冷板相关联的散热器。 冷板包括在冷板内延伸的多个冷却剂承载通道部分，以及具有比待冷却部件的表面积更大的表面积的导热表面。 散热器包括一个或多个包括多个热管段的热管。 一个或多个热管部分与冷板的第一区域部分对准，即，与要冷却的表面对准，并且部分地对准于位于第一区域外部的冷板的第二区域。 一个或多个热管促进热量从电子部件分配到位于冷板的第二区域中的冷板的冷却剂承载通道部分。

    DYNAMICALLY LIMITING ENERGY CONSUMED BY COOLING APPARATUS
    6.
    发明申请
    DYNAMICALLY LIMITING ENERGY CONSUMED BY COOLING APPARATUS 有权
    动态限制用冷却装置消耗的能源

    公开(公告)号：US20130138252A1

    公开(公告)日：2013-05-30

    申请号：US13305967

    申请日：2011-11-29

    申请人： Timothy J. CHAINER ,  Milnes P. DAVID ,  Madhusudan K. IYENGAR ,  Pritish R. PARIDA ,  Roger R. SCHMIDT ,  Mark D. SCHULTZ

    发明人： Timothy J. CHAINER ,  Milnes P. DAVID ,  Madhusudan K. IYENGAR ,  Pritish R. PARIDA ,  Roger R. SCHMIDT ,  Mark D. SCHULTZ

    IPC分类号： G05D23/19 ,  G06F1/32 ,  G05D7/06

    CPC分类号： G05D7/0635 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3206 ,  G11B33/144 ,  H05K7/20281 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836 ,  Y02D10/16

    摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.

    摘要翻译： 提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元 以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。 控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量 由N个可控组件消耗，其中Z> = 1。

    ACTIVELY CONTROLLING COOLANT-COOLED COLD PLATE CONFIGURATION
    7.
    发明申请
    ACTIVELY CONTROLLING COOLANT-COOLED COLD PLATE CONFIGURATION 审中-公开
    全面控制冷却冷却冷板配置

    公开(公告)号：US20140048243A1

    公开(公告)日：2014-02-20

    申请号：US13604850

    申请日：2012-09-06

    申请人： Timothy J. CHAINER ,  Pritish R. PARIDA

    发明人： Timothy J. CHAINER ,  Pritish R. PARIDA

    IPC分类号： F28F27/00

    CPC分类号： H05K7/20772 ,  H05K7/20836

    摘要： Cooling apparatuses are provided to facilitate active control of thermal and fluid dynamic performance of a coolant-cooled cold plate. The cooling apparatus includes the cold plate and a controller. The cold plate couples to one or more electronic components to be cooled, and includes an adjustable physical configuration. The controller dynamically varies the adjustable physical configuration of the cold plate based on a monitored variable associated with the cold plate or the electronic component(s) being cooled by the cold plate. By dynamically varying the physical configuration, the thermal and fluid dynamic performance of the cold plate are adjusted to, for example, optimally cool the electronic component(s), and at the same time, reduce cooling power consumption used in cooling the electronic component(s). The physical configuration can be adjusted by providing one or more adjustable plates within the cold plate, the positioning of which may be adjusted based on the monitored variable.

    摘要翻译： 提供冷却装置以便于主动控制冷却剂冷却的冷板的热和流体动态性能。 冷却装置包括冷板和控制器。 冷板耦合到要冷却的一个或多个电子部件，并且包括可调节的物理结构。 控制器基于与冷板或由冷板冷却的电子部件相关联的监控变量来动态地改变冷板的可调节物理结构。 通过动态地改变物理结构，冷板的热和流体动态性能被调整为例如最佳地冷却电子部件，并且同时降低冷却电子部件所使用的冷却功率消耗（ s）。 可以通过在冷板内提供一个或多个可调节板来调节物理结构，其可根据所监视的变量来调整其位置。

    ACTIVELY CONTROLLING COOLANT-COOLED COLD PLATE CONFIGURATION
    8.
    发明申请
    ACTIVELY CONTROLLING COOLANT-COOLED COLD PLATE CONFIGURATION 有权
    全面控制冷却冷却冷板配置

    公开(公告)号：US20140049918A1

    公开(公告)日：2014-02-20

    申请号：US13587131

    申请日：2012-08-16

    申请人： Timothy J. CHAINER ,  Pritish R. PARIDA

    发明人： Timothy J. CHAINER ,  Pritish R. PARIDA

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20772 ,  H05K7/20836

    摘要： A method is provided to facilitate active control of thermal and fluid dynamic performance of a coolant-cooled cold plate. The method includes: monitoring a variable associated with at least one of the coolant-cooled cold plate or one or more electronic components being cooled by the cold plate; and dynamically varying, based on the monitored variable, a physical configuration of the cold plate. By dynamically varying the physical configuration, the thermal and fluid dynamic performance of the cold plate are adjusted to, for example, optimally cool the one or more electronic components, and at the same time, reduce cooling power consumption used in cooling the electronic component(s). The physical configuration can be adjusted by providing one or more adjustable plates within the coolant-cooled cold plate, the positioning of which may be adjusted based on the monitored variable.

    摘要翻译： 提供了一种方法来促进主动控制冷却剂冷却冷板的热和流体动态性能。 该方法包括：监测与由冷板冷却的冷却剂冷却的冷板或一个或多个电子部件中的至少一个相关联的变量; 并且基于所监视的变量动态地改变冷板的物理结构。 通过动态地改变物理结构，冷板的热和流体动态性能被调整为例如最佳地冷却一个或多个电子部件，并且同时降低冷却电子部件所使用的冷却功率消耗（ s）。 可以通过在冷却剂冷却的冷板中提供一个或多个可调节板来调整物理构造，其可以基于所监视的变量来调整其位置。