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    DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE
    1.
    发明申请
    DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE 有权
    直接连接热交换器管段和冷却冷却结构

    公开(公告)号：US20130107453A1

    公开(公告)日：2013-05-02

    申请号：US13283933

    申请日：2011-10-28

    申请人： Timothy J. CHAINER ,  Patrick A. COICO ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    发明人： Timothy J. CHAINER ,  Patrick A. COICO ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： H05K7/20 ,  B21D53/02 ,  B23P11/00 ,  F28D15/00 ,  F28F9/02

    CPC分类号： B23P15/26 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/4935 ,  Y10T29/49826

    摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

    摘要翻译： 提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。 与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合 与冷却剂回路流体连通以便于冷却剂流过管段。 冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。 该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

    COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT
    2.
    发明申请
    COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT 有权
    冷却电子系统与液体冷却冷却板和热传递器耦合到电子元件

    公开(公告)号：US20120279686A1

    公开(公告)日：2012-11-08

    申请号：US13102200

    申请日：2011-05-06

    申请人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    发明人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： F28D15/02 ,  F28D15/00

    CPC分类号： H05K7/20336 ,  F28D15/02 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20936

    摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

    摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷冷板和与冷板相关联的散热器。 冷板包括在冷板内延伸的多个冷却剂承载通道部分，以及具有比待冷却部件的表面积更大的表面积的导热表面。 散热器包括一个或多个包括多个热管段的热管。 一个或多个热管部分与冷板的第一区域部分对准，即，与要冷却的表面对准，并且部分地对准于位于第一区域外部的冷板的第二区域。 一个或多个热管促进热量从电子部件分配到位于冷板的第二区域中的冷板的冷却剂承载通道部分。

    THERMAL TRANSFER STRUCTURES COUPLING ELECTRONICS CARD(S) TO COOLANT-COOLED STRUCTURE(S)
    6.
    发明申请
    THERMAL TRANSFER STRUCTURES COUPLING ELECTRONICS CARD(S) TO COOLANT-COOLED STRUCTURE(S) 有权
    热转印结构将电子卡耦合到冷却冷却结构（S）

    公开(公告)号：US20130343005A1

    公开(公告)日：2013-12-26

    申请号：US13527947

    申请日：2012-06-20

    申请人： Milnes P. DAVID ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Pritish R. PARIDA ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    发明人： Milnes P. DAVID ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Pritish R. PARIDA ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： H05K7/20 ,  H05K13/00

    CPC分类号： H05K7/20745 ,  H05K7/2079 ,  H05K13/00

    摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

    摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

    COOLING UNIT FOR CONTAINER-TYPE DATA CENTER
    7.
    发明申请
    COOLING UNIT FOR CONTAINER-TYPE DATA CENTER 有权
    集装箱型数据中心冷却装置

    公开(公告)号：US20120297807A1

    公开(公告)日：2012-11-29

    申请号：US13114203

    申请日：2011-05-24

    申请人： Brian A. CANNEY ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Roger R. SCHMIDT

    发明人： Brian A. CANNEY ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Roger R. SCHMIDT

    IPC分类号： F25B49/02 ,  B23P15/26 ,  F25D31/00 ,  F25D17/06 ,  F25B49/00

    CPC分类号： H05K7/1497 ,  F25B25/005 ,  F25B2700/2106 ,  F25B2700/21173 ,  F25D11/003 ,  F25D17/02 ,  H05K7/2079 ,  Y10T29/49359

    摘要： A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger.

    摘要翻译： 为集装箱式数据中心提供冷却装置和冷却方法。 冷却单元包括排热单元，用于将来自通过冷却剂回路的冷却剂的热量排除通过散热单元的空气;以及制冷单元，其可控制以选择性地向通过冷却剂的冷却剂的至少一部分提供辅助冷却 循环。 散热单元包括具有第一热交换器和第二热交换器的热交换组件，以及提供横跨第一和第二热交换器的气流的一个或多个气动装置。 所述第一热交换器与所述冷却剂回路流体连通，并且所述第二热交换器与所述制冷单元的制冷回路流体连通地联接，用于将通过所述制冷回路的制冷剂的热量排出到穿过所述第二热交换器的气流 。

    APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM
    8.
    发明申请
    APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM 有权
    用于促进电子系统冷却的装置和方法

    公开(公告)号：US20090154096A1

    公开(公告)日：2009-06-18

    申请号：US11957619

    申请日：2007-12-17

    申请人： Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Jason A. MATTESON ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    发明人： Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Jason A. MATTESON ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： H05K7/20 ,  F25B1/00 ,  B23P11/00

    CPC分类号： H05K7/20754 ,  F25D17/06 ,  F25D2317/0655 ,  F25D2317/0661 ,  Y10T29/49826

    摘要： Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.

    摘要翻译： 提供了用于促进采用蒸气压缩热交换系统的电子系统以及前后盖的空气冷却的装置和方法。 热交换系统的蒸发器壳体安装到电子系统的系统壳体，并且至少部分地延伸到系统壳体的空气入口侧和出口侧之间。 蒸发器壳体包括空气入口和出口以及蒸发器。 前盖与空气入口侧或空气出口开口相邻地安装在系统或蒸发器壳体上，后盖与空气出口侧或进气口相邻地安装在系统或蒸发器壳体上。 系统壳体，后盖，蒸发器壳体和前盖一起限定通过系统壳体和蒸发器壳体的闭环气流路径，其中蒸气压缩热交换系统冷却空气循环通过。

    DYNAMICALLY LIMITING ENERGY CONSUMED BY COOLING APPARATUS
    9.
    发明申请
    DYNAMICALLY LIMITING ENERGY CONSUMED BY COOLING APPARATUS 有权
    动态限制用冷却装置消耗的能源

    公开(公告)号：US20130138252A1

    公开(公告)日：2013-05-30

    申请号：US13305967

    申请日：2011-11-29

    申请人： Timothy J. CHAINER ,  Milnes P. DAVID ,  Madhusudan K. IYENGAR ,  Pritish R. PARIDA ,  Roger R. SCHMIDT ,  Mark D. SCHULTZ

    发明人： Timothy J. CHAINER ,  Milnes P. DAVID ,  Madhusudan K. IYENGAR ,  Pritish R. PARIDA ,  Roger R. SCHMIDT ,  Mark D. SCHULTZ

    IPC分类号： G05D23/19 ,  G06F1/32 ,  G05D7/06

    CPC分类号： G05D7/0635 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3206 ,  G11B33/144 ,  H05K7/20281 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836 ,  Y02D10/16

    摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.

    摘要翻译： 提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元 以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。 控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量 由N个可控组件消耗，其中Z> = 1。

    AIR-COOLING WALL WITH SLIDABLE HEAT EXCHANGERS
    10.
    发明申请
    AIR-COOLING WALL WITH SLIDABLE HEAT EXCHANGERS 有权
    空气冷却壁与可滑动的热交换器

    公开(公告)号：US20120298335A1

    公开(公告)日：2012-11-29

    申请号：US13115390

    申请日：2011-05-25

    申请人： Eric A. ECKBERG ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Howard V. MAHANEY, JR. ,  Roger R. SCHMIDT ,  Kenneth R. SCHNEEBELI

    发明人： Eric A. ECKBERG ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Howard V. MAHANEY, JR. ,  Roger R. SCHMIDT ,  Kenneth R. SCHNEEBELI

    IPC分类号： F28D15/00

    CPC分类号： H05K7/2079

    摘要： An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s).

    摘要翻译： 提供了一种空气冷却装置，其包括通过数据中心的电子机架的冷却空气的冷却壁。 空气冷却壁与电子机架的空气入口侧或空气出口侧分开设置并且与空气出口侧分开设置，并且包括与电子机架分离设置的壁板支撑结构， 支撑一个或多个可滑动的墙板。 可滑动壁板包括可滑动地支撑并设置成与电子机架的空气出口或空气入口侧间隔开的空气 - 液体热交换器。 热交换器从穿过热交换器的空气中提取热量，并且可以在支撑结构内沿横向于穿过机架的气流方向的方向滑动。 通过支撑结构的热交换器的可滑动支撑件便于进入电子​​机架的空气出口或空气入口侧。