公开(公告)号：US5587883A

公开(公告)日：1996-12-24

申请号：US557667

申请日：1995-11-13

申请人： Timothy L. Olson ,  Lauriann T. Carney ,  Gary C. Johnson ,  William M. Strom

发明人： Timothy L. Olson ,  Lauriann T. Carney ,  Gary C. Johnson ,  William M. Strom

IPC分类号： H01L23/50 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H05K7/20

CPC分类号： H01L23/4334 ,  H01L23/49541 ,  H01L2924/0002

摘要： A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a first region (18), a transition region (19), and a second region (21). A distance between a heat sink (12) and the lead frame (11) may vary. The offset is chosen to compensate for a predetermined distance between the heat sink (12) and the lead frame (11) such that the lead frame (11) aligns to lead frame handling equipment. A single lead frame manufacturing setup can then be used. A slot (22) is formed in the lead frame (11) extending through the second region (21) and the transition region (19) into first area (18) providing a path for injecting an encapsulation material into a mold.

摘要翻译： 用于容纳集成电路的引线框架封装。 一种引线框架（11），具有从封装的至少三个侧面延伸的多个引线（13）。 引线框架（11）形成有第一区域（18），过渡区域（19）和第二区域（21）。 散热器（12）和引线框架（11）之间的距离可以变化。 选择偏置以补偿散热器（12）和引线框架（11）之间的预定距离，使得引线框架（11）对准引线框处理设备。 然后可以使用单个引线框架制造设置。 在引线框架（11）中形成有延伸穿过第二区域（21）和过渡区域（19）进入第一区域（18）的槽（22），以提供将包封材料注入到模具中的路径。

公开(公告)号：US09397082B2

公开(公告)日：2016-07-19

申请号：US14990468

申请日：2016-01-07

申请人： William E. Edwards ,  Gary C. Johnson

发明人： William E. Edwards ,  Gary C. Johnson

IPC分类号： H01L21/44 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L25/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L2224/05554 ,  H01L2224/48247

摘要： First and second semiconductor die are mounted to first and second die pads of a lead frame disposed in a lead frame sheet. With a plurality of wire bonds, each post of a plurality of posts of the lead frame is connected to the first and second semiconductor die. Each post extends inward from opposite sides of the lead frame between the first and second die pads and is connected with a respective one of a plurality of leads of the lead frame. The first and second semiconductor die, the plurality of posts of the lead frame, and the plurality of wire bonds are encapsulated in a package. The lead frame sheet is sheared to define each lead of the plurality of leads. The plurality of posts includes first and second sets of posts extending inward from first and second opposite sides of the lead frame.

摘要翻译： 第一和第二半导体管芯被安装到设置在引线框架片材中的引线框架的第一和第二管芯焊盘。 利用多个引线接合，引线框架的多个柱的每个柱连接到第一和第二半导体管芯。 每个柱从第一和第二管芯焊盘之间的引线框架的相对侧向内延伸并且与引线框架的多个引线中的相应一个引线连接。 第一和第二半导体管芯，引线框架的多个柱和多个引线接合被封装在封装中。 剪切引线框架片以限定多个引线中的每个引线。 多个柱包括从引线框架的第一和第二相对侧向内延伸的第一和第二组柱。

公开(公告)号：US09236331B2

公开(公告)日：2016-01-12

申请号：US14189609

申请日：2014-02-25

申请人： William E. Edwards ,  Gary C. Johnson

发明人： William E. Edwards ,  Gary C. Johnson

IPC分类号： H01L23/04 ,  H01L23/495

CPC分类号： H01L25/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L2224/05554 ,  H01L2224/48247

摘要： An electronic apparatus includes a packaging enclosure, first and second die pads disposed within the packaging enclosure, first and second semiconductor die disposed on the first and second die pads, respectively, a plurality of packaging leads, each packaging lead projecting outward from the packaging enclosure, a plurality of packaging posts disposed within the packaging enclosure and extending inward from opposite sides of the packaging enclosure between the first and second die pads, each packaging post being connected with a respective one of the plurality of packaging leads, and a plurality of wire bonds disposed within the packaging enclosure. Each packaging post of the plurality of packaging posts is connected via a first wire bond of the plurality of wire bonds to the first semiconductor die and via a second wire bond of the plurality of wire bonds to the second semiconductor die. The plurality of packaging posts includes first and second sets of packaging posts extending inward from first and second opposite sides of the packaging enclosure, respectively.

摘要翻译： 一种电子设备，包括：封装壳体，设置在封装壳体内的第一和第二裸片焊盘，分别设置在第一和第二裸片焊盘上的第一和第二半导体管芯，多个封装引线，每个封装引线从封装外壳向外突出 ，多个包装柱，其设置在所述包装外壳内并且在所述第一和第二管芯焊盘之间从所述封装外壳的相对侧向内延伸，每个封装柱与所述多个封装引线中的相应一个连接， 封装在封装外壳内。 多个封装柱的每个封装柱通过多个引线键合的第一引线键合连接到第一半导体管芯，并且经由多个引线键合的第二引线键连接到第二半导体管芯。 多个包装柱包括分别从包装外壳的第一和第二相对侧向内延伸的第一组和第二组包装柱。

公开(公告)号：US06763826B1

公开(公告)日：2004-07-20

申请号：US09836574

申请日：2001-04-16

申请人： Robert Gumm ,  Gary C. Johnson

发明人： Robert Gumm ,  Gary C. Johnson

IPC分类号： F24J240

CPC分类号： F24S23/31 ,  F24S10/30 ,  F24S10/742 ,  F24S40/53 ,  F24S2025/011 ,  Y02E10/43 ,  Y02E10/44 ,  Y10S126/909

摘要： A solar water heater is provided. The heater features heat control so that a maximum temperature is automatically controlled. The heater is insulated to maintain a water temperature of water stored therein for long periods of time. The heater includes an insulated lens which transmits most solar radiation incident on its top surface through the lens. An air trap is located below the lens. A heat control valve opens the air trap to surrounding air when a maximum temperature for air within the air trap is exceeded. A heat absorption plate is located below the air trap. The plate is in contact with a heat transfer liquid within a liquid space below the plate. A heat exchanger is positioned within the space and routes water in heat transfer contact with the liquid within the space, while keeping the water isolated from the liquid within the space.

摘要翻译： 提供太阳能热水器。 加热器具有热控制，从而自动控制最高温度。 加热器是绝缘的，以保持长时间储存​​在其中的水的水温。 加热器包括绝缘透镜，其透射通过透镜入射在其顶表面上的大部分太阳辐射。 透镜下方有一个空气阱。 当超过空气阱中的空气的最高温度时，热控制阀将空气阱打开到周围的空气。 吸热板位于空气阱下方。 该板与板下方的液体空间内的传热液接​​触。 热交换器被定位在该空间内，并将水与空间内的液体传热接触，同时保持水与空间内的液体隔离。

公开(公告)号：US20160118373A1

公开(公告)日：2016-04-28

申请号：US14990468

申请日：2016-01-07

申请人： William E. Edwards ,  Gary C. Johnson

发明人： William E. Edwards ,  Gary C. Johnson

IPC分类号： H01L25/00 ,  H01L21/56 ,  H01L21/48

CPC分类号： H01L25/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L2224/05554 ,  H01L2224/48247

摘要： First and second semiconductor die are mounted to first and second die pads of a lead frame disposed in a lead frame sheet. With a plurality of wire bonds, each post of a plurality of posts of the lead frame is connected to the first and second semiconductor die. Each post extends inward from opposite sides of the lead frame between the first and second die pads and is connected with a respective one of a plurality of leads of the lead frame. The first and second semiconductor die, the plurality of posts of the lead frame, and the plurality of wire bonds are encapsulated in a package. The lead frame sheet is sheared to define each lead of the plurality of leads. The plurality of posts includes first and second sets of posts extending inward from first and second opposite sides of the lead frame.

摘要翻译： 第一和第二半导体管芯被安装到设置在引线框架片材中的引线框架的第一和第二管芯焊盘。 利用多个引线接合，引线框架的多个柱的每个柱连接到第一和第二半导体管芯。 每个柱从第一和第二管芯焊盘之间的引线框架的相对侧向内延伸并且与引线框架的多个引线中的相应一个引线连接。 第一和第二半导体管芯，引线框架的多个柱和多个引线接合被封装在封装中。 剪切引线框架片以限定多个引线中的每个引线。 多个柱包括从引线框架的第一和第二相对侧向内延伸的第一和第二组柱。

公开(公告)号：USD445667S1

公开(公告)日：2001-07-31

申请号：US29124273

申请日：2000-06-02

申请人： Gary C. Johnson

设计人： Gary C. Johnson

公开(公告)号：US4974582A

公开(公告)日：1990-12-04

申请号：US425105

申请日：1989-10-20

申请人： Gary C. Johnson

发明人： Gary C. Johnson

IPC分类号： A61H7/00 ,  A61H39/04

CPC分类号： A61H39/04 ,  A61H2201/1284 ,  A61H7/001

摘要： A pad on which a user lies to apply pressure to selected points on the body consists of two fabric panels and a number of balls having fabric engaging tabs at diametrically opposed points. The balls are placed on one of the panels at the points of desired pressure application and then covered by the second panel. The two panels may be connected together and carry grid markings to assist in positioning of the balls.

摘要翻译： 用户所在的衬垫，其上施加压力到身体上的选定点，由两个织物面板和多个具有在直径相对的点处具有织物接合片的球组成。 将球以所需的压力施加点放置在一个面板上，然后被第二面板覆盖。 两个面板可以连接在一起并带有网格标记以协助球的定位。

公开(公告)号：US4113299A

公开(公告)日：1978-09-12

申请号：US729195

申请日：1976-10-04

申请人： David W. Johnson ,  Gary C. Johnson

发明人： David W. Johnson ,  Gary C. Johnson

IPC分类号： B62D35/00 ,  B62D53/06

CPC分类号： B62D35/001 ,  B62D53/06

摘要： The invention comprises magnus tubes mounted adjacent to or imbedded in the orthogonal edges of a vehicle such as a semi-trailer, these tubes preferably being interengaged, for concomitant rotation and having a motive force such as a motor to simultaneously drive the tubes to expedite laminar flow of air around the edges of the wall in question as the vehicle moves, it being preferred that the motive force be reversible to invest the magnus tube with an additional braking force.

公开(公告)号：US20150243588A1

公开(公告)日：2015-08-27

申请号：US14189609

申请日：2014-02-25

申请人： William E. Edwards ,  Gary C. Johnson

发明人： William E. Edwards ,  Gary C. Johnson

IPC分类号： H01L23/495

CPC分类号： H01L25/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L2224/05554 ,  H01L2224/48247

摘要： An electronic apparatus includes a packaging enclosure, first and second die pads disposed within the packaging enclosure, first and second semiconductor die disposed on the first and second die pads, respectively, a plurality of packaging leads, each packaging lead projecting outward from the packaging enclosure, a plurality of packaging posts disposed within the packaging enclosure and extending inward from opposite sides of the packaging enclosure between the first and second die pads, each packaging post being connected with a respective one of the plurality of packaging leads, and a plurality of wire bonds disposed within the packaging enclosure. Each packaging post of the plurality of packaging posts is connected via a first wire bond of the plurality of wire bonds to the first semiconductor die and via a second wire bond of the plurality of wire bonds to the second semiconductor die. The plurality of packaging posts includes first and second sets of packaging posts extending inward from first and second opposite sides of the packaging enclosure, respectively.

摘要翻译： 一种电子设备，包括：封装壳体，设置在封装壳体内的第一和第二裸片焊盘，分别设置在第一和第二裸片焊盘上的第一和第二半导体管芯，多个封装引线，每个封装引线从封装外壳向外突出 ，多个包装柱，其设置在所述包装外壳内并且在所述第一和第二管芯焊盘之间从所述封装外壳的相对侧向内延伸，每个封装柱与所述多个封装引线中的相应一个连接， 封装在封装外壳内。 多个封装柱的每个封装柱通过多个引线键合的第一引线键合连接到第一半导体管芯，并且经由多个引线键合的第二引线键连接到第二半导体管芯。 多个包装柱包括分别从包装外壳的第一和第二相对侧向内延伸的第一组和第二组包装柱。

公开(公告)号：US5969461A

公开(公告)日：1999-10-19

申请号：US057144

申请日：1998-04-08

申请人： Michael J. Anderson ,  Gregory Kennison ,  Jeffrey E. Christensen ,  Gary C. Johnson ,  Jon G. Aday

发明人： Michael J. Anderson ,  Gregory Kennison ,  Jeffrey E. Christensen ,  Gary C. Johnson ,  Jon G. Aday

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H03H3/08 ,  H03H9/05 ,  H03H9/25 ,  H01L41/08

CPC分类号： H03H9/059 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49146

摘要： A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.

摘要翻译： 一种用于封装声波装置（10）而不污染设置在其表面（14）上的有源区域（12）的方法，包括以下步骤：为基板提供具有导电焊盘（18）的顶部（30），接合螺柱 将突起（20）连接到声波装置的面（14）的周边（22），将堤（26）设置在基板的顶部（30）上并且在导电垫（18）的位置的内部， 将凸块（20）对准并连接到衬底的顶部上的导电焊盘（18），以在声波器件（10）和衬底（16）之间形成导电互连，使底部填充材料（28）在 声波装置的周边（22）和互连周围，使得底部填充材料（28）在由坝（26）限定的边界（32）处停止，并且固化底部填充材料（28）以机械加强和保护 封装互连。