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38 条记录 (耗时 0.035 秒)

    Method and apparatus for cooling an integrated circuit
    1.
    发明授权
    Method and apparatus for cooling an integrated circuit 有权
    用于冷却集成电路的方法和装置

    公开(公告)号：US08237263B2

    公开(公告)日：2012-08-07

    申请号：US12651002

    申请日：2009-12-31

    申请人： Ting-Hau Wu ,  Chun-Ren Cheng ,  Chun-Wen Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Te-Hsi Lee

    发明人： Ting-Hau Wu ,  Chun-Ren Cheng ,  Chun-Wen Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Te-Hsi Lee

    IPC分类号： H01L23/34

    CPC分类号： H01L23/427 ,  B81B7/0093 ,  B81B2207/99 ,  F28D15/02 ,  F28F3/048 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit, a method of operating the integrated circuit, and a method of fabricating the integrated circuit are disclosed. According to one of the broader forms of the invention, a method and apparatus involve an integrated circuit that includes a heat transfer structure having a chamber that has a fluid disposed therein and that extends between a heat generating portion and a heat absorbing portion. Heat is absorbed into the fluid from the heat generating portion, and the fluid changes from a first phase to a second phase different from the first phase when the heat is absorbed. Heat is released from the fluid to the heat absorbing portion, and the fluid changes from the second phase to the first phase when the heat is released.

    摘要翻译： 公开了集成电路，操作集成电路的方法以及制造集成电路的方法。 根据本发明的一个更广泛的形式，一种方法和装置包括集成电路，该集成电路包括一个传热结构，该传热结构具有一个具有设置在其中的流体并且在发热部分和吸热部分之间延伸的腔室。 热量从发热部分吸收到流体中，并且当热被吸收时，流体从第一相位变化到与第一相位不同的第二相位。 热量从流体释放到吸热部分，并且当释放热量时，流体从第二相变为第一相。

    Method and Apparatus for Cooling an Integrated Circuit
    2.
    发明申请
    Method and Apparatus for Cooling an Integrated Circuit 有权
    用于冷却集成电路的方法和装置

    公开(公告)号：US20110156245A1

    公开(公告)日：2011-06-30

    申请号：US12651002

    申请日：2009-12-31

    申请人： Ting-Hau Wu ,  Chun-Ren Cheng ,  Chun-Wen Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Te-Hsi Lee

    发明人： Ting-Hau Wu ,  Chun-Ren Cheng ,  Chun-Wen Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Te-Hsi Lee

    IPC分类号： H01L23/34 ,  H01L21/50 ,  F28D15/02

    CPC分类号： H01L23/427 ,  B81B7/0093 ,  B81B2207/99 ,  F28D15/02 ,  F28F3/048 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit, a method of operating the integrated circuit, and a method of fabricating the integrated circuit are disclosed. According to one of the broader forms of the invention, a method and apparatus involve an integrated circuit that includes a heat transfer structure having a chamber that has a fluid disposed therein and that extends between a heat generating portion and a heat absorbing portion. Heat is absorbed into the fluid from the heat generating portion, and the fluid changes from a first phase to a second phase different from the first phase when the heat is absorbed. Heat is released from the fluid to the heat absorbing portion, and the fluid changes from the second phase to the first phase when the heat is released.

    摘要翻译： 公开了集成电路，操作集成电路的方法以及制造集成电路的方法。 根据本发明的一个更广泛的形式，一种方法和装置包括集成电路，该集成电路包括一个传热结构，该传热结构具有一个具有设置在其中的流体并且在发热部分和吸热部分之间延伸的腔室。 热量从发热部分吸收到流体中，并且当吸收热量时，流体从第一相位变化到与第一相位不同的第二相位。 热量从流体释放到吸热部分，并且当释放热量时，流体从第二相变为第一相。

    Triple-Axis MEMS Accelerometer Having a Bottom Capacitor
    3.
    发明申请
    Triple-Axis MEMS Accelerometer Having a Bottom Capacitor 有权
    具有底电容的三轴MEMS加速度计

    公开(公告)号：US20100308424A1

    公开(公告)日：2010-12-09

    申请号：US12751633

    申请日：2010-03-31

    申请人： Ting-Hau Wu ,  Chun-Wen Cheng ,  Chun-Ren Cheng ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Jiou-Kang Lee ,  Allen Timothy Chang

    发明人： Ting-Hau Wu ,  Chun-Wen Cheng ,  Chun-Ren Cheng ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Jiou-Kang Lee ,  Allen Timothy Chang

    IPC分类号： H01L29/84

    CPC分类号： G01P15/18 ,  G01P15/125 ,  G01P2015/082 ,  G01P2015/084 ,  H01L28/86

    摘要： An integrated circuit structure includes a substrate having a top surface; a first conductive layer over and contacting the top surface of the substrate; a dielectric layer over and contacting the first conductive layer, wherein the dielectric layer includes an opening exposing a portion of the first conductive layer; and a proof-mass in the opening and including a second conductive layer at a bottom of the proof-mass. The second conductive layer is spaced apart from the portion of the first conductive layer by an air space. Springs anchor the proof-mass to portions of the dielectric layer encircling the opening. The springs are configured to allow the proof-mass to make three-dimensional movements.

    摘要翻译： 集成电路结构包括具有顶表面的基板; 在衬底的顶表面上方并接触第一导电层; 电介质层，其与所述第一导电层接触并接触，其中所述电介质层包括露出所述第一导电层的一部分的开口; 并且在开口中具有证明质量，并且包括在质量块的底部的第二导电层。 第二导电层通过空气间隔与第一导电层的部分间隔开。 弹簧将证明质量锚定到围绕开口的介电层的部分。 弹簧被配置为允许证明物质进行三维运动。

    Triple-axis MEMS accelerometer having a bottom capacitor
    4.
    发明授权
    Triple-axis MEMS accelerometer having a bottom capacitor 有权
    具有底部电容器的三轴MEMS加速度计

    公开(公告)号：US08106470B2

    公开(公告)日：2012-01-31

    申请号：US12751633

    申请日：2010-03-31

    申请人： Ting-Hau Wu ,  Chun-Wen Cheng ,  Chun-Ren Cheng ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Jiou-Kang Lee ,  Allen Timothy Chang

    发明人： Ting-Hau Wu ,  Chun-Wen Cheng ,  Chun-Ren Cheng ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Jiou-Kang Lee ,  Allen Timothy Chang

    IPC分类号： H01L21/32

    CPC分类号： G01P15/18 ,  G01P15/125 ,  G01P2015/082 ,  G01P2015/084 ,  H01L28/86

    摘要： An integrated circuit structure includes a substrate having a top surface; a first conductive layer over and contacting the top surface of the substrate; a dielectric layer over and contacting the first conductive layer, wherein the dielectric layer includes an opening exposing a portion of the first conductive layer; and a proof-mass in the opening and including a second conductive layer at a bottom of the proof-mass. The second conductive layer is spaced apart from the portion of the first conductive layer by an air space. Springs anchor the proof-mass to portions of the dielectric layer encircling the opening. The springs are configured to allow the proof-mass to make three-dimensional movements.

    摘要翻译： 集成电路结构包括具有顶表面的基板; 在衬底的顶表面上方并接触第一导电层; 电介质层，其与所述第一导电层接触并接触，其中所述电介质层包括露出所述第一导电层的一部分的开口; 并且在开口中具有证明质量，并且包括在质量块的底部的第二导电层。 第二导电层通过空气间隔与第一导电层的部分间隔开。 弹簧将证明质量锚定到围绕开口的介电层的部分。 弹簧被配置为允许证明物质进行三维运动。

    Gyroscope sensors
    5.
    发明授权
    Gyroscope sensors 有权
    陀螺传感器

    公开(公告)号：US08776600B2

    公开(公告)日：2014-07-15

    申请号：US13610178

    申请日：2012-09-11

    申请人： Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai

    发明人： Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai

    IPC分类号： G01C19/00

    CPC分类号： G01C19/56 ,  Y10T29/49002

    摘要： A gyroscope sensor includes a gyro disk. A first light source is configured to provide a first light beam. A first light receiver is configured to receive the first light beam for sensing a vibration at a first direction of the gyro disk. A second light source is configured to provide a second light beam substantially parallel with the first light beam. A second light receiver is configured to receive the second light beam for sensing a vibration in a second direction of the gyro disk. The second direction is different from the first direction.

    摘要翻译： 陀螺传感器包括陀螺盘。 第一光源被配置为提供第一光束。 第一光接收器被配置为接收用于感测陀螺盘的第一方向上的振动的第一光束。 第二光源被配置为提供基本上与第一光束平行的第二光束。 第二光接收器被配置为接收用于感测陀螺盘的第二方向上的振动的第二光束。 第二个方向与第一个方向不同。

    MEMS Microphone with Single Polysilicon Film
    9.
    发明申请
    MEMS Microphone with Single Polysilicon Film 有权
    单个多晶硅薄膜的MEMS麦克风

    公开(公告)号：US20100117168A1

    公开(公告)日：2010-05-13

    申请号：US12347046

    申请日：2008-12-31

    申请人： Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Jung-Huei Peng

    发明人： Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Jung-Huei Peng

    IPC分类号： H01L29/84

    CPC分类号： H04R19/005 ,  H04R19/04 ,  H04R2201/003

    摘要： An integrated circuit structure includes a capacitor, which further includes a first capacitor plate formed of polysilicon, and a second capacitor plate substantially encircling the first capacitor plate. The first capacitor plate has a portion configured to vibrate in response to an acoustic wave. The second capacitor plate is fixed and has slanted edges facing the first capacitor plate.

    摘要翻译： 集成电路结构包括电容器，其还包括由多晶硅形成的第一电容器板和基本上环绕第一电容器板的第二电容器板。 第一电容器板具有被配置为响应于声波而振动的部分。 第二电容器板是固定的并且具有面向第一电容器板的倾斜边缘。

    Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same
    10.
    发明授权
    Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same 有权
    具有海绵状结构的低应力光敏树脂和使用其制造的装置

    公开(公告)号：US08053377B2

    公开(公告)日：2011-11-08

    申请号：US12892190

    申请日：2010-09-28

    申请人： Shang-Ying Tsai ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Ting-Hau Wu

    发明人： Shang-Ying Tsai ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Ting-Hau Wu

    IPC分类号： H01L21/31 ,  H01L21/469

    CPC分类号： B41J2/16 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B81B2201/052 ,  B81C1/00666 ,  B81C2201/017 ,  B81C2201/053

    摘要： System and method for forming a structure including a MEMS device structure. In order to prevent warpage of a substrate arising from curing process for a sacrificial material (such as a photoresist), and from subsequent high temperature process steps, an improved sacrificial material comprises (i) a polymer and (ii) a foaming agent or special function group. The structure can be formed by forming a trench in a substrate and filling the trench with a sacrificial material. The sacrificial material includes (i) a polymer and (ii) a foaming agent or special function group. After further process steps are completed, the sacrificial material is removed from the trench.

    摘要翻译： 用于形成包括MEMS器件结构的结构的系统和方法。 为了防止由牺牲材料（例如光致抗蚀剂）的固化过程引起的基板翘曲，以及随后的高温工艺步骤，改进的牺牲材料包括（i）聚​​合物和（ii）发泡剂或特殊的 功能组。 可以通过在衬底中形成沟槽并用牺牲材料填充沟槽来形成结构。 牺牲材料包括（i）聚​​合物和（ii）发泡剂或特殊功能组。 在完成进一步的工艺步骤之后，将牺牲材料从沟槽中移除。