公开(公告)号：US6000128A

公开(公告)日：1999-12-14

申请号：US921690

申请日：1997-09-02

申请人： Tohru Umeno ,  Naoki Arai

发明人： Tohru Umeno ,  Naoki Arai

IPC分类号： H01F27/28 ,  H01F41/04 ,  H05K3/02

CPC分类号： H01F27/2804 ,  H01F41/043 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155

摘要： A process of producing a multi-layered printed-coil substrate as a planar magnetic component for use as a transformer or a choke in a switched mode power supply circuit, etc. in which several types of printed-coil substrates having individually different coil patterns are prepared, some of them are selected depending upon the desired characteristics of planar magnetic component, and the selected substrates are layered to obtain a multi-layered printed-coil substrate. A printed-coil component, wherein pin terminals erected on insulating bases are inserted through through-holes formed in the printed-coil substrate having patterned coils in a single or several layers and pin terminals are soldered to the through-holes.

摘要翻译： 制造多层印刷线圈基板作为用作开关模式电源电路等中的变压器或扼流圈的平面磁性部件的过程，其中具有单独不同线圈图案的几种类型的印刷线圈基板是 制备的，其中一些根据平面磁性组分的期望特性进行选择，并且将所选择的基材层叠以获得多层印刷线圈基板。 印刷线圈部件，其中竖立在绝缘基底上的引脚端子通过形成在具有图案化线圈的印刷线圈基板中的通孔插入到单个或多个层中，并将引脚端子焊接到通孔。

公开(公告)号：US5952909A

公开(公告)日：1999-09-14

申请号：US715841

申请日：1996-09-26

申请人： Tohru Umeno ,  Naoki Arai

发明人： Tohru Umeno ,  Naoki Arai

IPC分类号： H01F17/00 ,  H01F27/28 ,  H01F41/04

CPC分类号： H01F41/043 ,  H01F17/0013 ,  H01F27/2804 ,  Y10T29/4902

摘要： A process of producing a multi-layered printed-coil substrate as a planar magnetic component for use as a transformer or a choke in a switched mode power supply circuit, etc. in which several types of printed-coil substrates having individually different coil patterns are prepared, some of them are selected depending upon the desired characteristics of planar magnetic component, and the selected substrates are layered to obtain a multi-layered printed-coil substrate. A printed-coil component, wherein pin terminals erected on insulating bases are inserted through through-holes formed in the printed-coil substrate having patterned coils in a single or several layers and pin terminals are soldered to the through-holes.

摘要翻译： 制造多层印刷线圈基板作为用作开关模式电源电路等中的变压器或扼流圈的平面磁性部件的过程，其中具有单独不同线圈图案的几种类型的印刷线圈基板是 制备的，其中一些根据平面磁性组分的期望特性进行选择，并且将所选择的基材层叠以获得多层印刷线圈基板。 印刷线圈部件，其中竖立在绝缘基底上的引脚端子通过形成在具有图案化线圈的印刷线圈基板中的通孔插入到单个或多个层中，并将引脚端子焊接到通孔。

公开(公告)号：US08592967B2

公开(公告)日：2013-11-26

申请号：US13146603

申请日：2010-01-28

申请人： Tohru Umeno

发明人： Tohru Umeno

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49822 ,  H01L23/495 ,  H01L23/49531 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01005

摘要： A semiconductor apparatus comprising an integrated semiconductor circuit device having pluralities of electrode pads, pluralities of first external terminals connected to the electrode pads of the integrated semiconductor circuit device, an inductor disposed in a region surrounded by the first external terminals, and a resin portion sealing them, the integrated semiconductor circuit device being arranged on an upper surface of the inductor, and the inductor being exposed from a lower surface of the resin portion together with the first external terminals.

摘要翻译： 一种半导体装置，包括具有多个电极焊盘的集成半导体电路器件，连接到集成半导体电路器件的电极焊盘的多个第一外部端子，设置在由第一外部端子包围的区域中的电感器，以及树脂部分密封 它们，集成半导体电路器件布置在电感器的上表面上，并且电感器与第一外部端子一起从树脂部分的下表面露出。

公开(公告)号：US20110284989A1

公开(公告)日：2011-11-24

申请号：US13146603

申请日：2010-01-28

申请人： Tohru Umeno

发明人： Tohru Umeno

IPC分类号： H01L27/06

CPC分类号： H01L23/49822 ,  H01L23/495 ,  H01L23/49531 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01005

摘要： A semiconductor apparatus comprising an integrated semiconductor circuit device having pluralities of electrode pads, pluralities of first external terminals connected to the electrode pads of the integrated semiconductor circuit device, an inductor disposed in a region surrounded by the first external terminals, and a resin portion sealing them, the integrated semiconductor circuit device being arranged on an upper surface of the inductor, and the inductor being exposed from a lower surface of the resin portion together with the first external terminals.

摘要翻译： 一种半导体装置，包括具有多个电极焊盘的集成半导体电路器件，连接到集成半导体电路器件的电极焊盘的多个第一外部端子，设置在由第一外部端子包围的区域中的电感器，以及树脂部分密封 它们，集成半导体电路器件布置在电感器的上表面上，并且电感器与第一外部端子一起从树脂部分的下表面露出。

公开(公告)号：US20100033286A1

公开(公告)日：2010-02-11

申请号：US12307433

申请日：2007-07-05

申请人： Yasuhisa Katayama ,  Tohru Umeno ,  Takeshi Tachibana

发明人： Yasuhisa Katayama ,  Tohru Umeno ,  Takeshi Tachibana

IPC分类号： H01F5/00

CPC分类号： H01F17/0013 ,  B32B18/00 ,  C04B35/265 ,  C04B2235/3208 ,  C04B2235/3232 ,  C04B2235/3239 ,  C04B2235/3251 ,  C04B2235/3274 ,  C04B2235/3277 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3293 ,  C04B2235/3298 ,  C04B2235/3418 ,  C04B2235/5409 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/72 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/704 ,  H01F3/14 ,  H01F41/046

摘要： A laminated device comprising pluralities of magnetic ferrite layers, conductor patterns each formed on each magnetic ferrite layer and connected in a lamination direction to form a coil, and a non-magnetic ceramic layer formed on at least one magnetic ferrite layer such that it overlaps the conductor patterns in a lamination direction, the non-magnetic ceramic layer comprising as main components non-magnetic ceramics having higher sintering temperatures than that of the magnetic ferrite, and further one or more of Cu, Zn and Bi in the form of an oxide.

摘要翻译： 一种层叠装置，包括多个磁性铁氧体层，各导电图案分别形成在每个磁性铁氧体层上并且沿层叠方向连接以形成线圈;以及非磁性陶瓷层，形成在至少一个磁性铁氧体层上，使得它与 所述非磁性陶瓷层包括作为主要组分的非磁性陶瓷，所述非磁性陶瓷的烧结温度高于所述磁性铁氧体，并且还包含一种或多种氧化物形式的Cu，Zn和Bi。

公开(公告)号：US08004381B2

公开(公告)日：2011-08-23

申请号：US12307433

申请日：2007-07-05

申请人： Yasuhisa Katayama ,  Tohru Umeno ,  Takeshi Tachibana

发明人： Yasuhisa Katayama ,  Tohru Umeno ,  Takeshi Tachibana

IPC分类号： H01F5/00 ,  H01F27/28 ,  H01F27/24 ,  B32B9/00 ,  C04B35/26

CPC分类号： H01F17/0013 ,  B32B18/00 ,  C04B35/265 ,  C04B2235/3208 ,  C04B2235/3232 ,  C04B2235/3239 ,  C04B2235/3251 ,  C04B2235/3274 ,  C04B2235/3277 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3293 ,  C04B2235/3298 ,  C04B2235/3418 ,  C04B2235/5409 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/72 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/704 ,  H01F3/14 ,  H01F41/046

摘要： A laminated device comprising pluralities of magnetic ferrite layers, conductor patterns each formed on each magnetic ferrite layer and connected in a lamination direction to form a coil, and a non-magnetic ceramic layer formed on at least one magnetic ferrite layer such that it overlaps the conductor patterns in a lamination direction, the non-magnetic ceramic layer comprising as main components non-magnetic ceramics having higher sintering temperatures than that of the magnetic ferrite, and further one or more of Cu, Zn and Bi in the form of an oxide.

摘要翻译： 一种层叠装置，包括多个磁性铁氧体层，各导电图案分别形成在每个磁性铁氧体层上并且沿层叠方向连接以形成线圈;以及非磁性陶瓷层，形成在至少一个磁性铁氧体层上，使得它与 所述非磁性陶瓷层包括作为主要组分的非磁性陶瓷，所述非磁性陶瓷的烧结温度高于所述磁性铁氧体，并且还包含一种或多种氧化物形式的Cu，Zn和Bi。