SUB-MILLISECOND OPTICAL DETECTION OF PULSED PLASMA PROCESSES

    公开(公告)号:US20250157801A1

    公开(公告)日:2025-05-15

    申请号:US18505810

    申请日:2023-11-09

    Abstract: An optical emission spectroscopy (OES) detection device includes an optical collector configured to be optically coupled to a plasma in a plasma processing apparatus, an adjustable wavelength filter optically coupled to the optical collector, and a photodetector optically coupled to the adjustable wavelength filter. The optical collector receives an optical signal from the plasma. The adjustable wavelength filter is configured to automatically adjust a passband of the adjustable wavelength filter to include a selected wavelength in response to receiving a wavelength selection signal, and allow a filtered portion of the optical signal to pass through while excluding a remaining portion of the optical signal. The filtered portion includes the selected wavelength. The photodetector is configured to generate an OES measurement in response to detecting the filtered portion of the optical signal with a response time that is less than one millisecond.

    HYBRID X-RAY AND OPTICAL METROLOGY AND NAVIGATION

    公开(公告)号:US20250060324A1

    公开(公告)日:2025-02-20

    申请号:US18620332

    申请日:2024-03-28

    Abstract: A method of characterizing a device under test (DUT) includes illuminating the DUT with a broadband optical beam within an optical field of view (FOV), illuminating the DUT with an X-ray beam within an X-ray FOV overlapping the optical FOV, and concurrently acquiring X-ray metrology information, e.g., one or more X-ray images utilizing various modalities, such as absorption, phase contrast difference, darkfield, small angle X-ray scattering (SAXS) and/or fluorescence, from the X-ray FOV and a plurality of optical images of the optical FOV, each of the optical images corresponding to respective selected wavelengths of the broadband optical beam from each of ultraviolet, visible, and infrared wavelengths, for example including deep ultraviolet, near infrared, or short-wavelength infrared wavelengths. The DUT may be one or more substrates, e.g., stacked, and include electronic devices such as three-dimensional integrated devices.

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