公开(公告)号：US09627192B2

公开(公告)日：2017-04-18

申请号：US14803421

申请日：2015-07-20

Applicant: Tokyo Electron Limited

Inventor： Naoyuki Okamura ,  Kazuki Kosai ,  Kazuhiro Teraoka ,  Fumihiro Kamimura

IPC: B08B3/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02057 ,  H01L21/67051

Abstract: Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.

公开(公告)号：US20160184859A1

公开(公告)日：2016-06-30

申请号：US14966026

申请日：2015-12-11

Applicant: Tokyo Electron Limited

Inventor： Fumihiro Kamimura ,  Hiromi Hara

IPC: B05C11/10 ,  H01L21/306 ,  B05C11/11 ,  H01L21/67 ,  B05C5/00

Abstract: Provided is a substrate liquid processing apparatus that processes a substrate with a processing liquid. The substrate liquid processing apparatus includes: a processing liquid storage unit configured to store the processing liquid therein; a processing liquid heating unit configured to heat the processing liquid, a controller configured to control the processing liquid heating unit; a temperature sensor; and a concentration sensor connected to the controller. The controller is configured to: measure a concentration of the processing liquid with the concentration sensor, measure a temperature of the processing liquid with the temperature sensor, calculate a boiling point corresponding to the measured concentration of the processing liquid, and control the output of the processing liquid heating unit, based on the boiling point and the measured temperature of the processing liquid.

Abstract translation: 提供了一种用处理液处理基板的基板液体处理装置。 基板液体处理装置包括：处理液体存储单元，被配置为在其中存储处理液体; 处理液加热单元，被配置为加热处理液;控制器，被配置为控制处理液加热单元; 温度传感器; 和连接到控制器的浓度传感器。 控制器被配置为：用浓度传感器测量处理液的浓度，用温度传感器测量处理液的温度，计算对应于所测量的处理液浓度的沸点，并控制 处理液体加热单元，基于处理液的沸点和测量温度。

公开(公告)号：US20160027635A1

公开(公告)日：2016-01-28

申请号：US14803421

申请日：2015-07-20

Applicant: Tokyo Electron Limited

Inventor： Naoyuki Okamura ,  Kazuki Kosai ,  Kazuhiro Teraoka ,  Fumihiro Kamimura

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02057 ,  H01L21/67051

Abstract: Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.

Abstract translation: 公开了一种用聚合物去除液清洗蚀刻的基板的基板处理装置（基板处理方法和其中存储有基板处理程序的计算机可读存储介质），其中异丙醇蒸气，水蒸气，去离子水 在用聚合物除去液体清洗基材之前，向基材供给异丙醇，氨水，氨水和异丙醇。

公开(公告)号：US09339775B2

公开(公告)日：2016-05-17

申请号：US14750319

申请日：2015-06-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroshi Tanaka ,  Koukichi Hiroshiro ,  Fumihiro Kamimura

IPC: B01F5/10 ,  B01F3/08 ,  B01F15/00 ,  B01F15/04 ,  C01B15/08 ,  C11D3/39 ,  C11D11/00 ,  H01L21/67 ,  B01F15/02 ,  B01F15/06

CPC classification number: B01F3/088 ,  B01F3/0861 ,  B01F3/0865 ,  B01F5/10 ,  B01F15/00253 ,  B01F15/00331 ,  B01F15/00396 ,  B01F15/0243 ,  B01F15/0412 ,  B01F15/0437 ,  B01F15/06 ,  B01F2015/062 ,  B01F2215/0036 ,  B01J19/24 ,  B01J2219/00103 ,  B01J2219/24 ,  C01B15/08 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/67057

Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxornonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.

Abstract translation: 本发明提供了当硫酸和过氧化氢溶液彼此混合时，能够充分产生有效地从基材中除去抗蚀剂的化学 - 液体混合方法和药物 - 液体混合装置。 首先，用硫酸填充内箱10，使从内箱10溢出的硫酸流入外箱12.然后，将过氧化氢溶液供给至内箱10，将氢 使过氧化物溶液流入外槽12，由此将过氧化氢溶液和硫酸的两种液体储存在外罐12中。同时当过氧化氢溶液流入外罐12时，返回泵 16被激活。

公开(公告)号：US10811266B2

公开(公告)日：2020-10-20

申请号：US14966026

申请日：2015-12-11

Applicant: Tokyo Electron Limited

Inventor： Fumihiro Kamimura ,  Hiromi Hara

IPC: H01L21/306 ,  H01L21/67

Abstract: Provided is a substrate liquid processing apparatus that processes a substrate with a processing liquid. The substrate liquid processing apparatus includes: a processing liquid storage unit configured to store the processing liquid therein; a processing liquid heating unit configured to heat the processing liquid, a controller configured to control the processing liquid heating unit; a temperature sensor; and a concentration sensor connected to the controller. The controller is configured to: measure a concentration of the processing liquid with the concentration sensor, measure a temperature of the processing liquid with the temperature sensor, calculate a boiling point corresponding to the measured concentration of the processing liquid, and control the output of the processing liquid heating unit, based on the boiling point and the measured temperature of the processing liquid.

公开(公告)号：US09415356B1

公开(公告)日：2016-08-16

申请号：US15130282

申请日：2016-04-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroshi Tanaka ,  Koukichi Hiroshiro ,  Fumihiro Kamimura

IPC: B01F3/08 ,  B01F5/10 ,  B01F15/00 ,  B01F15/06 ,  B01J19/24 ,  C01B15/08

CPC classification number: B01F3/088 ,  B01F3/0861 ,  B01F3/0865 ,  B01F5/10 ,  B01F15/00253 ,  B01F15/00331 ,  B01F15/00396 ,  B01F15/0243 ,  B01F15/0412 ,  B01F15/0437 ,  B01F15/06 ,  B01F2015/062 ,  B01F2215/0036 ,  B01J19/24 ,  B01J2219/00103 ,  B01J2219/24 ,  C01B15/08 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/67057

Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.

公开(公告)号：US11869777B2

公开(公告)日：2024-01-09

申请号：US17030488

申请日：2020-09-24

Applicant: Tokyo Electron Limited

Inventor： Fumihiro Kamimura ,  Masatoshi Kasahara ,  Teruomi Minami ,  Ikuo Sunaka

IPC: H01L21/67 ,  B08B3/04 ,  B08B7/00 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/04 ,  B08B7/0014 ,  H01L21/02057 ,  H01L21/67248 ,  H01L21/68764

Abstract: A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.

公开(公告)号：US11712710B2

公开(公告)日：2023-08-01

申请号：US16528757

申请日：2019-08-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Fumihiro Kamimura ,  Takahisa Otsuka ,  Hiroshi Komiya ,  Nobuhiro Ogata

IPC: H01L21/67 ,  B05B14/30 ,  B05B1/30

CPC classification number: B05B14/30 ,  B05B1/3093 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67017 ,  H01L21/67023 ,  H01L21/67051

Abstract: A substrate processing apparatus includes: a processing chamber in which a substrate is processed with a processing liquid; a nozzle having a discharge port from which the processing liquid is discharged, the discharge port being formed in a distal end portion of the nozzle; a nozzle bath including an accommodation chamber formed therein, wherein the distal end portion of the nozzle is accommodated in the accommodation chamber at a standby time at which the processing liquid is not supplied to the substrate; a circulation line configured to return the processing liquid, which is discharged from the nozzle to the nozzle bath, to the nozzle; and a first restraint part configured to restrain a gas from flowing between an outside of the nozzle bath and the processing liquid present inside the nozzle bath when the processing liquid discharged from the nozzle to the nozzle bath is circulated to the nozzle.