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1.发明申请公开(公告)号：US20170287703A1
公开(公告)日：2017-10-05
申请号：US15454154
申请日：2017-03-09
发明人： Yoshifumi Amano , Satoshi Morita , Ryoji Ikebe , Isamu Miyamoto
CPC分类号： H01L21/02087 , B08B3/08 , G03B13/32 , G03B17/08 , H01L21/6704 , H01L21/6708 , H01L21/67253 , H01L21/67259 , H01L22/12 , H01L22/20
摘要： Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.
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公开(公告)号：US20210257236A1
公开(公告)日：2021-08-19
申请号：US17242709
申请日：2021-04-28
发明人： Yoshifumi Amano , Satoshi Morita , Ryoji Ikebe , Isamu Miyamoto
摘要： A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
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3.发明申请公开(公告)号：US20170287704A1
公开(公告)日：2017-10-05
申请号：US15454269
申请日：2017-03-09
发明人： Yoshifumi Amano , Satoshi Morita , Ryoji Ikebe , Isamu Miyamoto
IPC分类号： H01L21/02 , H01L21/66 , G05B19/402 , H01L21/67
CPC分类号： H01L22/20 , G05B2219/45031 , H01L21/6708 , H01L21/67253 , H01L21/67259 , H01L22/12
摘要： Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.
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公开(公告)号：US11011436B2
公开(公告)日：2021-05-18
申请号：US15454269
申请日：2017-03-09
发明人： Yoshifumi Amano , Satoshi Morita , Ryoji Ikebe , Isamu Miyamoto
摘要： Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.
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公开(公告)号：US10128137B2
公开(公告)日：2018-11-13
申请号：US15454346
申请日：2017-03-09
发明人： Yoshifumi Amano , Satoshi Morita , Ryoji Ikebe , Isamu Miyamoto
摘要： A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
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公开(公告)号：US11905603B2
公开(公告)日：2024-02-20
申请号：US17553971
申请日：2021-12-17
发明人： Takashi Nakazawa , Isamu Miyamoto , Keigo Satake , Kenji Nakamizo
摘要： A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.
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公开(公告)号：US11880213B2
公开(公告)日：2024-01-23
申请号：US17320733
申请日：2021-05-14
CPC分类号： G05D7/0635 , B05C11/1026 , H01L21/6708 , H01L21/67023 , H01L21/67253 , G01F1/661 , G01M3/38
摘要： A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.
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公开(公告)号：US11018035B2
公开(公告)日：2021-05-25
申请号：US16154936
申请日：2018-10-09
发明人： Yoshifumi Amano , Satoshi Morita , Ryoji Ikebe , Isamu Miyamoto
摘要： A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
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公开(公告)号：US10217628B2
公开(公告)日：2019-02-26
申请号：US15454154
申请日：2017-03-09
发明人： Yoshifumi Amano , Satoshi Morita , Ryoji Ikebe , Isamu Miyamoto
摘要： Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.
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公开(公告)号：US20190043742A1
公开(公告)日：2019-02-07
申请号：US16154936
申请日：2018-10-09
发明人： Yoshifumi Amano , Satoshi Morita , Ryoji Ikebe , Isamu Miyamoto
摘要： A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
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