公开(公告)号：US20130334172A1

公开(公告)日：2013-12-19

申请号：US13677534

申请日：2012-11-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuhei Matsumoto ,  Shuji Iwanaga ,  Hiroshi Tomita ,  Kenji Nakamizo ,  Satoshi Morita

IPC: H01L21/67 ,  G05D3/00

CPC classification number: H01L21/67023 ,  G05D3/00 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67259

Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.

Abstract translation: 公开了一种能够在不受例如基板的材料或表面状况的影响的情况下精确地确定基板的保持状态的液体处理装置。 液体处理装置包括：保持基板的基板保持单元，当基板被基板保持单元适当地保持时拍摄基板周边部分存在的区域的照相机;以及控制单元，其确定基板保持单元的保持状态 所述基板由所述基板保持单元基于由所述照相机拍摄的图像保持。

公开(公告)号：US11135698B2

公开(公告)日：2021-10-05

申请号：US15181527

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki

IPC: B24B37/005 ,  B24B37/20

Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.

公开(公告)号：US11094568B2

公开(公告)日：2021-08-17

申请号：US15960800

申请日：2018-04-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji Nakamizo ,  Satoshi Morita ,  Akinori Tanaka ,  Hiroshi Komiya ,  Mikio Nakashima ,  Kousuke Fukuda ,  Youichi Masaki ,  Ryoji Ando ,  Ikuo Sunaka

IPC: H01L21/67 ,  G01F9/00 ,  G01M3/28 ,  G01F25/00 ,  G05B23/02 ,  G01F15/00

Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.

公开(公告)号：US12264396B2

公开(公告)日：2025-04-01

申请号：US18517341

申请日：2023-11-22

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakazawa ,  Isamu Miyamoto ,  Keigo Satake ,  Kenji Nakamizo

IPC: C23F1/26 ,  C23F1/08

Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

公开(公告)号：US11905603B2

公开(公告)日：2024-02-20

申请号：US17553971

申请日：2021-12-17

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakazawa ,  Isamu Miyamoto ,  Keigo Satake ,  Kenji Nakamizo

IPC: C23F1/26 ,  C23F1/08

CPC classification number: C23F1/26 ,  C23F1/08

Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

公开(公告)号：US20160370810A1

公开(公告)日：2016-12-22

申请号：US15181770

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki ,  Takuro Masuzumi

IPC: G05D7/06

CPC classification number: G05D7/0635 ,  G05B2219/41303 ,  H01L21/67051 ,  H01L21/67253

Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.

Abstract translation: 公开了一种包括室，至少一个喷嘴，测量单元，打开/关闭单元和控制器的处理设备。 该室容纳工件。 喷嘴设置在腔室中以朝向工件供应处理流体。 测量单元测量供应到喷嘴的处理流体的供应流量。 打开/关闭单元执行要供给到喷嘴的处理流体的流路的打开/关闭。 控制器以预设的定时输出打开和关闭操作信号。 在输出打开操作信号之后，控制器基于测量单元的测量结果计算处理流体的积分量，并且执行输出定时改变处理以改变从预设定时输出打开或关闭操作信号的定时 基于计算的积分量。

公开(公告)号：US10261521B2

公开(公告)日：2019-04-16

申请号：US15181770

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki ,  Takuro Masuzumi

IPC: G06F19/00 ,  G05D7/06 ,  H01L21/67

Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.

公开(公告)号：US20160368114A1

公开(公告)日：2016-12-22

申请号：US15181527

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.

Abstract translation: 公开了一种处理装置，其包括容纳工件的室，设置在室内的喷嘴，测量供给到喷嘴的处理流体的供给流量的测量单元，执行流路开闭的打开/关闭单元 的处理流体，以及控制器。 控制器根据指示处理内容的配方信息发送打开/关闭操作信号，该打开/关闭操作信号使打开/关闭单元执行打开/关闭操作。 根据配方信息向打开/关闭单元发送打开/关闭操作信号后，控制器基于测量单元的测量结果开始积分供给流量，基于以下方式监视供给流量的上升 计算的积分量，以及当提供特定流量时，基于由测量单元实际测量的值监视供给流量。

公开(公告)号：US09039863B2

公开(公告)日：2015-05-26

申请号：US13677534

申请日：2012-11-15

Applicant: Tokyo Electron Limited

Inventor： Shuhei Matsumoto ,  Shuji Iwanaga ,  Hiroshi Tomita ,  Kenji Nakamizo ,  Satoshi Morita

IPC: C23F1/00 ,  H01L21/67 ,  G05D3/00

CPC classification number: H01L21/67023 ,  G05D3/00 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67259

Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.

Abstract translation: 公开了一种能够在不受例如基板的材料或表面状况的影响的情况下精确地确定基板的保持状态的液体处理装置。 液体处理装置包括：保持基板的基板保持单元，当基板被基板保持单元适当地保持时拍摄基板周边部分存在的区域的照相机;以及控制单元，其确定基板保持单元的保持状态 所述基板由所述基板保持单元基于由所述照相机拍摄的图像保持。