公开(公告)号：US20150036109A1

公开(公告)日：2015-02-05

申请号：US14449419

申请日：2014-08-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke YOSHIHARA ,  Hideharu KYOUDA ,  Koshi MUTA ,  Taro YAMAMOTO ,  Yasushi TAKIGUCHI ,  Masahiro FUKUDA

IPC: G03F7/30

CPC classification number: G03F7/3021 ,  B05C5/02 ,  B05C5/027 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/30 ,  H01L21/6715

Abstract: A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.

Abstract translation: 显影方法包括：通过基板保持器水平保持曝光的基板; 通过从显影剂喷嘴提供显影剂，在基底的一部分上形成液体熔池; 旋转基板; 通过使显影剂喷嘴移动使得旋转基板上的显影剂的供给位置沿基板的径向方向移动，将液体熔池分散在基板的整个表面上; 使液体熔池在基板的整个表面上的扩展同时与接触部分与液体熔池接触，接触部分被构造成与显影剂喷嘴一起移动并且具有与基板相对的表面， 小于衬底的表面。 根据该方法，能够抑制向基板外侧落下的液体的量。 此外，由于可以降低基板的旋转速度，可以抑制显影剂的飞溅。 此外，可以通过搅拌显影剂来提高生产量。

公开(公告)号：US20170090291A1

公开(公告)日：2017-03-30

申请号：US15374081

申请日：2016-12-09

Applicant: Tokyo Electron Limited

Inventor： Kousuke YOSHIHARA ,  Hideharu KYOUDA ,  Koshi MUTA ,  Taro YAMAMOTO ,  Yasushi TAKIGUCHI ,  Masahiro FUKUDA

IPC: G03F7/30 ,  B05C11/08 ,  B05C5/02 ,  B05D1/00 ,  B05D1/26

CPC classification number: G03F7/3021 ,  B05C5/02 ,  B05C5/027 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/30 ,  H01L21/6715

Abstract: A developing apparatus including a horizontal substrate holder, a rotating mechanism to rotate the substrate holder, a developer nozzle to supply a developer onto a part of the substrate to form a liquid puddle, a moving mechanism to move the developer nozzle in a radial direction of the rotating substrate, a contact part that moves with the developer nozzle and has a surface opposed to the substrate, which is smaller than the surface of the substrate, and a control unit to output a control signal such that a supply position of the developer on the substrate is moved in the radial direction of the substrate so that the liquid puddle is spread out on a whole surface of the substrate while the contact part is in contact with the liquid puddle.

公开(公告)号：US20150027492A1

公开(公告)日：2015-01-29

申请号：US14321054

申请日：2014-07-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Hideharu KYOUDA ,  Koshi MUTA

IPC: B08B1/04 ,  B08B3/04 ,  H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67046 ,  H01L21/68792

Abstract: There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.

Abstract translation: 设置有第一和第二清洁部件，其构造成当由吸收垫保持的晶片水平保持时清洁晶片的后表面中的中心区域，并且被配置为清洁晶片的后表面中的周边区域， 晶片由旋转卡盘保持。 由于提供第一和第二清洁部件，与仅使用一个清洁部件的情况相比，可以提高洗涤性。 第一和第二清洁构件被构造成由公共转动轴水平转动。 当清洁晶片后表面中的中心区时，转轴被定位成与晶片重叠。 由于通过使用晶片的移动区域来定位转动轴，所以可以减小装置的尺寸。

公开(公告)号：US20160314958A1

公开(公告)日：2016-10-27

申请号：US15204068

申请日：2016-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Akihiro FUJIMOTO ,  Shuuichi NISHIKIDO ,  Dai KUMAGAI ,  Naoto YOSHITAKA ,  Takahiro KITANO ,  Yoichi TOKUNAGA

IPC: H01L21/02 ,  H01L21/687 ,  B08B5/02 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02 ,  H01L21/67 ,  B08B7/00

CPC classification number: H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

Abstract translation: 公开的用于清洁基板的背面的基板清洁装置包括：第一基板支撑部，其构造成在基板的背面的第一区域处支撑基板，所述背面朝下; 第二基板支撑部，其构造成在所述基板的背面的第二区域处支撑所述基板，所述第二区域与所述第一区域分离; 清洗液供给部，构成为向所述基板的背面供给清洗液; 干燥部，其构造成干燥所述基板的背面的第二区域; 以及清洁部，其构造成当所述基板被所述第一基板支撑部支撑所述基板时，清洁所述基板的背面的第三区域，所述第三区域包括所述第二区域以及所述基板的背面的第四区域， 基板由第二基板支撑部分支撑，除了后表面的第二区域之外的第四区域。

公开(公告)号：US20140071411A1

公开(公告)日：2014-03-13

申请号：US14022434

申请日：2013-09-10

Applicant: Tokyo Electron Limited

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshinori IKEDA ,  Koki YOSHIMURA ,  Yoshiki OKAMOTO ,  Masahiro FUKUDA

IPC: G03F7/30

CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

公开(公告)号：US20180308719A1

公开(公告)日：2018-10-25

申请号：US16014308

申请日：2018-06-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Koki YOSHIMURA ,  Taro YAMAMOTO ,  Hideharu KYOUDA ,  Koshi MUTA

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/6715

Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

公开(公告)号：US20160202609A1

公开(公告)日：2016-07-14

申请号：US15051780

申请日：2016-02-24

Applicant: Tokyo Electron Limited

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshinori IKEDA ,  Koki YOSHIMURA ,  Yoshiki OKAMOTO ,  Masahiro FUKUDA

IPC: G03F7/16

CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

公开(公告)号：US20150027503A1

公开(公告)日：2015-01-29

申请号：US14339539

申请日：2014-07-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Koki YOSHIMURA ,  Taro YAMAMOTO ,  Hideharu KYOUDA ,  Koshi MUTA

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/6715

Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

Abstract translation: 一种用于使用处理流体对基板进行液体处理的液体处理装置，包括：沿左右方向并排布置的多个基板保持单元; 喷嘴，被构造成将处理流体供应到保持在每个基板保持单元中的基板; 以及喷嘴移动机构，其构造成使喷嘴在与将基板保持单元的排列方向相交的前后方向向前后方向移动，所述喷嘴移动机构在供给位置和供给位置之间，所述供给位置将所述处理流体供给至包含所述基板的中央部的区域， 限定在与衬底保持单元的行的前侧相对的衬底保持单元的行的后侧处的基准装载和卸载的等待位置。

公开(公告)号：US20140102474A1

公开(公告)日：2014-04-17

申请号：US14049815

申请日：2013-10-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Akihiro FUJIMOTO ,  Shuuichi NISHIKIDO ,  Dai KUMAGAI ,  Naoto YOSHITAKA ,  Takahiro KITANO ,  Yoichi TOKUNAGA

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

Abstract: A substrate cleaning apparatus for cleaning a substrate back surface includes a first substrate supporting portion supporting the substrate at a first area of the substrate back surface, the back surface facing down; a second substrate supporting portion supporting the substrate at a second area of the substrate back surface, the second area being separated from the first area; a cleaning liquid supplying portion supplying cleaning liquid to the substrate back surface; a drying portion drying the second area of the substrate back surface; and a cleaning portion cleaning a third area of the substrate back surface when the substrate is supported by the first substrate supporting portion, the third area including the second area, and cleaning a fourth area of the substrate back surface when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area.

Abstract translation: 用于清洗衬底背面的衬底清洁装置包括在衬底背面的第一区域处支撑衬底的第一衬底支撑部分，其背面朝下; 第二基板支撑部，在所述基板背面的第二区域支撑所述基板，所述第二区域与所述第一区域分离; 清洗液供给部，其向所述基板背面供给清洗液; 干燥部，干燥所述基板背面的第二区域; 以及当所述基板被所述第一基板支撑部支撑时，所述清洁部分清洁所述基板背面的第三区域，所述第三区域包括所述第二区域，以及当所述基板被所述第二区域支撑时，清洁所述基板背面的第四区域 第二基板支撑部分，除第二区域之外的第四区域。

公开(公告)号：US20210039221A1

公开(公告)日：2021-02-11

申请号：US16977935

申请日：2019-02-26

Applicant: Tokyo Electron Limited

Inventor： Nozomu KANETAKE ,  Akihiro KUBO ,  Teruhiko KODAMA ,  Taro YAMAMOTO ,  Yasushi TAKIGUCHI ,  Yoshiki OKAMOTO ,  Hayato HOSAKA

IPC: B24B7/22 ,  H01L21/67 ,  B24B19/02 ,  B24B41/047

Abstract: A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.