公开(公告)号：US20220244685A1

公开(公告)日：2022-08-04

申请号：US17584712

申请日：2022-01-26

Applicant: Tokyo Electron Limited

Inventor： Yuto NODA ,  Shota YAMAZAKI ,  Yuichi TAKENAGA ,  Toshiyuki FUKUMOTO

IPC: G05B13/04 ,  G05B13/02 ,  G05B23/02

Abstract: An information processing device includes: a machine learning model selection part configured to select a machine learning model appropriate for a data set used for learning of the machine learning model; a calculation part configured to perform an optimization calculation by using the selected machine learning model to calculate process conditions that can achieve a target process result, predicted values of a process result corresponding to each of the process conditions, and reliability of the predicted values; a process condition selection part configured to select, among the process conditions that can achieve the target process result, one or more process conditions according to the predicted values of the process result and the reliability of the predicted values; and a display controller configured to display the selected process conditions, the predicted values of the process result corresponding to each of the selected process conditions, and the reliability of the predicted values.

公开(公告)号：US20240404849A1

公开(公告)日：2024-12-05

申请号：US18668806

申请日：2024-05-20

Applicant: Tokyo Electron Limited

Inventor： Tatsuya WATANABE ,  Yuichi TAKENAGA ,  Shota YAMAZAKI ,  Youngtai KANG

IPC: H01L21/67 ,  H01L21/673

Abstract: A substrate processing system includes a substrate processing apparatus including a processing container and a boat for transferring a plurality of substrates into the processing container; a measuring device that measures a substrate processing result of a substrate in the substrate processing apparatus; and an information processing device that estimates substrate processing results at a plurality of points on the substrate, based on the substrate processing result. The information processing device of the substrate processing system includes an input unit that inputs summary data extracted from the substrate processing result measured by the measuring device, a calculation unit that calculates a plurality of estimated values indicating the substrate processing results at the plurality of points on the substrate based on the summary data; and a display control unit that displays the plurality of estimated values on a display device.

公开(公告)号：US20240026541A1

公开(公告)日：2024-01-25

申请号：US18223703

申请日：2023-07-19

Applicant: Tokyo Electron Limited

Inventor： Shota YAMAZAKI

IPC: C23C16/52

CPC classification number: C23C16/52 ,  H01L21/67069

Abstract: An information processing apparatus includes: a registration reception unit that receives a registration of registration information for identifying log information of a desired process step from log information of a substrate processing apparatus that has performed a process including a plurality of steps according to a process condition; an identification unit that identifies the log information of the desired process step from the log information of the substrate processing apparatus, based on the registration information; a process condition acquisition unit that acquires a process condition of the desired process step from the identified log information of the desired process step; an optimization unit that optimizes the process condition of the desired process step, using the acquired process condition of the desired process step, and process result information of the process; and an output unit that outputs the optimized process condition of the desired process step.

公开(公告)号：US20210134570A1

公开(公告)日：2021-05-06

申请号：US17075869

申请日：2020-10-21

Applicant: Tokyo Electron Limited

Inventor： Shota YAMAZAKI ,  Yuichi TAKENAGA

IPC: H01J37/32 ,  H01L21/67 ,  G05B19/4155 ,  C23C16/455 ,  C23C16/52

Abstract: An information processing device includes a storage configured to store a first film thickness model or a first refractive index model defining an amount of change in a film thickness or a refractive index at each position of a first wafer when a film forming processing is performed by changing an output of each of a plurality of plasma sources provided in a film forming device by a predetermined amount and a calculator configured to calculate, based on the first film thickness model or the first refractive index model, a correction value of the output of each of the plurality of plasma sources to achieve a target value of a film thickness or a target value of a refractive index at each position of a second wafer.

公开(公告)号：US20250087455A1

公开(公告)日：2025-03-13

申请号：US18956002

申请日：2024-11-22

Applicant: Tokyo Electron Limited

Inventor： Sho KUMAKURA ,  Soichiro KIMURA ,  Koyumi SASA ,  Nobuhiro ODASHIMA ,  Yuji MASAKI ,  Noboru TAKEMOTO ,  Makoto KOBAYASHI ,  Shota YAMAZAKI

IPC: H01J37/305 ,  H01L21/02

Abstract: An etching method includes a step (a) of providing a substrate, the substrate including a first film and a second film having an opening on the first film, the first film containing a metallic element and a non-metallic element, a step (b) of forming a protective film on a sidewall of a recess formed in the first film corresponding to the opening, and a step (c) of etching the first film through the opening with a plasma generated from a processing gas including a halogen-containing gas at the same time as or after the step (b).

公开(公告)号：US20250046658A1

公开(公告)日：2025-02-06

申请号：US18782981

申请日：2024-07-24

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki KARASAWA ,  Masakazu YAMAMOTO ,  Yuichi TAKENAGA ,  Youngtai KANG ,  Shota YAMAZAKI

IPC: H01L21/66 ,  C23C16/46 ,  C23C16/52

Abstract: A substrate processing method includes providing a substrate processing apparatus including a processing container that accommodates a substrate, and a heater that heats an inside of the processing container; setting a specific section with an in-plane temperature distribution of a substrate that results in a desired outcome of substrate processing based on a first prediction model that predicts a time-dependent change of the in-plane temperature distribution of the substrate after temperature increase or decrease caused by the heater; and performing the substrate processing in the specific section.

公开(公告)号：US20240328782A1

公开(公告)日：2024-10-03

申请号：US18612938

申请日：2024-03-21

Applicant: Tokyo Electron Limited

Inventor： Shota YAMAZAKI

IPC: G01B21/08

CPC classification number: G01B21/08

Abstract: An information processing apparatus includes an input unit that inputs positional information regarding a plurality of measurement points on a substrate and a plurality of measured values indicating a substrate processing result at each of the plurality of measurement points, a calculation unit that calculates a plurality of estimated values for the substrate processing result at each of the plurality of measurement points selected from the input positional information regarding the plurality of measurement points using a local linear regression method, a determination unit that determines, as an outlier, the measured value at the measurement point where an absolute value of a difference between the measured value and the estimated value at each of the plurality of selected measurement points deviates from a preset threshold, and a correction unit that corrects the measured value at the measurement point determined as the outlier.