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公开(公告)号：US11581201B2
公开(公告)日：2023-02-14
申请号：US16820898
申请日：2020-03-17
Applicant: Tokyo Electron Limited
Inventor： Kazuteru Obara , Tatsuya Yamaguchi , Yasuaki Kikuchi , Ryuji Kusajima , Shinya Nasukawa , Kazuyuki Kikuchi
IPC: H01L21/67 , C23C16/455 , H01L21/324 , H01L21/677 , C23C16/34
Abstract: A heat treatment apparatus includes: a processing container configured to accommodate and process a plurality of substrates in multiple tiers under a reduced-pressure environment; a first heater configured to heat the plurality of substrates accommodated in the processing container; a plurality of gas supply pipes configured to supply a gas to positions having different heights in the processing container; and a second heater provided on a gas supply pipe that supplies a gas to a lowermost position among the plurality of gas supply pipes, and configured to heat the gas in the gas supply pipe.
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2.发明授权公开(公告)号：US11257697B2
公开(公告)日：2022-02-22
申请号：US16396994
申请日：2019-04-29
Applicant: Tokyo Electron Limited
Inventor： Tatsuya Yamaguchi , Yasuaki Kikuchi
Abstract: A temperature monitoring apparatus includes: a calculator configured to calculate a temperature monitoring waveform by a first-order lag function based on an elapsed time from a start of a temperature change from a first temperature to a second temperature, and a time constant calculated based on a locus of the temperature change; and a monitor configured to monitor a temperature changing from the first temperature to the second temperature based on the temperature monitoring waveform calculated by the calculator.
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公开(公告)号：US20200303222A1
公开(公告)日：2020-09-24
申请号：US16820898
申请日：2020-03-17
Applicant: Tokyo Electron Limited
Inventor： Kazuteru Obara , Tatsuya Yamaguchi , Yasuaki Kikuchi , Ryuji Kusajima , Shinya Nasukawa , Kazuyuki Kikuchi
IPC: H01L21/67 , C23C16/455 , C23C16/34 , H01L21/677 , H01L21/324
Abstract: A heat treatment apparatus includes: a processing container configured to accommodate and process a plurality of substrates in multiple tiers under a reduced-pressure environment; a first heater configured to heat the plurality of substrates accommodated in the processing container; a plurality of gas supply pipes configured to supply a gas to positions having different heights in the processing container; and a second heater provided on a gas supply pipe that supplies a gas to a lowermost position among the plurality of gas supply pipes, and configured to heat the gas in the gas supply pipe.
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公开(公告)号：US11114319B2
公开(公告)日：2021-09-07
申请号：US16690712
申请日：2019-11-21
Applicant: Tokyo Electron Limited
Inventor： Tatsuya Yamaguchi , Yasuaki Kikuchi , Koji Yoshii , Wataru Nakajima , Norio Baba
IPC: H01L21/67 , H01L21/263 , H01L21/66
Abstract: A heat treatment apparatus includes a heating unit provided around a processing container accommodating a substrate; a plurality of blowing units configured to blow a cooling medium into a space between the processing container and the heating unit; and a shutter configured to simultaneously opens/closes at least two of the plurality of blowing units and including a slit formed corresponding to each of the blowing units.
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公开(公告)号：US20200340116A1
公开(公告)日：2020-10-29
申请号：US16852475
申请日：2020-04-18
Applicant: Tokyo Electron Limited
Inventor： Yasuaki Kikuchi , Tatsuya Yamaguchi , Kazuteru Obara , Ryuji Kusajima
Abstract: A heat treatment apparatus includes: an inner tube having a cylindrical shape and configured to accommodate a substrate; an outer tube configured to cover an outside of the inner tube; a heater provided around the outer tube; a gas supply pipe that extends along a longitudinal direction in the inner tube; an opening formed in a side wall of the inner tube facing the gas supply pipe; a temperature sensor provided at a position shifted by a predetermined angle from the opening in a circumferential direction of the inner tube; and a controller that controls the heater based on a detected value of the temperature sensor.
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Patent Agency Ranking
公开(公告)号：US20200340111A1
公开(公告)日：2020-10-29
申请号：US16852478
申请日：2020-04-19
Applicant: Tokyo electron limited
Inventor： Yasuaki Kikuchi , Tatsuya Yamaguchi , Kazuteru Obara , Ryuji Kusajima
IPC: C23C16/455 , C23C16/34 , C23C16/458
Abstract: A film forming method includes: accommodating a substrate in a processing container of a film forming apparatus; supplying an inert gas to the processing container at a flow rate equal to an average flow rate of a plurality of gases to be supplied into the processing container in a film forming process and maintaining a pressure of the processing container to be substantially same as an average pressure of the processing container in the film forming process; and alternately supplying the plurality of gases into the processing container and forming a film on the substrate.
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7.发明申请公开(公告)号：US20190341284A1
公开(公告)日：2019-11-07
申请号：US16396994
申请日：2019-04-29
Applicant: Tokyo Electron Limited
Inventor： Tatsuya Yamaguchi , Yasuaki Kikuchi
Abstract: A temperature monitoring apparatus includes: a calculator configured to calculate a temperature monitoring waveform by a first-order lag function based on an elapsed time from a start of a temperature change from a first temperature to a second temperature, and a time constant calculated based on a locus of the temperature change; and a monitor configured to monitor a temperature changing from the first temperature to the second temperature based on the temperature monitoring waveform calculated by the calculator.
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公开(公告)号：US10431479B2
公开(公告)日：2019-10-01
申请号：US15864299
申请日：2018-01-08
Applicant: Tokyo Electron Limited
Inventor： Tatsuya Yamaguchi , Kazuteru Obara , Yasuaki Kikuchi , Koji Yoshii
IPC: H01L21/67
Abstract: Disclosed is a heat treatment apparatus including: a processing container configured to accommodate a substrate; a furnace body having a heater configured to heat the substrate accommodated in the processing container and provided around the processing container; a blower configured to supply a coolant to a space between the processing container and the furnace body; and a controller having a continuous operation mode in which the blower is continuously energized and an intermittent operation mode in which energization and de-energization of the blower are repeated, and configured to control driving of the blower based on an instruction voltage. The controller drives the blower in the intermittent operation mode when the instruction voltage is higher than 0 V and lower than a predetermined threshold voltage.
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9.发明授权公开(公告)号：US11815407B2
公开(公告)日：2023-11-14
申请号：US17007009
申请日：2020-08-31
Applicant: Tokyo Electron Limited , Furuya Metal Co., Ltd.
Inventor： Hisashi Inoue , Masahiro Kobayashi , Yasuaki Kikuchi , Tatsuya Yamaguchi , Koji Yoshii , Kensuke Morita , Jun Itabashi
Abstract: A thermocouple structure according to one aspect of the present disclosure includes a first element wire, second element wires formed of a material different from the first element wire, an insulating covering member covering at least one of the first element wire and the second element wires, and a protective tube accommodating the first element wire and the second element wire. Each of the second element wires is bonded to a different position on the first element wire.
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公开(公告)号：US20200168486A1
公开(公告)日：2020-05-28
申请号：US16690712
申请日：2019-11-21
Applicant: Tokyo Electron Limited
Inventor： Tatsuya Yamaguchi , Yasuaki Kikuchi , Koji Yoshii , Wataru Nakajima , Norio Baba
IPC: H01L21/67 , H01L21/66 , H01L21/263
Abstract: A heat treatment apparatus includes a heating unit provided around a processing container accommodating a substrate; a plurality of blowing units configured to blow a cooling medium into a space between the processing container and the heating unit; and a shutter configured to simultaneously opens/closes at least two of the plurality of blowing units and including a slit formed corresponding to each of the blowing units.
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