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公开(公告)号：US11441101B2
公开(公告)日：2022-09-13
申请号：US16336658
申请日：2017-09-22
Applicant: TOKYO OHKA KOGYO CO., LTD. , TOKYO ELECTRON LIMITED
Inventor： Isao Hirano , Kazumasa Wakiya , Shoichi Terada , Junji Nakamura , Takayuki Toshima
Abstract: A cleaning composition which can remove a layer of interest using a conventional apparatus, such as a coater, a baking furnace and a cleaning chamber, installed in semiconductor manufacturing equipment while preventing the damage or deformation of layers other than the layer of interest, such as a substrate and an interlayer insulation film; a cleaning method using the cleaning composition; and a method for producing a semiconductor employing the cleaning method. A layer of interest formed on a substrate is cleaned with a cleaning composition containing a component capable of decomposing the layer of interest and a film-forming polymer. An example of the layer of interest is a hard mask film. An example of the component is at least one of a basic compound and an acidic compound.
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公开(公告)号：US10347482B2
公开(公告)日：2019-07-09
申请号：US15661157
申请日：2017-07-27
Applicant: Tokyo Electron Limited
Inventor： Takayuki Toshima , Shoichi Terada , Junji Nakamura
IPC: B08B3/10 , H01L21/02 , B08B3/08 , H01L21/67 , H01L21/311 , H01L21/3213
Abstract: The present disclosure relates to a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of an adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to a substrate, a substrate heating unit configured to subsequently heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent in the processing liquid and is lower than the boiling point of the removing agent, and a rinsing liquid supplying unit configured to subsequently supply a rinsing liquid to the substrate so as to remove the adhered substance from the substrate.
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公开(公告)号：US09744551B2
公开(公告)日：2017-08-29
申请号：US13920219
申请日：2013-06-18
Applicant: Tokyo Electron Limited
Inventor： Takayuki Ishii , Takahiro Sakamoto , Takahiro Kitano , Shoichi Terada
CPC classification number: B05C5/0258 , B05B1/044 , B05B12/081 , B05C5/0254 , H01L21/6715
Abstract: Disclosed is a coating apparatus capable of enhancing the film thickness uniformity. The coating apparatus includes a nozzle and a moving mechanism. The nozzle includes a storage chamber that stores a coating liquid and a slit-like flow path that is in communication with the storage chamber, and discharges the coating liquid through a discharge port formed at a front end of the flow path. The moving mechanism moves the nozzle and the substrate relatively to each other along a surface of the substrate. Also, in the flow path provided in the nozzle, flow resistance at the central portion in the longitudinal direction is larger than that at both end portions in the longitudinal direction.
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Patent Agency Ranking
公开(公告)号：US11355362B2
公开(公告)日：2022-06-07
申请号：US16606660
申请日：2018-02-02
Applicant: TOKYO OHKA KOGYO CO., LTD. , TOKYO ELECTRON LIMITED
Inventor： Isao Hirano , Shoichi Terada , Junji Nakamura , Takayuki Toshima
IPC: H01L21/02 , H01L21/027 , H01L21/304 , H01L21/3065 , H01L21/308 , H01L21/324 , H01L21/67 , C11D7/08 , C11D7/34 , G03F7/42
Abstract: A washing method, a washing device, a storage medium, and a washing composition for enabling effective removal of a layer to be processed by decomposing or degenerating the layer to be processed at a higher temperature than conventionally. In a state where a substrate provided with a layer to be processed is heated, the substrate is supplied with vapor of a component that can decompose the layer to be processed, and thereafter the layer to be processed that has reacted with the component is removed from the substrate. As the component, a nitric acid or a sulfonic acid is preferable. As the sulfonic acid, a fluorinated alkyl sulfonic acid is preferable.
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公开(公告)号：US20180040468A1
公开(公告)日：2018-02-08
申请号：US15661157
申请日：2017-07-27
Applicant: Tokyo Electron Limited
Inventor： Takayuki Toshima , Shoichi Terada , Junji Nakamura
CPC classification number: H01L21/0206 , B08B3/08 , B08B3/10 , B08B3/106 , H01L21/02071 , H01L21/31122 , H01L21/31144 , H01L21/32139 , H01L21/67028 , H01L21/6704 , H01L21/67051 , H01L21/67109 , H01L21/67253
Abstract: The present disclosure relates to a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of an adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to a substrate, a substrate heating unit configured to subsequently heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent in the processing liquid and is lower than the boiling point of the removing agent, and a rinsing liquid supplying unit configured to subsequently supply a rinsing liquid to the substrate so as to remove the adhered substance from the substrate.
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公开(公告)号：US20190279861A1
公开(公告)日：2019-09-12
申请号：US16420441
申请日：2019-05-23
Applicant: Tokyo Electron Limited
Inventor： Takayuki Toshima , Shoichi Terada , Junji Nakamura
IPC: H01L21/02 , H01L21/67 , B08B3/10 , H01L21/311 , B08B3/08
Abstract: The present disclosure relates to a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of an adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to a substrate, a substrate heating unit configured to subsequently heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent in the processing liquid and is lower than the boiling point of the removing agent, and a rinsing liquid supplying unit configured to subsequently supply a rinsing liquid to the substrate so as to remove the adhered substance from the substrate.
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公开(公告)号：US10591823B2
公开(公告)日：2020-03-17
申请号：US14974810
申请日：2015-12-18
Applicant: TOKYO ELECTRON LIMITED
Inventor： Keisuke Yoshida , Yuzo Ohishi , Keisuke Sasaki , Shoichi Terada
Abstract: A substrate processing apparatus includes a hot plate which supports and heats a substrate, a light source which emits etching energy beam such that the etching energy beam etches the substrate held by the hot plate, a window device which is positioned between the light source and the hot plate and transmits the etching energy beam emitted by the light source toward the substrate, and an adjusting device which adjusts emission amounts of the etching energy beam from portions of the window device toward the substrate such that the adjusting device reduces difference in etching amounts of portions of the substrate.
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公开(公告)号：US20140000517A1
公开(公告)日：2014-01-02
申请号：US13920219
申请日：2013-06-18
Applicant: Tokyo Electron Limited
Inventor： Takayuki Ishii , Takahiro Sakamoto , Takahiro Kitano , Shoichi Terada
IPC: B05C5/02
CPC classification number: B05C5/0258 , B05B1/044 , B05B12/081 , B05C5/0254 , H01L21/6715
Abstract: Disclosed is a coating apparatus capable of enhancing the film thickness uniformity. The coating apparatus includes a nozzle and a moving mechanism. The nozzle includes a storage chamber that stores a coating liquid and a slit-like flow path that is in communication with the storage chamber, and discharges the coating liquid through a discharge port formed at a front end of the flow path. The moving mechanism moves the nozzle and the substrate relatively to each other along a surface of the substrate. Also, in the flow path provided in the nozzle, flow resistance at the central portion in the longitudinal direction is larger than that at both end portions in the longitudinal direction.
Abstract translation: 公开了能够提高膜厚均匀性的涂布装置。 涂布装置包括喷嘴和移动机构。 喷嘴包括储存室，其存储与储存室连通的涂布液体和狭缝状流路，并且通过形成在流路前端的排出口排出涂布液。 移动机构沿着基板的表面使喷嘴和基板彼此相对移动。 此外，在设置在喷嘴中的流路中，长度方向中央部的流动阻力大于长度方向的两端部的流动阻力。
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